Part A
5CEFA7F23I7N
Intel
- Lifecycle
- Active
- Stock
- 7313 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA7F23I7N and 5CEFA2M13C7N are not drop-in replacements for one another. Although both are Intel (Altera) Cyclone V FPGAs sharing the same device family and 28 nm process, they differ fundamentally in logic density, package footprint, speed grade, and operating temperature range. The 5CEFA7F23I7N offers significantly higher logic capacity in a larger FBGA package with an industrial temperature rating, while the 5CEFA2M13C7N provides lower density in a compact MBGA package with commercial temperature support. These differences in resource count, pinout, and thermal specification prevent direct substitution without a full board redesign and re-qualification.
Different logic density
Different package footprint
Different speed grade
Different temperature range
Parts at a glance
Part B
5CEFA2M13C7N
Intel
- Lifecycle
- Active
- Stock
- 3960 Stückzahl
- Package
- TFBGA-383
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F23I7N | 5CEFA2M13C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 150000 | 25000 | Logic element count determines the amount of digital logic that can be implemented, directly affecting design capacity and substitutability. |
| Total RAM Bits | 7880704 | 1953792 | Embedded memory capacity limits on-chip buffering and data storage, which is critical for memory-intensive applications. |
| Number of I/O | 480 | 240 | I/O count determines how many external signals the device can interface with, affecting board-level connectivity and pin compatibility. |
| Package / Case | FBGA-484 | MBGA-383 | Package type and footprint must match the PCB layout for physical substitutability; different packages are not drop-in compatible. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial-grade parts can replace commercial ones but not vice versa. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must be compatible with the board power design for correct operation. |
| Number of Logic Array Blocks (LABs) | 5640 | 943 | LAB count reflects the granularity of logic resources and influences placement and routing capacity for complex designs. |
| Embedded Multipliers (18x18) | 312 | 66 | Dedicated multipliers are essential for DSP and arithmetic-intensive functions; fewer multipliers limit computational throughput. |
| Maximum Operating Frequency | Not verified from public sources | Not verified from public sources | Maximum frequency determines timing closure for high-speed designs, but this parameter could not be verified from reliable public sources. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA2M13C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA7F23I7N and the 5CEFA2M13C7N?
The 5CEFA7F23I7N is a Cyclone V FPGA with 149,500 logic elements (LEs) in a 484-pin FBGA package, while the 5CEFA2M13C7N is a Cyclone V FPGA with 25,000 LEs in a 383-pin Micro FBGA package. They differ in logic density, package type, pin count, and speed grade (I7 vs C7).
Are the 5CEFA7F23I7N and 5CEFA2M13C7N pin-to-pin compatible?
No. The 5CEFA7F23I7N uses a 484-pin FBGA package, while the 5CEFA2M13C7N uses a 383-pin Micro FBGA package. The different package sizes, ball counts, and ball maps make them physically and electrically incompatible for direct PCB replacement.
What is the logic element count for each device?
The 5CEFA7F23I7N contains 149,500 logic elements (LEs). The 5CEFA2M13C7N contains 25,000 logic elements (LEs). These values are specified in the Intel Cyclone V device family datasheet.
What do the speed grade suffixes I7 and C7 indicate?
The suffix I7 indicates an industrial temperature grade device with speed grade 7. The suffix C7 indicates a commercial temperature grade device with speed grade 7. Industrial-grade devices are rated for a wider operating temperature range than commercial-grade devices.
Can the 5CEFA2M13C7N be used as a drop-in replacement for the 5CEFA7F23I7N?
No. The two devices differ in logic density, package footprint, pin count, and temperature grade. A drop-in replacement is not possible without redesigning the PCB and verifying all electrical, timing, and thermal requirements against the target application.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEFA7F23I7N and the 5CEFA2M13C7N are members of the Intel Cyclone V FPGA family, specifically the E variant (5CEFA). They share the same architecture and IP support but differ in density, package, and speed/temperature grade.
Which device is better suited for space-constrained designs?
The 5CEFA2M13C7N is better suited for space-constrained designs because it uses a 383-pin Micro FBGA package, which is smaller than the 484-pin FBGA package used by the 5CEFA7F23I7N. However, the smaller package also provides fewer I/O pins and lower logic capacity.