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EP3C80F780C6N
+StücklisteIC FPGA 429 I/O 780FBGA
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HerstellerIntel
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Herstellerteil #EP3C80F780C6N
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Paket FBGA-780
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Auf Lager1544
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Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5079 |
| NumberofLogicElements/Cells | 81264 |
| TotalRAMBits | 2810880 |
| NumberofI/O | 429 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 780-BGA |
Übersicht
Description
Key specifications:
- FPGA Fabric: 65nm low-power process
- I/O Pins: 429 (supports multiple standards like LVDS, LVCMOS)
- Clock Management: Up to 4 PLLs
- Package: 780-pin FineLine BGA (FBGA)
Applications include embedded systems, industrial control, and communications. The Cyclone III series balances performance and power efficiency, with this variant offering moderate logic density and I/O flexibility.
For development, Intel’s Quartus II software is typically used. Always refer to the datasheet for detailed electrical and timing specifications.
Equivalent
- EP3C40F780C6N (lower capacity)
- EP3C120F780C6N (higher capacity)
- Lattice ECP3 series (similar low-power FPGAs)
- Xilinx Spartan-6 (comparable performance)
Check pin compatibility and features before substitution. For exact replacements, consult Intel’s documentation or distributors like Arrow, Avnet, or Digi-Key.
Pinout
- Pin Count: 780 pins (FPGA package: F780)
- Key Functions:
- I/O Pins: 535 user I/Os (supports multiple standards: LVTTL, LVCMOS, LVDS, etc.)
- Logic Elements: ~81K LEs
- Memory: 3.6 Mb embedded RAM
- PLLs: 4 phase-locked loops for clock management
- Multipliers: 56 18x18 multipliers for DSP applications
This FPGA is designed for cost-sensitive, high-volume applications with moderate logic density.
Application
- Embedded Systems: Used in industrial control, automation, and robotics.
- Communications: Signal processing, networking, and protocol bridging.
- Consumer Electronics: Video processing, display controllers, and IoT devices.
- Automotive: Infotainment and driver assistance systems.
- Medical Devices: Imaging and diagnostic equipment.
- Military/Aerospace: Ruggedized and low-power applications.
Its low power, high logic density, and cost-effectiveness make it suitable for diverse mid-range FPGA applications.