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EP2AGX45DF25C4N
+StücklisteIC FPGA 252 I/O 572FBGA
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HerstellerIntel
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Herstellerteil #EP2AGX45DF25C4N
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Paket FBGA-572
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Auf Lager2364
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Arria II GX |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 1805 |
| NumberofLogicElements/Cells | 42959 |
| TotalRAMBits | 3517440 |
| NumberofI/O | 252 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 572-BGA, FCBGA |
Übersicht
Description
Key specifications include a density of approximately 45K logic elements, a 2.5V core voltage, and advanced I/O options that support high-speed serial communications. The FPGA also offers embedded multipliers and DSP blocks for efficient signal processing tasks, making it an excellent choice for complex algorithms and data processing operations.
Arria II GX FPGAs are known for their low power consumption and cost-effectiveness, providing designers with a balance of performance and efficiency. The device is housed in a 672-pin FBGA package, facilitating integration into compact and space-constrained designs. Overall, the EP2AGX45DF25C4N is ideal for developers seeking a versatile and robust solution for demanding FPGA applications.
Equivalent
Features
1. Logic Elements: It comprises approximately 45,000 logic elements, suitable for complex digital circuits.
2. Transceivers: Integrates high-speed serial transceivers, supporting data rates up to 6.375 Gbps, making it ideal for high-bandwidth applications.
3. Memory: Features up to 2.5 Mbits of embedded memory, including RAM blocks for efficient data handling.
4. DSP Blocks: Includes 80 multipliers for digital signal processing tasks, enhancing performance in computational applications.
5. I/O Pins: Offers numerous general-purpose I/O pins, which support various I/O standards for flexible interfacing.
6. Power Efficiency: Designed for low power consumption, optimizing performance-per-watt metrics.
7. Package and Temperature: Comes in a 484-pin FBGA package and supports an industrial temperature range of -40°C to 100°C.
These features make the EP2AGX45DF25C4N suitable for applications in telecommunications, video processing, and other high-performance computing areas.
Pinout
Key functions of the EP2AGX45DF25C4N include:
1. Logic Elements: It has a large number of logic elements that enable the implementation of complex digital circuits.
2. High-Speed Transceivers: Suitable for high-speed data transfer applications.
3. Memory Blocks: Includes embedded memory blocks for data storage and processing.
4. DSP Blocks: Dedicated digital signal processing blocks to enhance the performance of DSP applications.
5. I/O Options: Supports various I/O standards and has programmable I/O pins for flexible interfacing.
6. Clock Management: Provides advanced clock management features to ensure accurate timing and synchronization.
This FPGA is ideal for applications requiring high-speed data processing, digital signal processing, and efficient power management.
Manufacturer
Application
1. High-Speed Networking: Supports protocols such as Ethernet, PCI Express, and Serial RapidIO.
2. Telecommunications: Used in base stations and optical transport networks for fast data processing.
3. Broadcast and Pro Audio/Video: Offers high bandwidth for video processing and transmission.
4. Military and Aerospace: Ideal for radar and secure communication systems due to its high reliability and performance.
5. Data Centers: Utilized in server acceleration and storage solutions.
Its programmable logic and I/O features make it versatile for custom applications requiring flexibility and high-speed data handling.