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EP2SGX60EF1152I4N
+StücklisteIC FPGA 534 I/O 1152FBGA
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HerstellerIntel
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Herstellerteil #EP2SGX60EF1152I4N
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Paket FBGA-1152
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Auf Lager2469
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Stratix® II GX |
| Part Status | Obsolete |
| Number of LABs/CLBs | 3022 |
| Number of Logic Elements/Cells | 60440 |
| Total RAM Bits | 2544192 |
| Number of I/O | 534 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. High Logic Density: Offers a significant number of logic elements for complex computations.
2. Transceivers: Integrated high-speed transceivers capable of supporting data rates suitable for applications like networking and telecommunications.
3. Memory Blocks: Includes embedded memory blocks for efficient on-chip data storage and manipulation.
4. DSP Blocks: Contains Digital Signal Processing blocks for high-speed arithmetic operations, beneficial in signal processing tasks.
5. I/O Flexibility: Supports multiple I/O standards and protocols, enhancing its versatility in diverse applications.
The device is typically used in industries requiring robust, high-speed data handling capabilities, such as telecommunications, data centers, and broadcast equipment. The EP2SGX60EF1152I4N combines high performance with programmable flexibility, making it ideal for demanding digital applications.
Equivalent
Features
1. Logic Elements: Contains 60,000 logic elements for complex designs.
2. Transceivers: Up to 20 high-speed transceivers, supporting data rates up to 6.375 Gbps.
3. I/O Pins: Offers 828 user I/O pins for versatile interfacing.
4. Memory: Integrated with 2.5 Mbits of embedded memory for efficient data storage and processing.
5. DSP Blocks: Includes dedicated DSP blocks for signal processing tasks.
6. Power: Designed with low-power consumption in mind.
7. Package: Comes in an FBGA (Fine-Pitch Ball Grid Array) package with 1152 pins.
8. Operating Temperature: Supports a commercial temperature range.
9. Configuration: Supports multiple configuration schemes including JTAG and AS.
This FPGA is suitable for high-speed communication, signal processing, and other demanding applications requiring high performance and flexibility.
Pinout
Key functions and features of the EP2SGX60EF1152I4N include:
1. High-Speed Transceivers: It incorporates high-speed transceiver blocks suitable for data rates of up to 6.375 Gbps, facilitating fast data transmission.
2. Logic Elements: It includes a substantial number of logic elements (LEs), which are the basic building blocks for implementing digital circuits.
3. Memory Blocks: The FPGA offers embedded memory blocks for efficient data storage and retrieval, supporting complex data processing tasks.
4. DSP Blocks: Equipped with dedicated DSP blocks, it enables advanced digital signal processing applications.
5. I/O Pins: The device provides numerous general-purpose I/O pins for interfacing with other components and systems.
6. Configuration Options: It supports multiple configuration schemes including JTAG for ease of programming and debugging.
These features make the EP2SGX60EF1152I4N suitable for demanding applications requiring high-speed data handling and extensive processing capabilities.
Manufacturer
Application
1. Telecommunications: Used in base stations and communication infrastructure for data handling and signal processing.
2. Networking: Supports high-speed networking equipment such as routers and switches.
3. Broadcast: Facilitates real-time video and audio processing for broadcasting systems.
4. Military and Aerospace: Suitable for secure and reliable data processing in avionics and defense systems.
5. Data Centers: Enhances server efficiency and performance through data acceleration and workload optimization.
6. Test and Measurement: Employed in sophisticated electronic testing and measurement equipment.
These applications benefit from the FPGA's flexibility, high-speed serial connectivity, and processing capabilities.