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K4A8G085WB-BCTD
+StücklisteFBGA-78 Memory (ICs) RoHS
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HerstellerSamsung
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Herstellerteil #K4A8G085WB-BCTD
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Auf Lager5358
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | FBGA-78 |
Übersicht
Description
- Capacity: 8Gb (1GB per chip)
- Speed: 2666 Mbps (DDR4-2666)
- Voltage: 1.2V (standard for DDR4)
- Organization: 8Gbit (512M x16)
- Package: 78-ball FBGA
- Applications: Consumer electronics, servers, networking, and embedded systems.
It supports auto-refresh, self-refresh, and on-die termination (ODT) for signal integrity. Designed for high-speed, low-power operation, it’s commonly used in modules like SODIMMs or UDIMMs.
For detailed specs, refer to Samsung’s datasheet.
Features
- Density: 8Gb (1GB)
- Organization: 512M x16
- Speed: 2133 Mbps (DDR4-2133)
- Voltage: 1.2V (standard DDR4)
- Package: 78-ball FBGA
- Refresh: Auto & Self-Refresh
- Burst Length: 8 (BL8)
- CAS Latency (CL): 15 cycles
- Operating Temp: Commercial (0°C to 95°C)
- On-Die Termination (ODT): Supported
Designed for high-speed, low-power applications like servers, networking, and computing systems.
Manufacturer
Samsung is one of the world's largest memory chip producers, known for high-performance DRAM, NAND flash, and SSD solutions. The company dominates the global memory market, supplying components for smartphones, servers, and computing devices.
The K4A8G085WB-BCTD is part of Samsung’s LPDDR4/LPDDR4X lineup, designed for power-efficient applications like mobile and embedded systems.
Key facts:
- Manufacturer: Samsung Electronics
- Type: Memory (DRAM)
- Industry: Semiconductors & Technology
- Market Position: Global leader in memory production
Samsung’s innovations in memory technology make it a critical supplier for major tech firms.
Application
- Computing: Servers, desktops, and laptops for high-speed data processing.
- Networking: Routers, switches, and telecom equipment requiring reliable memory.
- Embedded Systems: Industrial automation, medical devices, and automotive applications.
- Consumer Electronics: Smart TVs, gaming consoles, and high-performance appliances.
Its 8Gb (1GB) capacity, DDR4-3200 speed, and low power consumption make it suitable for applications demanding efficiency and speed.
Package
Frequently Asked Questions
Q: What packaging type does the K4A8G085WB-BCTD use and how does it affect PCB design?
A: It uses FBGA-78 packaging, which requires precise solder ball alignment for reliable connection, suitable for high-density memory applications.
Q: Is this component compatible with DDR4 memory interfaces?
A: Based on its Samsung series and FBGA-78 packaging, it is likely a DDR4 SDRAM, but verify the datasheet for exact interface specifications.
Q: What is the typical application for the K4A8G085WB-BCTD?
A: It is commonly used in servers, networking equipment, and embedded systems requiring high-speed, low-power memory with 8Gb density.
Q: Can this component handle industrial temperature ranges?
A: Without lifecycle or temperature range data in the provided specs, assume standard commercial range. Confirm with Samsung datasheet for extended range support.
Q: What is the memory organization of the K4A8G085WB-BCTD?
A: The part number indicates an 8Gb density (x8 organization expected), but full details require the Samsung datasheet for precise configuration.
Q: How does FBGA-78 packaging affect soldering process requirements?
A: FBGA-78 requires controlled reflow profiles and X-ray inspection due to fine-pitch balls, ensuring no solder bridges or voids form.
