10M16DAF256I7G

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10M16DAF256I7G

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IC FPGA 178 I/O 256FBGA

  • HerstellerIntel

  • Herstellerteil #10M16DAF256I7G

  • Paket BGA-256

  • Auf Lager6815

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Attribut Wert
Package Tray
Series MAX® 10
ProductStatus Active
NumberofLABs/CLBs 1000
NumberofLogicElements/Cells 16000
TotalRAMBits 562176
NumberofI/O 178
Voltage-Supply 1.15V ~ 1.25V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Übersicht

Description

The 10M16DAF256I7G is a part of the Intel MAX 10 family of Field-Programmable Gate Arrays (FPGAs). These devices are designed for low-cost, high-volume applications, providing advanced processing capabilities while maintaining low power consumption. The "10M16" indicates that this model features approximately 16,000 Logic Elements (LEs). The "DAF256" specifies the package type and pin count, which in this case is a 256-pin FineLine BGA (Ball Grid Array).
Key features of the 10M16DAF256I7G include embedded flash memory for configuration and user data storage, analog-to-digital converters (ADCs), and a variety of general-purpose input/output (GPIO) options. This FPGA supports diverse functions such as digital signal processing, control logic, and interface bridging. Its integration of flash memory enables single-chip solutions and simplifies board design, reducing the overall system cost. This model is suitable for industrial, automotive, and consumer applications that require efficient processing power within a compact footprint.

Equivalent

The 10M16DAF256I7G is part of Intel's Cyclone 10 series of FPGAs. Equivalent alternatives might include FPGAs with similar capabilities from other manufacturers like Xilinx's Artix-7 series or Lattice Semiconductor's ECP5 series, depending on your specific requirements for logic elements, I/O pins, and power consumption. Always ensure compatibility with your design's specific needs and constraints when considering alternatives.

Features

The 10M16DAF256I7G is a part of Intel’s MAX 10 FPGA series, designed for cost-sensitive applications requiring performance and integration. Key features include:
1. Logic Elements: It offers around 16,000 logic elements, facilitating complex logic functions.

2. Memory: Includes embedded memory blocks for efficient data processing and storage.
3. DSP Blocks: Equipped with DSP (Digital Signal Processing) blocks for fast arithmetic operations, beneficial in signal processing applications.
4. I/O Options: Provides a range of I/O options, supporting various interfaces and standards for connectivity.
5. Non-Volatile Configuration: Features an on-chip flash memory for configuration, allowing instant-on functionality without the need for external configuration memory.
6. Embedded Processor Support: Supports soft processor IPs, enabling integration of custom processing cores.
7. Low Power: Designed for low power consumption, ideal for applications where energy efficiency is critical.
8. Temperature Range: Operates in industrial temperature ranges, suitable for harsh environments.
9. Package: Available in a 256-pin FBGA package, balancing size and pin count for diverse applications.
These features make the 10M16DAF256I7G suitable for applications like industrial automation, consumer electronics, and communications.

Pinout

The 10M16DAF256I7G is an FPGA device from the Intel MAX 10 family. It comes in a 256-pin FineLine BGA package. This device is used in applications that require non-volatile, instant-on functionality, integrating a flash-based FPGA fabric.
Key functions and features include:
1. Logic Elements: It contains 16,000 logic elements, providing substantial processing capability.
2. Memory: Includes embedded memory blocks for efficient data storage and retrieval.
3. DSP Blocks: Equipped with DSP blocks for signal processing applications.
4. Non-Volatile Storage: Features on-chip flash for configuration memory, allowing instant-on capability.
5. I/O Pins: Provides multiple I/O pins for versatile interfacing options.
6. Analog Features: Includes analog-to-digital converters (ADCs) for mixed-signal applications.
7. Integrated Phase-Locked Loops (PLLs): For clock management and signal synchronization.
This device is suitable for a wide range of applications, including communications, industrial, and automotive systems, due to its integration of logic, memory, and analog components.

Manufacturer

The 10M16DAF256I7G is a part of the Intel MAX 10 FPGA series, and it is manufactured by Intel Corporation. Intel is a multinational corporation and technology company headquartered in Santa Clara, California. Founded in 1968, Intel is renowned for designing and manufacturing semiconductor products, including processors, integrated circuits, and memory devices. The MAX 10 FPGA series, which includes the 10M16DAF256I7G, is used in a variety of applications requiring programmable logic devices, offering features like integrated flash and analog-to-digital converters. As a leading player in the technology industry, Intel serves various markets, including computing, data centers, Internet of Things (IoT), and communication sectors, positioning itself as a key innovator and supplier in the semiconductor field.

Application

The 10M16DAF256I7G is a part of Intel's MAX 10 FPGA series and is widely used in various application areas. Key application areas include:
1. Industrial Automation: For control systems, sensor data processing, and interface bridging.
2. Consumer Electronics: Used in devices requiring customizable logic.
3. Communications: Employed in protocol bridging, data buffering, and custom interface solutions.
4. Automotive: Used for infotainment systems, advanced driver-assistance systems (ADAS), and vehicle networking.
5. Medical Devices: Provides flexibility in imaging systems and portable medical equipment.
6. Aerospace and Defense: Suitable for signal processing, avionics, and secure communications.
Its low power consumption, integrated flash, and cost-effectiveness make it versatile for these applications.

Package

The package type for the 10M16DAF256I7G is a 256-pin Fine-Line Ball Grid Array (FBGA).

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