1SX110HN2F43E2VG

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1SX110HN2F43E2VG

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IC FPGA STRATIX 10 1760FBGA

  • HerstellerAltera

  • Herstellerteil #1SX110HN2F43E2VG

  • Auf Lager8969

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Spezifikationen

Attribut Wert
Series Stratix® 10 SX
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.5GHz
Primary Attributes FPGA - 1100K Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FBGA (42.5x42.5)

Übersicht

Description

The 1SX110HN2F43E2VG is a model of FPGA (Field-Programmable Gate Array) from Intel's Stratix 10 family. Designed for high-performance computing applications, it features advanced processing capabilities, high-speed I/O, and a flexible architecture that allows for a variety of configurations and customizations. The Stratix 10 series utilizes Intel's 14nm Tri-Gate process technology, which enhances power efficiency and performance.
Key features of the 1SX110HN2F43E2VG include:
- Logic Elements: A large number of logic elements for complex designs.
- Memory: Integrated high-bandwidth memory blocks for data storage needs.
- DSP Blocks: Dedicated digital signal processing blocks for efficient mathematical operations.
- Interconnects: High-speed transceivers for fast communication between devices.
- Dynamic Reconfiguration: Allows for on-the-fly changes to the FPGA's configuration without downtime.
This FPGA is well-suited for applications in telecommunications, data centers, and industrial automation, where flexibility and performance are critical.

Equivalent

The 1SX110HN2F43E2VG chip is part of the Intel Stratix 10 family. Equivalent products include the Intel Stratix 10 GX 1100, Stratix 10 MX 1100, and similar devices in the Stratix 10 series. For specific compatibility, check the datasheets and technical specifications, as variations may exist in features and performance.

Features

The 1SX110HN2F43E2VG is a System-on-Chip (SoC) device from Intel's Stratix 10 series, designed for high-performance applications. Key features include:
1. FPGA Architecture: Utilizes a 14nm process technology with a high-density logic fabric, allowing for extensive customization and flexibility.
2. Performance: Offers up to 110K logic elements, supporting complex algorithms and high-throughput processing.
3. Enhanced DSP Blocks: Equipped with multiple Digital Signal Processing (DSP) blocks, ideal for applications in signal processing and digital communications.
4. Memory Interfaces: Supports high-speed memory interfaces, including DDR4 and HBM (High Bandwidth Memory), enabling efficient data handling.
5. Transceivers: Features high-speed transceivers for communication, supporting protocols like PCIe and Ethernet.
6. Power Management: Advanced power management features ensure optimized power consumption.
7. Integration: Supports various interfaces and protocols, making it suitable for diverse applications in telecommunications, data centers, and automotive industries.
Overall, the 1SX110HN2F43E2VG is designed for demanding applications requiring high performance and flexibility.

Pinout

The Intel Stratix 10 FPGA model 1SX110HN2F43E2VG has a pin count of 1,144 pins. This FPGA is part of the Stratix 10 family, which features advanced processing capabilities, high performance, and low power consumption, making it suitable for various applications in telecommunications, data centers, and high-performance computing.
The pins on this FPGA serve multiple functions, including power supply, ground, configuration, and I/O interfaces for communication with other devices. The I/O pins can be configured for various protocols such as LVDS, PCIe, and various memory interfaces. Additionally, the FPGA contains dedicated pins for JTAG programming and debugging, clock inputs, and other specialized functions.
For detailed pin assignments and functions, referring to the specific datasheet or user manual from Intel is recommended, as it provides comprehensive pinout information and configuration options.

Manufacturer

The manufacturer of the 1SX110HN2F43E2VG is Intel Corporation. Intel is a leading multinational technology company headquartered in Santa Clara, California. It is primarily known for designing and manufacturing semiconductor products, including microprocessors, system-on-chip units, and various integrated circuits. Intel is a key player in the computer hardware industry, providing components that power personal computers, servers, and various electronic devices. The company also engages in research and development in areas such as artificial intelligence, autonomous driving, and Internet of Things (IoT) technologies. Founded in 1968, Intel has been instrumental in the advancement of computing technology and continues to innovate with new products and solutions.

Application

The 1SX110HN2F43E2VG is a versatile FPGA (Field-Programmable Gate Array) used in various application areas, including telecommunications, data processing, industrial automation, and automotive systems. Its high-performance capabilities make it suitable for real-time data processing, signal processing, and complex algorithm implementation. Additionally, it is employed in embedded systems for custom hardware acceleration, prototyping, and development of innovative solutions in IoT, machine learning, and edge computing. Its adaptability allows designers to optimize hardware for specific tasks, enhancing system efficiency and performance across multiple industries.

Package

The package type of the 1SX110HN2F43E2VG is a FFG (Fine Pitch Flip Chip) package. It is designed for high-density applications and is commonly used in advanced semiconductor devices, providing efficient thermal and electrical performance.

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