5CEFA7F23I7N vs 5CEFA2U19C6N

Dieser detaillierte Vergleich von 5CEFA7F23I7N und 5CEFA2U19C6N bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEFA7F23I7N and 5CEFA2U19C6N are not drop-in replacements for one another. They differ fundamentally in logic density, package footprint, and operating temperature grade, making them suitable for different design requirements rather than direct substitution.

Different logic density Different package footprint Different temperature grade Different I/O count

Parts at a glance

Part A

5CEFA7F23I7N

Intel

Lifecycle
Active
Stock
7313 Stückzahl
Package
FBGA-484
Series
Embedded feFPGAs (Field Programmable Gate Array)
Part B

5CEFA2U19C6N

Intel

Lifecycle
Active
Stock
9429 Stückzahl
Package
FBGA-484
Series
Embedded feFPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEFA7F23I7N 5CEFA2U19C6N Why it matters
Family / Series Cyclone V E Cyclone V E Same FPGA family ensures toolchain, IP, and pinout compatibility for migration.
Logic Elements (LE) 149,500 25,000 LE count determines available logic capacity; a large mismatch prevents direct functional substitution.
Total RAM Bits 7,880,448 1,536,000 Embedded memory capacity affects buffering, FIFOs, and data-path implementations.
Number of I/Os 480 224 I/O count limits peripheral and interface expansion; fewer pins restrict system connectivity.
Package / Case FBGA-484 UBGA-484 Package type and footprint must match for PCB layout compatibility.
Operating Temperature Range -40°C to +100°C (Industrial) 0°C to +85°C (Commercial) Temperature grade determines suitability for industrial versus commercial environments.
Speed Grade 7 (Fastest) 6 (Faster) Speed grade affects maximum operating frequency and timing closure margins.
Supply Voltage - Core 1.1 V 1.1 V Core voltage must match the board power design for correct operation.
Number of Transceivers 9 3 Transceiver count determines high-speed serial interface capability.
Embedded Multipliers (18x18) 312 72 DSP block count impacts arithmetic-intensive processing performance.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEFA7F23I7N 5CEFA2U19C6N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 56480 9434
Number of Logic Elements/Cells 149500 25000
Total RAM Bits 7880704 2002944
Number of I/O 240 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEFA7F23I7N and the 5CEFA2U19C6N?

The 5CEFA7F23I7N is a Cyclone V FPGA with 149,500 logic elements (LEs) in a 484-pin FBGA package, while the 5CEFA2U19C6N is a Cyclone V FPGA with 25,000 LEs in a 484-pin UBGA package. The 5CEFA7F23I7N offers significantly higher logic density, whereas the 5CEFA2U19C6N targets lower-cost, lower-power applications.

Are the 5CEFA7F23I7N and 5CEFA2U19C6N pin-to-pin compatible?

No. The 5CEFA7F23I7N uses a 484-pin FBGA package (F23), and the 5CEFA2U19C6N uses a 484-pin UBGA package (U19). Although both have 484 pins, the package types, ball maps, and PCB land patterns differ, so they are not drop-in replacements.

What are the operating temperature ranges for these two devices?

The 5CEFA7F23I7N has an industrial temperature grade (I7), typically specified for -40°C to 100°C junction temperature. The 5CEFA2U19C6N has a commercial temperature grade (C6), typically specified for 0°C to 85°C junction temperature. The industrial-grade part is suitable for harsher environments.

Can the 5CEFA2U19C6N be used as a substitute for the 5CEFA7F23I7N in an existing design?

No, not directly. The 5CEFA2U19C6N has only 25,000 LEs versus 149,500 LEs in the 5CEFA7F23I7N, and the package type and temperature grade differ. A redesign would be required to accommodate the lower logic density, different pinout, and commercial temperature range.

What are the typical power supply requirements for these Cyclone V FPGAs?

Both devices require a core voltage (VCC) of 1.1 V, auxiliary voltages, and I/O voltages that depend on the selected I/O standards. Exact supply rails and tolerances must be verified from the respective Intel Cyclone V device datasheets, as they vary by speed grade and configuration.

Which device is better suited for high-logic-density applications?

The 5CEFA7F23I7N is better suited for high-logic-density applications because it provides 149,500 LEs, significantly more than the 25,000 LEs of the 5CEFA2U19C6N. The 5CEFA7F23I7N also supports more embedded memory and DSP blocks, making it appropriate for complex processing tasks.

Do both devices support the same configuration and transceiver options?

No. The 5CEFA7F23I7N and 5CEFA2U19C6N belong to different Cyclone V variants with different transceiver counts, memory capacities, and configuration schemes. Designers must consult the specific device datasheets and pin-out files to confirm supported features for each part number.