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10M08SAM153C8G
+StücklisteIC FPGA 112 I/O 153MBGA
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HerstellerIntel
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Herstellerteil #10M08SAM153C8G
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Paket 153-VFBGA
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Auf Lager6980
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 500 |
| NumberofLogicElements/Cells | 8000 |
| TotalRAMBits | 387072 |
| NumberofI/O | 112 |
| Voltage-Supply | 2.85V ~ 3.465V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 153-VFBGA |
Übersicht
Description
The 10M08SAM153C8G features a compact design with a small footprint, encapsulated in a 153-ball BGA (Ball Grid Array) package. It supports various I/O standards and offers flexible I/O configurations, making it adaptable to different system requirements. The FPGA architecture provides a balance between performance and power efficiency, allowing for faster data processing while minimizing energy use.
Its user-configurable architecture allows developers to customize the FPGA to specific application needs, and it is supported by Intel's Quartus Prime design software. This FPGA is part of a series that provides an economical solution for applications requiring moderate processing power and flexibility without incurring high costs.
Equivalent
Features
1. Logic Elements: It has 8,000 logic elements, providing a configurable logic array for implementing custom logic functions.
2. Embedded Memory: Includes embedded memory blocks, offering a total of 387 kilobits of RAM.
3. User I/O Pins: Offers 101 general-purpose input/output (GPIO) pins for interfacing with other devices.
4. Built-in ADC: Features dual onboard analog-to-digital converters (ADCs) for mixed-signal applications.
5. Non-volatile Configuration Memory: Stores configuration data internally, allowing for instant-on functionality without needing an external configuration device.
6. Operating Voltage: Supports core voltage levels of 3.3V, and I/O levels from 1.2V to 3.3V.
7. Package: Available in a 153-pin Micro FineLine BGA package, suitable for space-constrained applications.
8. Power Management: Features advanced power management modes to reduce power consumption when the FPGA is idle.
9. Temperature Range: Supports a commercial temperature range of 0°C to 85°C.
These features make it suitable for consumer, industrial, and automotive applications requiring a balance of performance and power efficiency.
Pinout
Key functions and features of the 10M08SAM153C8G include:
1. Logic Elements (LEs): It contains around 8,000 logic elements, which are used for implementing digital circuits.
2. Embedded Memory: It includes embedded memory blocks for storing data or configuration information.
3. I/O Pins: The device supports a variety of I/O standards and offers flexible I/O pin configurations.
4. Analog Features: Integrated ADCs allow for mixed-signal processing capabilities.
5. Dual-Configuration Flash: Enables configuration swapping for redundancy or upgrades.
6. Power Management: Advanced power management features for efficient operation.
This FPGA is suitable for applications in various fields, including industrial, automotive, and consumer electronics, providing a balance of cost, performance, and flexibility.
Manufacturer
Application
1. Industrial Automation: Used in control systems and monitoring equipment.
2. Consumer Electronics: Supports functions in smart devices and home appliances.
3. Communications: Utilized in network infrastructure and signal processing.
4. Automotive: Assists in advanced driver-assistance systems (ADAS) and infotainment.
5. Medical Devices: Implements processing and control in diagnostic equipment.
6. IoT Devices: Facilitates connectivity and data processing.
These FPGAs offer embedded flash memory, efficient power management, and flexible I/O, making them suitable for diverse applications.