Part A
5CEFA5U19I7N
Intel
- Lifecycle
- Active
- Stock
- 1812 Stückzahl
- Package
- UBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA5U19I7N and 5CEFA2M13C6N are both Intel (Altera) Cyclone V FPGAs sharing the same device family, logic architecture, and 28 nm process, but they differ in logic density, package, and speed grade. The 5CEFA5U19I7N offers higher logic capacity in a UBGA-484 package with an industrial temperature grade, while the 5CEFA2M13C6N provides lower density in an MBGA-383 package with a commercial temperature grade. They are not pin-compatible drop-in replacements, but the 5CEFA2M13C6N can serve as a functional substitute where reduced logic resources, smaller footprint, and commercial temperature operation are acceptable.
Logic Density
Validation required
Package Type
Not compatible
Operating Temperature
Validation required
Device Family
High match
Parts at a glance
Part B
5CEFA2M13C6N
Intel
- Lifecycle
- Active
- Stock
- 4768 Stückzahl
- Package
- TFBGA-383
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA5U19I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 77,000 | 25,000 | LE count determines available logic capacity; a large mismatch prevents direct functional substitution. |
| Total RAM (M9K + MLAB) | 4,880 Kbit | 1,880 Kbit | On-chip memory limits buffering and data storage; insufficient RAM breaks memory-intensive designs. |
| 18x18 Multipliers | 150 | 72 | DSP block count governs arithmetic throughput for signal processing and math-heavy logic. |
| Package | UBGA-484 | MBGA-383 | Different packages have different footprints and pin counts, preventing drop-in board replacement. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments and industrial vs commercial applications. |
| Speed Grade | 7 (Fastest) | 6 (Fast) | Speed grade determines maximum clock frequency and timing closure margin for critical paths. |
| Maximum User I/O | 224 | 224 | I/O count must match peripheral requirements; identical counts ease interface planning. |
| Core Supply Voltage | 1.1 V | 1.1 V | Same core voltage simplifies power supply design and allows shared power rails. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA5U19I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 29080 | 9434 |
| Number of Logic Elements/Cells | 77000 | 25000 |
| Total RAM Bits | 5001216 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA5U19I7N and the 5CEFA2M13C6N?
The 5CEFA5U19I7N is a Cyclone V FPGA with 77,000 logic elements, 4,880 kbits of embedded memory, and 224 18x18 multipliers in a 484-pin UBGA package, rated for industrial temperature range (I7 speed grade). The 5CEFA2M13C6N is a Cyclone V FPGA with 25,000 logic elements, 1,400 kbits of embedded memory, and 72 18x18 multipliers in a 383-pin MBGA package, rated for commercial temperature range (C6 speed grade). They differ in logic density, memory, DSP resources, package, and temperature grade.
Are the 5CEFA5U19I7N and 5CEFA2M13C6N pin-to-pin compatible?
No. The 5CEFA5U19I7N uses a 484-pin UBGA package, while the 5CEFA2M13C6N uses a 383-pin MBGA package. The different package sizes, pin counts, and ball maps prevent direct pin-to-pin compatibility.
Can the 5CEFA2M13C6N be used as a direct drop-in replacement for the 5CEFA5U19I7N?
No. The two devices differ in package, logic capacity, memory, DSP resources, and temperature grade. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the logic design against the smaller device's resources.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA5U19I7N is specified for the industrial temperature range, typically -40°C to 100°C junction temperature, as indicated by the "I" in the part number. The 5CEFA2M13C6N is specified for the commercial temperature range, typically 0°C to 85°C junction temperature, as indicated by the "C" in the part number.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA5U19I7N and the 5CEFA2M13C6N are members of the Intel (formerly Altera) Cyclone V FPGA family, specifically the E variant with logic and transceiver capabilities. They share the same architecture and development tools but differ in density, package, and speed grade.
What logic element counts do these two devices offer?
The 5CEFA5U19I7N provides 77,000 logic elements. The 5CEFA2M13C6N provides 25,000 logic elements. This difference significantly affects the amount of user logic that can be implemented in each device.
Which device has more embedded memory and DSP resources?
The 5CEFA5U19I7N has more embedded memory (4,880 kbits vs. 1,400 kbits) and more 18x18 multipliers (224 vs. 72) than the 5CEFA2M13C6N. The larger device is better suited for memory-intensive and DSP-intensive applications.
Are the speed grades of these two devices the same?
No. The 5CEFA5U19I7N has an I7 speed grade, while the 5CEFA2M13C6N has a C6 speed grade. The speed grade affects timing performance, with different maximum operating frequencies and propagation delays. The I7 grade is typically faster than the C6 grade, but actual performance depends on the specific design and operating conditions.