H5TQ2G63GFR-RDC

Abbildungen dienen nur als Referenz

H5TQ2G63GFR-RDC

+Stückliste

2Gbit 1.425V~1.575V 667MHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Packaging FBGA-96
Clock Frequency 667MHz
Memory Format DDR3 SDRAM
Memory Size 2Gbit
Operating Temperature -40℃~+95℃
Refresh Current 6mA
Voltage - Supply 1.425V~1.575V

Übersicht

Description

"H5TQ2G63GFR-RDC" appears to be a specific code or identifier that could relate to a product, service, or system, but without additional context or publicly available information, it is challenging to provide a detailed introduction. In general, alphanumeric codes such as this are often used for categorization, inventory management, or identification purposes across various industries, including technology, manufacturing, and logistics.
To understand the specific nature of H5TQ2G63GFR-RDC, one would typically look for documentation related to the context in which this code is used, such as user manuals, technical specifications, or corporate databases. If associated with a proprietary system, accessing detailed information might require permissions or direct inquiry with the entity that issued or uses the code.
For a proper introduction, consider where and how you're encountering this code and seek relevant sources that can provide clarity, such as contacting customer support or consulting an internal resource if the code is used within an organization.

Equivalent

The H5TQ2G63GFR-RDC chip is a DDR3 SDRAM from SK Hynix. Equivalent products may include:
1. Samsung K4B2G1646F-BCMA
2. Micron MT41K256M16HA-125
3. Nanya NT5CB256M8FN-DI
These chips typically have similar specifications such as memory size, speed, and form factor, but it's important to verify compatibility with your specific requirements.

Features

The model number H5TQ2G63GFR-RDC refers to a specific type of DRAM chip produced by SK Hynix. Here are some key features and details:
1. Type: DDR3 SDRAM
2. Density: 2Gb (Gigabit), which translates to 256MB (Megabyte) per chip.
3. Configuration: The "G" in the model indicates the chip’s organization, typically 8 bits.
4. Package: FBGA (Fine-Pitch Ball Grid Array), providing a compact layout.
5. Speed: Operates at various DDR3 speeds, commonly up to 1600 MT/s (megatransfers per second).
6. Voltage: Typically operates at 1.5V, though low-voltage versions (1.35V) are common.
7. Use: Commonly used in computers, servers, and other electronic devices requiring efficient memory solutions.
These chips are designed to provide reliable performance with improved speed and efficiency, suitable for a wide range of applications.

Pinout

The H5TQ2G63GFR-RDC is a DDR3 SDRAM chip manufactured by SK Hynix. It typically comes in a 78-ball FBGA (Fine-pitch Ball Grid Array) package. The pin count for this package is 78.
The primary function of this chip is to serve as a high-speed, volatile memory solution, commonly used in applications requiring temporary data storage and quick access. It supports data rates that are standard for DDR3 technology, providing efficient memory performance across various computing devices. The H5TQ2G63GFR-RDC operates at a standard 1.5V power supply and includes features such as programmable CAS latency, burst length, and sequential/Interleave burst type access. It's typically used in desktops, laptops, and other devices that require efficient memory management.

Manufacturer

The H5TQ2G63GFR-RDC is manufactured by SK Hynix. SK Hynix is a South Korean company that specializes in the production of semiconductor memory devices. It is one of the largest memory chip makers in the world, focusing on producing DRAM, NAND flash, and other semiconductor components. SK Hynix serves a wide range of industries, including consumer electronics, computing, mobile devices, and data centers, providing critical components that enable the storage and processing of data in various applications. The company is known for its technological innovations and plays a significant role in the global electronics supply chain.

Application

The H5TQ2G63GFR-RDC is likely a part number for a DRAM module, specifically a DDR3 SDRAM. Its application areas include computing systems such as desktops, laptops, and servers, where it serves as volatile memory to temporarily store data for quick access by the CPU. It's also used in networking equipment and various embedded systems, helping improve system performance by providing fast data access. Additionally, it can be used in consumer electronics like gaming consoles and smart TVs, where efficient memory management is crucial for optimal operation. Overall, its primary function is to enhance the speed and efficiency of data processing in a wide range of electronic devices.

Package

The package type H5TQ2G63GFR-RDC refers to a DDR4 DRAM memory module from SK Hynix. It is typically used in high-performance computing applications, servers, and workstations. The package type is designed for reliability and efficiency in data processing.

Frequently Asked Questions


Q: What is the memory density and configuration of this HYNIX DDR3 chip?
A: It is a 2Gbit DDR3 SDRAM, organized as 128M x16, suitable for high-density memory modules or embedded systems.


Q: What is the maximum operating clock frequency supported by the H5TQ2G63GFR-RDC?
A: It supports a clock frequency of 667MHz, corresponding to a data rate of 1333Mbps per pin.


Q: Does this component support industrial temperature range operation?
A: Yes, its operating temperature range is -40°C to +95°C, making it suitable for industrial and automotive applications.


Q: What is the supply voltage requirement for this DDR3 SDRAM?
A: The required supply voltage is 1.425V to 1.575V, compliant with standard DDR3 VDDQ specifications.


Q: What is the typical refresh current consumption for this memory chip?
A: The typical refresh current is 6mA, ensuring low power consumption during self-refresh mode for battery-backed applications.


Q: What package type is used for the H5TQ2G63GFR-RDC?
A: It comes in an FBGA-96 package, a standard 96-ball fine-pitch ball grid array for DDR3 memory.


Q: Is this component compatible with standard DDR3 memory controllers?
A: Yes, it conforms to the JEDEC DDR3 SDRAM standard, ensuring compatibility with most DDR3 memory controllers and SoCs.


Produkte, die mit H5TQ2G63GFR-RDC zusammenhängen

  • Schnellangebot

  • Senden Sie Ihre Angebotsanfrage für H5TQ2G63GFR-RDC Mit diesem Formular können Sie uns innerhalb von 12 Stunden kontaktieren.