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EP3C120F484I7N
+StücklisteIC FPGA 283 I/O 484FBGA
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HerstellerIntel
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Herstellerteil #EP3C120F484I7N
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Paket FBGA-484
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Auf Lager3456
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Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 7443 |
| NumberofLogicElements/Cells | 119088 |
| TotalRAMBits | 3981312 |
| NumberofI/O | 283 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BGA |
Übersicht
Description
Equivalent
Features
1. Logic Elements: It contains approximately 119,088 logic elements, which provide the flexibility required for various digital design implementations.
2. Embedded Memory: The FPGA offers around 3.97 Mbits of embedded memory, supporting complex data storage and processing needs.
3. I/O Pins: It includes 360 general-purpose I/O pins, suitable for extensive interfacing requirements with external components.
4. PLL: The device integrates four phase-locked loops (PLLs) for clock management and signal conditioning, enhancing timing precision.
5. Speed Grade: With a speed grade of '7', it supports a good balance between performance and power efficiency.
6. Package: Comes in a 484-pin FineLine BGA package, facilitating compact board designs.
7. Voltage: Operates on a core voltage of 1.2V and I/O voltages ranging from 1.2V to 3.3V, enabling compatibility with various power sources.
These features make the EP3C120F484I7N suitable for a wide range of applications, including consumer electronics, communications, and industrial automation.
Pinout
Key functions and features include:
1. Logic Elements: It provides 120,000 logic elements, accommodating complex digital designs.
2. Memory: It includes embedded memory for on-chip data storage and processing.
3. PLLs: The device has several phase-locked loops (PLLs) for clock management.
4. I/O Pins: It supports multiple I/O standards and provides plenty of I/O pins for interfacing with other hardware.
5. Power: Designed for low power consumption, suitable for power-sensitive applications.
6. Applications: Used in consumer electronics, automotive, communications, and industrial applications.
The detailed pinout and specific functions of each pin are described in the official datasheet provided by Intel for accurate design implementation.
Manufacturer
As part of Intel, the focus on FPGAs continues, with Intel using these technologies to enhance their data center, networking, and Internet of Things (IoT) businesses. FPGAs are particularly valued for their flexibility, allowing developers to optimize hardware for specific tasks, which can lead to significant performance improvements in custom applications.
Application
1. Telecommunications: Used for signal processing, protocol bridging, and network infrastructure.
2. Consumer Electronics: Enables advanced features in devices due to its flexibility and power efficiency.
3. Industrial Automation: Implements control systems, real-time processing, and data acquisition.
4. Medical Devices: Utilized in imaging systems and diagnostic equipment for data processing.
5. Automotive Systems: Supports infotainment, driver assistance, and advanced vehicle control.
6. Aerospace and Defense: Critical for secure communications, radar systems, and avionics.
These applications benefit from the FPGA's high performance, low power consumption, and reconfigurability.