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EP4CGX150DF27I7N
+StücklisteIC FPGA 393 I/O 672FBGA
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HerstellerIntel
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Herstellerteil #EP4CGX150DF27I7N
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Paket FBGA-672
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Auf Lager2746
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Cyclone® IV GX |
| Part Status | Active |
| Number of LABs/CLBs | 9360 |
| Number of Logic Elements/Cells | 149760 |
| Total RAM Bits | 6635520 |
| Number of I/O | 393 |
| Voltage - Supply | 1.16V ~ 1.24V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include integrated transceivers that support data rates up to 3.125 Gbps, making it suitable for serial connectivity. Its architecture supports numerous I/O standards and includes dedicated PLLs (Phase-Locked Loops) for clock management. The device is housed in a 27mm x 27mm FineLine BGA package, model F27, which ensures a compact footprint on circuit boards.
The EP4CGX150DF27I7N is part of a cost-effective FPGA family that balances performance with power efficiency, making it ideal for applications in consumer electronics, automotive systems, and industrial applications where power consumption and space are critical considerations.
Equivalent
Features
1. Logic Elements: It has 149,760 logic elements, providing ample resources for complex designs.
2. Memory: The FPGA includes 5,631 Kbits of embedded memory for data storage and processing.
3. DSP Blocks: It contains 288 embedded multipliers, enhancing its ability to perform digital signal processing tasks.
4. Transceivers: The device features up to 8 high-speed transceivers, supporting data rates up to 3.125 Gbps, ideal for high-bandwidth applications.
5. I/O Pins: With 383 user I/O pins, it offers extensive connectivity options for interfacing with other components.
6. Package: The device is available in the FBGA-672 package, allowing for moderate footprint designs.
7. Power: Designed for low power consumption, it suits applications requiring energy efficiency.
8. Applications: Suitable for applications in communications, broadcast, and industrial markets, among others.
Overall, the EP4CGX150DF27I7N is an efficient solution for high-speed, low-power applications requiring robust data processing and connectivity capabilities.
Pinout
In terms of functionality, the EP4CGX150DF27I7N is designed for high-speed and low-power applications. It includes multiple features such as high-speed transceivers, abundant logic, memory, DSP blocks, and various I/O options. This makes it suitable for applications in communications, networking, and consumer electronics. The device supports PCI Express, Gigabit Ethernet, and other high-speed protocols through its transceiver channels. Additionally, it offers various I/O standards and is equipped with PLLs for clock management. The combination of these features allows for versatile application design, enabling efficient data processing and communication in complex systems.
Manufacturer
Intel Corporation is a multinational corporation and technology company headquartered in Santa Clara, California. It is well known for its semiconductor products and is one of the world's largest and most prominent manufacturers of microprocessors. Intel's activities span design and manufacturing of products for computing, networking, data storage, and communications. The company is recognized for its innovation in technology and significant contributions to the growth of computing technology globally.