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EP3C25F324C8
+StücklisteIC FPGA 215 I/O 324FBGA
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HerstellerIntel
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Herstellerteil #EP3C25F324C8
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Paket FBGA-324
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Auf Lager1977
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Cyclone® III |
| Part Status | Active |
| Number of LABs/CLBs | 1539 |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of I/O | 215 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Elements: 24,624 LEs for implementing custom logic.
2. Embedded Memory: Includes M9K memory blocks for efficient data storage.
3. DSP Blocks: Supports digital signal processing applications.
4. I/O Pins: Multiple I/O pins with support for various standards like LVTTL, LVCMOS.
5. Power Efficiency: Designed with low power consumption in mind.
6. Configuration: Supports multiple configuration schemes.
The EP3C25F324C8 is ideal for designers looking for a balance between performance, cost, and power efficiency in programmable logic devices. It supports a wide array of applications, offering flexibility and scalability for complex designs.
Equivalent
Features
1. Logic Elements: Contains 24,624 logic elements, allowing for significant digital logic design customization.
2. Memory: Includes 594 Kbits of embedded memory for data storage and manipulation.
3. I/O Pins: Provides 215 I/O pins, facilitating extensive connectivity options.
4. PLL: Equipped with 4 phase-locked loops for clock management, ensuring stable operation.
5. Speed Grade: The "C8" indicates a specific speed grade, affecting the performance and timing of the device.
6. Low Power Consumption: Designed for low power usage, making it suitable for energy-sensitive applications.
7. Package: Comes in a 324-pin FineLine BGA (Ball Grid Array) package, optimizing space on the circuit board.
8. Temperature Range: Operates within a commercial temperature range, suitable for various environments.
These features make the EP3C25F324C8 a versatile choice for a wide range of embedded and digital signal processing applications.
Pinout
Manufacturer
Intel Corporation is a multinational technology company headquartered in Santa Clara, California. It is widely recognized as a leading manufacturer of semiconductor chips and is a key player in the development of various technologies including processors, integrated graphics, and other computer components. Intel's transition into FPGAs through its acquisition of Altera represents its expansion into more diverse semiconductor markets, enabling it to offer solutions for data centers, the Internet of Things (IoT), and advanced computing applications.
Application
1. Consumer Electronics: Provides efficient processing capabilities for devices such as set-top boxes and digital TVs.
2. Industrial Automation: Used in control systems for real-time processing and decision-making.
3. Telecommunications: Supports functions in networking equipment, including data packet processing.
4. Medical Devices: Facilitates image processing and control systems.
5. Automotive Systems: Functions in engine control units and infotainment systems.
Its flexibility makes it suitable for diverse applications requiring customizable logic solutions.