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EP4CE30F23I7N
+StücklisteIC FPGA 328 I/O 484FBGA
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HerstellerIntel
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Herstellerteil #EP4CE30F23I7N
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Paket FBGA-484
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Auf Lager2627
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Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Cyclone® IV E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1803 |
| NumberofLogicElements/Cells | 28848 |
| TotalRAMBits | 608256 |
| NumberofI/O | 328 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BGA |
Übersicht
Description
Key features of the EP4CE30F23I7N include:
1. Logic Elements (LEs): It has approximately 28,896 LEs, providing significant processing capabilities for complex computations and designs.
2. Memory: The device includes embedded memory blocks to facilitate efficient data storage and processing.
3. I/O Pins: It offers numerous I/O pins, allowing for versatile connectivity with other components and systems.
4. Embedded Multipliers: These facilitate efficient arithmetic computations, crucial for signal processing applications.
5. Low Power: The Cyclone IV FPGAs are known for their low power consumption, making them ideal for energy-sensitive applications.
6. Package: The 'F23' refers to its package type, a FineLine BGA, which supports high-density applications.
Overall, the EP4CE30F23I7N is suitable for cost-sensitive applications requiring moderate processing power and flexibility.
Equivalent
1. Xilinx Spartan-6 series, specifically models like XC6SLX25 or XC6SLX45 which offer similar logic resources.
2. Lattice ECP3 series, such as the LFE3-35EA, providing comparable performance and capacity.
3. Microsemi (formerly Actel) IGLOO series, more specifically the AGLN250, offering similar capabilities for low-power applications.
Always verify specific requirements like I/O count, power consumption, and package type for compatibility.
Features
1. Logic Elements: It contains 28,224 logic elements.
2. Memory: The FPGA provides 594 Kbits of embedded memory.
3. I/O Pins: It offers a maximum of 528 user I/O pins.
4. Phase-Locked Loops (PLLs): It includes 4 PLLs for clock management.
5. Package: Available in a 484-pin FineLine BGA package, with a pitch of 0.8mm.
6. Operating Temperature: It supports an industrial temperature range from -40°C to +100°C.
7. Supply Voltage: The core voltage is 1.2V, while the I/O banks support voltages from 1.2V to 3.3V.
8. Power Consumption: Designed for low power consumption, making it suitable for power-sensitive applications.
9. Development Tools: Compatible with Altera’s Quartus II software for design and implementation.
10. Applications: Ideal for a wide range of applications including communications, automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and cost.
Pinout
1. Logic Elements (LEs): The EP4CE30F23I7N has approximately 28,896 LEs, providing ample capacity for complex digital designs.
2. Embedded Memory: It includes embedded memory blocks, offering a total of 1,152 Kbits of RAM, which can be used for storing data and implementing memory-intensive functions.
3. DSP Blocks: The device contains a number of embedded multipliers or DSP blocks for implementing high-speed arithmetic operations.
4. I/O Pins: The FPGA offers a significant number of general-purpose I/O pins, which can be configured for various I/O standards and communication protocols.
5. PLL Support: It includes multiple PLLs for clock management and generation, supporting a wide range of clock input frequencies and output frequencies.
Overall, the EP4CE30F23I7N is designed for low-power, cost-sensitive applications while delivering a balance of performance and flexibility.
Manufacturer
Altera, known for its FPGAs, was acquired by Intel in 2015, and their product lines have since been integrated under Intel's Programmable Solutions Group. Intel is widely recognized as a leading company in the technology and semiconductor industries, providing components that serve various applications in consumer electronics, data centers, automotive systems, and industrial equipment.
Application
1. Embedded Systems: Used in microcontrollers and processors for flexible hardware solutions.
2. Communications: Suitable for broadband wireless, networking, and protocol bridging.
3. Industrial Automation: Facilitates control systems, robotics, and signal processing.
4. Consumer Electronics: Powers devices needing rapid data processing and interface control.
5. Automotive: Used in infotainment systems, advanced driver-assistance systems (ADAS), and more.
6. Medical Devices: Supports imaging and diagnostics equipment with real-time data processing.
Its low power consumption and cost-effectiveness make it ideal for high-volume applications.