10AS032E3F29I2SG

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10AS032E3F29I2SG

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IC SOC CORTEX-A9 1.5GHZ 780FBGA

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Attribut Wert
Series Arria 10 SX
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 320K Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA, FC (29x29)

Übersicht

Description

The code "10AS032E3F29I2SG" appears to be alphanumeric and could represent various things depending on the context, such as a product identifier, a course code, or a reference number in a specific system. Without additional context, it’s challenging to provide a precise introduction.
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To gain a clearer understanding, please provide more context surrounding the usage of "10AS032E3F29I2SG." This will enable a more tailored explanation and relevance to your needs.

Equivalent

The 10AS032E3F29I2SG chip is an Intel FPGA from the Arria 10 family. Equivalent products include the Xilinx Zynq UltraScale+ series and Lattice Semiconductor's ECP5 FPGAs. Additionally, Altera Cyclone V or Cyclone 10 FPGAs can serve as alternatives, depending on specific requirements like logic density and performance. Always verify compatibility based on your application needs.

Features

The 10AS032E3F29I2SG is a system-on-chip (SoC) FPGA (Field-Programmable Gate Array) from Intel's Arria 10 family. Key features include:
1. Density: 32,000 logic elements (LEs) provide substantial design capacity.
2. Performance: Supports high-speed interfaces and operates at up to 1.5 GHz clock speeds for demanding applications.
3. Embedded Memory: Contains up to 1.5 Mbits of embedded memory, enabling efficient data handling and storage.
4. DSP Blocks: Integrates dedicated DSP (Digital Signal Processing) blocks for high-performance arithmetic operations, ideal for signal processing tasks.
5. Transceivers: Includes multiple high-speed transceivers supporting protocols such as PCIe, SGMII, and others for flexible connectivity options.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
7. Configuration: Supports various configuration modes, including JTAG, for flexible deployment and programming.
This FPGA is well-suited for applications in communications, automotive, industrial automation, and aerospace sectors.

Pinout

The 10AS032E3F29I2SG is an Intel (formerly Altera) Arria 10 SoC FPGA. It features a total of 29 user I/O pins. The device is designed for various applications, including digital signal processing, image processing, and high-performance computing.
The FPGA provides configurable functionality where the pins can be used for different purposes based on the design requirements, such as general-purpose I/O, configuration, or dedicated functions like clock inputs/outputs and other interfaces. The FPGA is also capable of interfacing with various protocols, making it versatile for integration into complex systems.
For detailed specifications, including exact pin assignments and functions, refer to the relevant datasheet or user guide provided by Intel.

Manufacturer

The manufacturer of the 10AS032E3F29I2SG is Intel Corporation. Intel is a multinational technology company headquartered in Santa Clara, California, known for designing and manufacturing advanced integrated digital technology solutions. It is one of the world's largest and highest-valued semiconductor chip makers, primarily recognized for its microprocessors, motherboard chipsets, and other computing components used in personal computers, servers, and various electronics.
Intel plays a crucial role in the development of computing technology and is a leader in innovation, producing products that power a wide range of devices from PCs to data centers. The 10AS032E3F29I2SG is part of Intel’s Arria 10 FPGA (Field Programmable Gate Array) family, which is used for various applications, including telecommunications, automotive, industrial, and data processing.
In summary, Intel Corporation is a pivotal player in the technology sector, focusing on semiconductors and digital solutions.

Application

The 10AS032E3F29I2SG is a high-density FPGAs (Field-Programmable Gate Arrays) from Intel, designed for various application areas, including:
1. Data Center: Accelerating workloads in cloud computing and storage.
2. Networking: Enhancing performance in packet processing and network functions virtualization.
3. Automotive: Supporting advanced driver-assistance systems (ADAS) and automotive communications.
4. Industrial Automation: Enabling real-time processing in manufacturing and robotics.
5. Medical Devices: Assisting in imaging and diagnostic equipment.
6. Aerospace & Defense: Providing reliable solutions for communication and radar systems.
These applications leverage the FPGA's flexibility, high performance, and low power consumption.

Package

The package type of the 10AS032E3F29I2SG is a F757 device package, which is a 29mm x 29mm, 676-ball Fine Pitch Ball Grid Array (FBGA).

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