Part A
5CEFA9F27I7N
Intel
- Lifecycle
- Active
- Stock
- 7586 Stückzahl
- Package
- BGA-672
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA4U19I7 are not functionally interchangeable. The 5CEFA9F27I7N offers substantially higher logic density, greater embedded memory, and more multiplier resources, while the 5CEFA4U19I7 provides a smaller, lower-cost alternative with reduced I/O and logic capacity. The differing package footprints and pin counts further prevent direct board-level substitution without redesign.
Different logic density
Different package footprint
Different I/O count
Different memory resources
Parts at a glance
Part B
5CEFA4U19I7
Intel
- Lifecycle
- Active
- Stock
- 4673 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA4U19I7 | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 49000 | Logic element count determines the maximum complexity of digital logic that can be implemented, directly affecting functional substitutability. |
| Total RAM Bits | 14251008 | 3080192 | Embedded memory capacity limits the size of buffers, FIFOs, and data storage that can be implemented on-chip. |
| Number of I/O | 336 | 224 | Available I/O pins determine how many external signals and peripherals the device can interface with. |
| Package / Case | 672-BBGA, FCBGA | 484-UBGA, FCBGA | Package type and footprint must match the PCB layout for the device to be physically interchangeable. |
| Number of LABs/CLBs | 113560 | 18480 | Logic array blocks define the granularity of programmable logic resources available for design implementation. |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | Temperature range affects reliability and suitability for industrial versus commercial environments. |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V | Core supply voltage must be compatible with the board power design for correct operation. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style determines the assembly process and board compatibility. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA4U19I7 |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 18480 |
| Number of Logic Elements/Cells | 301000 | 49000 |
| Total RAM Bits | 14251008 | 3464192 |
| Number of I/O | 336 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA4U19I7?
The 5CEFA9F27I7N is a larger Cyclone V FPGA in the F27 package with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers. The 5CEFA4U19I7 is a smaller Cyclone V FPGA in the U19 package with 49,000 logic elements, 3,080 Kbits of embedded memory, and 144 18x18 multipliers. Both are speed grade 7 industrial-temperature devices, but they differ significantly in logic density, memory, DSP resources, and package footprint.
Are the 5CEFA9F27I7N and 5CEFA4U19I7 pin-compatible?
No. The 5CEFA9F27I7N uses the F27 package, while the 5CEFA4U19I7 uses the U19 package. These are different package types with different pin counts, ball maps, and PCB land patterns, so they are not pin-compatible or drop-in replacements.
Can the 5CEFA4U19I7 be used as a direct substitute for the 5CEFA9F27I7N?
No. The 5CEFA4U19I7 has substantially fewer logic elements, embedded memory, and DSP blocks than the 5CEFA9F27I7N, and it uses a different package. A direct substitution would require a full design review, resource re-evaluation, and PCB redesign, and would only be possible if the target design fits within the smaller device's resources.
Do both devices belong to the same FPGA family and speed grade?
Yes. Both the 5CEFA9F27I7N and 5CEFA4U19I7 are Intel (formerly Altera) Cyclone V FPGAs with speed grade 7 and industrial temperature range designation. They share the same family architecture and supported IP ecosystem, but differ in density, package, and available resources.
Which device offers more embedded memory and DSP resources?
The 5CEFA9F27I7N offers significantly more embedded memory and DSP resources than the 5CEFA4U19I7. The 5CEFA9F27I7N provides 13,917 Kbits of embedded memory and 480 18x18 multipliers, while the 5CEFA4U19I7 provides 3,080 Kbits of embedded memory and 144 18x18 multipliers.
Are both devices available in industrial temperature grade?
Yes. Both the 5CEFA9F27I7N and 5CEFA4U19I7 carry the "I7" suffix, which indicates industrial temperature range and speed grade 7 in the Intel Cyclone V ordering code. This makes both suitable for industrial-temperature applications within their respective resource and package constraints.
What should be verified before migrating a design from the 5CEFA9F27I7N to the 5CEFA4U19I7?
Before migrating, verify that the target design fits within the 5CEFA4U19I7's 49,000 logic elements, 3,080 Kbits of embedded memory, and 144 18x18 multipliers. Also confirm I/O count, transceiver requirements, PLL availability, package footprint, power delivery, and configuration scheme against the respective Intel Cyclone V device datasheets and pin-out files.