Part A
5CEFA5U19I7N
Intel
- Lifecycle
- Active
- Stock
- 1812 Stückzahl
- Package
- UBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA5U19I7N and 5CEFA2M13I7N are not drop-in replacements for each other. They differ in logic density, package footprint, and available user I/O, so a direct board-level swap is not feasible without redesign. The 5CEFA5U19I7N offers higher logic capacity and more I/O in a UBGA-484 package, while the 5CEFA2M13I7N provides lower density in a smaller MBGA-383 package. Selection should be based on required logic resources, I/O count, and PCB footprint constraints.
Different logic density
Different package footprint
Different I/O count
Different pin count
Parts at a glance
Part B
5CEFA2M13I7N
Intel
- Lifecycle
- Active
- Stock
- 6649 Stückzahl
- Package
- TFBGA-383
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA5U19I7N | 5CEFA2M13I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 77,000 | 25,000 | Logic capacity determines the maximum complexity of digital designs the FPGA can implement; a large mismatch means the smaller device cannot host the same design. |
| Total Embedded RAM | 4,880 kbit | 1,944 kbit | On-chip memory limits buffering, FIFO depth, and data storage; designs needing more RAM cannot be ported to the smaller device. |
| Embedded 18x18 Multipliers | 150 | 75 | DSP blocks accelerate arithmetic; fewer multipliers restrict signal-processing throughput and parallelism. |
| Maximum User I/O | 224 | 175 | I/O count determines how many peripherals and interfaces can be connected; insufficient pins prevent a drop-in replacement. |
| Package | UBGA-484 | MBGA-383 | Package footprint and ballout must match the PCB; different packages are not physically interchangeable. |
| PLLs | 8 | 4 | PLLs generate and synchronize clocks; fewer PLLs limit clock domain flexibility. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow shared power rails. |
| Operating Temperature Range | -40°C to 100°C | -40°C to 100°C | Temperature grade must satisfy the application environment; matching ranges ensure equivalent thermal suitability. |
| Series / Family | Cyclone V E | Cyclone V E | Same family implies compatible architecture, toolchain, and IP support, easing migration between devices. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA5U19I7N | 5CEFA2M13I7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 29080 | 9434 |
| Number of Logic Elements/Cells | 77000 | 25000 |
| Total RAM Bits | 5001216 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA5U19I7N and the 5CEFA2M13I7N?
The 5CEFA5U19I7N is a Cyclone V FPGA with 77,000 logic elements (LEs) in a 484-pin UBGA package, while the 5CEFA2M13I7N is a Cyclone V FPGA with 25,000 LEs in a 383-pin MBGA package. The 5CEFA5U19I7N offers higher logic density and more user I/O, whereas the 5CEFA2M13I7N provides a smaller footprint and lower logic capacity.
Are the 5CEFA5U19I7N and 5CEFA2M13I7N pin-to-pin compatible?
No. The 5CEFA5U19I7N uses a 484-pin UBGA package, and the 5CEFA2M13I7N uses a 383-pin MBGA package. The different package sizes, pin counts, and ball maps prevent direct pin-to-pin compatibility.
Can the 5CEFA2M13I7N be used as a direct drop-in replacement for the 5CEFA5U19I7N?
No. The two devices differ in logic density, package type, pin count, and I/O resources. A direct drop-in replacement is not possible without redesigning the PCB and verifying all electrical and functional requirements against the respective datasheets.
Do both the 5CEFA5U19I7N and 5CEFA2M13I7N belong to the same FPGA family?
Yes. Both devices are part of the Intel (formerly Altera) Cyclone V FPGA family, specifically the E variant with integrated transceivers. They share the same architecture and process technology but differ in logic capacity and package options.
What is the operating temperature range for the 5CEFA5U19I7N and 5CEFA2M13I7N?
Both the 5CEFA5U19I7N and 5CEFA2M13I7N are specified for the industrial temperature range of -40°C to +100°C junction temperature (TJ), as indicated by the "I7" speed grade and industrial suffix in their part numbers.
Which device has more user I/O pins, the 5CEFA5U19I7N or the 5CEFA2M13I7N?
The 5CEFA5U19I7N provides more user I/O pins than the 5CEFA2M13I7N. The 5CEFA5U19I7N in the 484-pin UBGA package offers up to 224 user I/O pins, while the 5CEFA2M13I7N in the 383-pin MBGA package offers up to 112 user I/O pins, according to Intel Cyclone V device documentation.
Are the 5CEFA5U19I7N and 5CEFA2M13I7N RoHS compliant?
Yes. Both the 5CEFA5U19I7N and 5CEFA2M13I7N are RoHS-compliant lead-free packages, as stated in Intel's product material declarations and distributor datasheets.