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AS4C64M16D3B-12BCN
+StücklisteIC DRAM 1GBIT PARALLEL 96FBGA
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HerstellerAlliance Memory, Inc.
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Herstellerteil #AS4C64M16D3B-12BCN
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Paket FBGA-96
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Auf Lager7644
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Spezifikationen
| Attribut | Wert |
| Package | Tray |
| ProductStatus | Active |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR3 |
| MemorySize | 1Gb (64M x 16) |
| MemoryInterface | Parallel |
| ClockFrequency | 800 MHz |
| WriteCycleTime-WordPage | 15ns |
| AccessTime | 20 ns |
| Voltage-Supply | 1.425V ~ 1.575V |
| OperatingTemperature | 0°C ~ 95°C (TC) |
| MountingType | Surface Mount |
| Package/Case | 96-TFBGA |
Übersicht
Description
This memory chip supports programmable read or write burst lengths of 4 or 8, along with an auto precharge option. It possesses an 8n-prefetch architecture, which helps optimize the memory bandwidth. The AS4C64M16D3B-12BCN includes features such as on-die termination (ODT) and self-refresh, contributing to reduced power consumption and enhanced signal integrity.
The device is housed in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, which ensures compactness and reliability in various environmental conditions. It is often used in applications requiring reliable performance and low power consumption.
Equivalent
Features
1. Density and Organization: 1Gb density organized as 64M x 16 bits.
2. Clock Speed: Supports a maximum clock rate of 800 MHz, providing a data rate of up to 1600 MT/s (megatransfers per second).
3. Power Supply: Operates at a nominal voltage of 1.5V with support for low voltage variants for power efficiency.
4. Data Width: 16-bit data width, suitable for high-performance applications.
5. Package: Available in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package for compact design integration.
6. Temperature Range: Supports commercial and industrial temperature ranges, ensuring reliability in various environments.
7. Burst Length: Configurable burst lengths of 8 and 4 with an internal pre-fetch architecture.
8. Low Power Features: Includes self-refresh modes and power-down options to conserve energy.
9. Compatibility: Compliant with the JEDEC DDR3 standard for broad compatibility with DDR3 interfaces.
These features make the AS4C64M16D3B-12BCN suitable for applications requiring fast and efficient memory solutions, such as consumer electronics, networking, and computing devices.
Pinout
Key features include:
- High data transfer rates, typically up to 1600 Mbps (megabits per second)
- Power supply voltage of 1.5V
- Supports features such as on-die termination (ODT), self-refresh, and auto-precharge
- Commonly used for applications requiring fast and efficient memory access
The pin count for the AS4C64M16D3B-12BCN, given its 78-ball FBGA package, is 78 pins/balls. These pins are used for various functions such as data input/output, power supply, ground connection, clock signals, and control signals necessary for the DDR3 SDRAM operation.