EP4CE55F23I7N

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EP4CE55F23I7N

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IC FPGA 324 I/O 484FBGA

  • HerstellerIntel

  • Herstellerteil #EP4CE55F23I7N

  • Paket FBGA-484

  • Auf Lager1499

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Attribut Wert
Package Tray
Series Cyclone® IV E
ProductStatus Active
NumberofLABs/CLBs 3491
NumberofLogicElements/Cells 55856
TotalRAMBits 2396160
NumberofI/O 324
Voltage-Supply 1.15V ~ 1.25V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-BGA

Übersicht

Description

The EP4CE55F23I7N is part of Altera's Cyclone IV FPGA family, which is designed for cost-sensitive applications requiring low power consumption and high functionality. These FPGAs are built using a 60 nm process technology and are well-suited for a variety of applications including automotive, consumer electronics, and industrial automation.
Key features of the EP4CE55F23I7N include:
- 55,880 logic elements
- 3.9 Mbits of embedded memory
- 328 user I/O pins
- 156 multipliers for DSP applications
The device supports a range of I/O standards, such as LVTTL, LVCMOS, SSTL, and HSTL, and is equipped with PLLs for clock management, making it highly flexible for a variety of designs. The FPGA is housed in a 484-pin FineLine BGA package, which optimizes space and thermal performance.
Overall, the EP4CE55F23I7N offers a balance of performance, flexibility, and low power consumption, making it suitable for a broad array of applications where cost-effectiveness and efficiency are key considerations.

Equivalent

The EP4CE55F23I7N is an Altera Cyclone IV FPGA. Equivalent products from other manufacturers might include the Xilinx Spartan-6 series, such as the XC6SLX45 or Lattice's ECP3 series, like the LFE3-70E. When selecting equivalents, consider the specific requirements like logic elements, I/O pins, and power consumption to ensure compatibility for your application. Always verify the specs and performance features to ensure a proper match.

Features

The EP4CE55F23I7N is part of the Cyclone IV family of FPGAs by Intel (formerly Altera). It features 55,880 logic elements, providing a substantial amount of programmable logic for various applications. The device includes 3,888 kilobits of embedded memory, which supports a wide range of data handling and processing tasks. For digital signal processing, it offers 154 embedded multipliers, which can be utilized for efficient implementation of signal processing algorithms.
The FPGA supports up to 294 user I/O pins, allowing for flexible interfacing with other digital components. It operates within a voltage range of 1.15V to 1.25V for core voltage, making it suitable for low-power applications. The device is housed in a 484-pin FineLine BGA package, which is designed for high-density applications while maintaining a small footprint.
Overall, the EP4CE55F23I7N is well-suited for applications that require a balance between cost, performance, and power efficiency, such as in industrial, automotive, or consumer electronics.

Pinout

The EP4CE55F23I7N is a member of the Cyclone IV family of FPGAs produced by Intel (formerly Altera). It is specifically a Cyclone IV E series device. This FPGA comes in a FineLine BGA (Ball Grid Array) package, specifically with a 23x23 mm package size.
The EP4CE55F23I7N has a pin count of 484. These pins are used for a variety of functions including general-purpose I/Os (GPIOs), power supply connections, configuration, clock inputs, and dedicated function pins for features like PLLs (Phase-Locked Loops) and other specialized purposes.
The device's primary function is to be a reconfigurable logic device that allows for the implementation of custom digital circuits. It is often used in applications requiring moderate to high-performance processing capabilities with a need for flexibility and adaptability, such as embedded systems, digital signal processing, and custom computing tasks.
For detailed specifications and pin assignments, referring to the official datasheet or user manual provided by Intel is recommended.

Manufacturer

The EP4CE55F23I7N is manufactured by Intel Corporation, specifically through its subsidiary Intel Programmable Solutions Group (formerly known as Altera). This device is part of the Cyclone IV FPGA (Field Programmable Gate Array) family.
Intel is a multinational corporation and technology company, widely recognized for its role in producing semiconductor chips and microprocessors, which are integral to a variety of computing devices. The company is headquartered in Santa Clara, California, and it operates in various sectors including data centers, artificial intelligence, and the Internet of Things (IoT).
Altera, acquired by Intel in 2015, was a leading company in the FPGA industry. FPGAs are semiconductor devices that can be programmed post-manufacturing to perform a wide range of computing tasks, which makes them highly versatile for various applications, including telecommunications, automotive, industrial, and consumer electronics.
Intel's acquisition of Altera expanded its portfolio to include programmable hardware, thereby enhancing its capabilities in providing solutions for computing and data processing needs across diverse industries.

Application

The EP4CE55F23I7N is a member of the Cyclone IV FPGA family from Intel (formerly Altera). It is used in various applications that require moderate logic density and lower power consumption. Typical application areas include:
1. Embedded Systems: For custom processing tasks and interfacing.
2. Signal Processing: Used in applications requiring DSP functions.
3. Communications: Facilitating protocol bridging and data routing.
4. Industrial Automation: For control systems and process automation.
5. Consumer Electronics: In products requiring adaptable hardware functions.
6. Automotive: For infotainment systems and advanced driver-assistance systems (ADAS).
It supports a range of applications needing cost-effective, flexible, and reconfigurable logic solutions.

Package

The EP4CE55F23I7N is an FPGA from the Altera Cyclone IV family. Its package type is a 484-pin FineLine BGA (Ball Grid Array), denoted by the "F23" in its part number. This type of packaging is used to provide a high density of connections and improved thermal performance.

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