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10M16DCF484C8G
+StücklisteIC FPGA 320 I/O 484FBGA
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HerstellerIntel
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Herstellerteil #10M16DCF484C8G
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Paket BGA-484
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Auf Lager6504
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 1000 |
| Number of Logic Elements/Cells | 16000 |
| Total RAM Bits | 562176 |
| Number of I/O | 320 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
- 16,000 logic elements (LEs)
- 484-pin FineLine BGA package (FBGA)
- Commercial-grade temperature range (0°C to 85°C)
- On-chip flash memory for configuration storage
- Dual-configuration support for fail-safe updates
- Low-power operation with integrated analog features (ADC, PLLs)
Designed for cost-sensitive, low-power applications like industrial control, IoT, and embedded systems, it combines FPGA flexibility with non-volatile configuration. The C8G suffix indicates a 484-pin package with lead-free (RoHS-compliant) construction.
Key strengths include instant-on capability, small form factor, and integration of analog and digital functions. Suitable for prototyping and production where reliability and power efficiency are critical.
For detailed specs, refer to Intel’s MAX 10 FPGA Device Overview datasheet.
Equivalent
- Lattice LCMXO2-1200HC-6MG132C (MachXO2 series)
- Xilinx XC6SLX16-2FTG256C (Spartan-6 series)
- Microsemi (Microchip) IGLOO2 M2GL010-FGG484
These alternatives offer similar logic density (~10K–16K LEs) and package compatibility (484-pin BGA). Check power, I/O, and feature requirements for exact suitability.
Features
- Logic Elements: 16,000
- Memory: 504 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- I/O Pins: 223 user I/Os (supports LVDS, LVCMOS)
- Flash Memory: Integrated configuration flash (no external memory needed)
- ADC: Dual 12-bit, 1 MSPS analog-to-digital converter
- Clock Management: Up to 4 PLLs
- Package: 484-pin FineLine BGA (FBGA)
- Operating Voltage: Core (1.2V), I/O (1.2V–3.3V)
- Temperature Grade: Commercial (0°C to +85°C)
Ideal for low-power, cost-sensitive applications like industrial control, automotive, and consumer electronics.
Pinout
- Pin Count: 484 pins (484-ball FineLine BGA package).
- Function: A low-cost, non-volatile FPGA with embedded flash, supporting general-purpose logic, DSP, and memory integration.
- Key Features:
- 16,000 logic elements (LEs).
- 504 Kbits embedded memory.
- 56 18x18 multipliers.
- On-chip ADC, PLLs, and user flash.
- Supports various I/O standards (LVCMOS, LVDS, etc.).
Commonly used in industrial, automotive, and consumer applications.