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IC FPGA 130 I/O 169UBGA
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HerstellerIntel
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Herstellerteil #10M08SAU169I7G
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Paket LFBGA-169
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Auf Lager1501
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 500 |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 387072 |
| Number of I/O | 130 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the 10M08SAU169I7G include:
1. Logic Elements: It contains 8,000 logic elements, allowing for complex digital circuit designs.
2. Embedded Memory: Provides embedded memory blocks for on-chip data storage.
3. Integrated ADC: Includes an integrated analog-to-digital converter for mixed-signal applications.
4. Package Type: The U169 indicates a 169-pin package, which is a small form factor suitable for space-constrained applications.
5. Temperature Range: The "I7" suggests that it operates over an industrial temperature range, making it robust for challenging environments.
The Intel MAX 10 series supports non-volatile configuration memory, enabling instant-on functionality. It is often used in applications requiring flexibility and reconfigurability, like prototyping, IoT devices, and hardware acceleration.
Equivalent
Features
1. FPGA Fabric: 8,000 logic elements (LEs) offering flexibility for various digital designs.
2. Integrated Flash: On-chip flash memory for configuration and non-volatile storage, enabling instant-on functionality.
3. Embedded Memory: Includes 387 Kbits of embedded memory for data processing and storage.
4. DSP Blocks: Built-in DSP blocks for efficient implementation of signal processing applications.
5. Clock Management: Features PLLs for advanced clock management and reduced jitter.
6. I/O Options: Provides multi-voltage I/O support, including LVTTL, LVCMOS, and differential signaling standards.
7. Package: Available in a 169-pin UFBGA package, which aids in compact designs.
8. Temperature Range: Designed for industrial temperature ranges, suitable for harsh environments.
9. Low Power Usage: Optimized for low power consumption, enhancing energy efficiency.
10. Development Tools: Supported by Intel’s Quartus Prime software for design and implementation.
This combination of features makes the 10M08SAU169I7G suitable for a wide range of applications, including industrial automation, communications, and consumer electronics.
Pinout
The functions of the pins in the 10M08SAU169I7G include:
1. General Purpose I/O (GPIO): Used for interfacing with other devices, sensors, and components.
2. Power and Ground Pins: Supply necessary power to the FPGA and ground connections.
3. JTAG Interface Pins: Used for programming and debugging the device.
4. Clock Input Pins: Accept external clock signals for synchronous operations.
5. Configuration and Initialization Pins: Manage the configuration process and control the initial state of the FPGA.
6. Dedicated and Optional PLL Pins: Used for clock management and generating various clock frequencies.
This concise overview provides a fundamental understanding of the pin count and functions of the 10M08SAU169I7G FPGA device. For detailed pin assignments and electrical specifications, referring to the official datasheet is recommended.
Manufacturer
Intel's operations are diverse, covering everything from data center solutions and artificial intelligence to the Internet of Things (IoT) and embedded systems. The company invests heavily in research and development to drive innovation in technology and maintain its leadership position in the market. Its products are widely used in personal computers, servers, and a broad array of electronic devices, underscoring its role as a cornerstone of the modern digital world.
Application
1. Industrial Automation: Used in control systems, sensing, and data acquisition.
2. Consumer Electronics: Supports smart devices and home automation.
3. Automotive Systems: Assists in driver assistance and infotainment systems.
4. Communications: Applied in networking equipment for data processing.
5. Medical Devices: Utilized in portable medical instruments and diagnostics.
6. Aerospace and Defense: Supports avionics and defense communication systems.
These applications benefit from its low power consumption, built-in flash, and processing capabilities.