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EP3C40F780I7N
+StücklisteIC FPGA 535 I/O 780FBGA
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HerstellerIntel
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Herstellerteil #EP3C40F780I7N
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Paket FBGA-780
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Auf Lager6694
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2475 |
| NumberofLogicElements/Cells | 39600 |
| TotalRAMBits | 1161216 |
| NumberofI/O | 535 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 780-BGA |
Übersicht
Description
The Cyclone III series is fabricated on a 65 nm process technology, optimizing power efficiency and performance. The EP3C40F780I7N also supports features like embedded multipliers and PLLs (Phase-Locked Loops), which are essential for digital signal processing and clock management. Its non-volatile configuration memory ensures quick start-up, and it offers a range of development tools and support resources to assist designers in rapid prototyping and implementation. This FPGA is ideal for applications in consumer electronics, communications, and industrial automation, where cost-effectiveness and power efficiency are critical.
Equivalent
Features
The EP3C40F780I7N is housed in a 780-pin FineLine BGA package, permitting high-density I/O configurations. It provides up to 535 user I/O pins, which allows for extensive connectivity options. The device supports various I/O standards, including LVTTL, LVCMOS, and SSTL, providing versatility in interfacing with other components.
Additionally, the FPGA features Altera's Quartus II design software compatibility for efficient design implementation and includes support for advanced configuration schemes, such as JTAG and AS (Active Serial) programming, facilitating easy updates and debugging.
Pinout
The key functions and features of the EP3C40F780I7N include:
- It contains 39,600 Logic Elements (LEs), which are the building blocks for designing digital circuits within the FPGA.
- It offers up to 116 embedded multipliers for efficient digital signal processing (DSP) operations.
- The device contains multiple phase-locked loops (PLLs) for clock management, enabling the integration of complex timing requirements.
- It includes a significant amount of embedded memory, with up to 1,161 Kbits of RAM, facilitating data storage and fast access.
- Support for numerous I/O standards, making it versatile for different interfacing needs.
- The device is suitable for applications in automotive, industrial, and communications sectors due to its robust performance over a wide temperature range.
Manufacturer
Application
1. Industrial Automation: Used in control systems and robotics for real-time processing.
2. Consumer Electronics: Implemented in smart devices and home automation systems.
3. Automotive: Used in advanced driver-assistance systems (ADAS) and infotainment.
4. Communication: Deployed in base stations and network infrastructure for signal processing.
5. Medical Devices: Utilized in imaging systems and portable diagnostics.
6. Aerospace and Defense: Used in avionics and secure communication systems.
These applications benefit from the FPGA's flexibility, reconfigurability, and performance.