K4A8G165WC-BCRC

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K4A8G165WC-BCRC

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8Gbit 1.14V~1.26V 1.333GHz DDR4 SDRAM FBGA-96 Memory (ICs) RoHS

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Spezifikationen

Attribut Wert
Packaging FBGA-96
Clock Frequency 1.333GHz
Supply Current 64mA
Memory Format DDR4 SDRAM
Memory Size 8Gbit
Operating Temperature 0℃~+95℃
Refresh Current 2mA
Voltage - Supply 1.14V~1.26V

Übersicht

Description

The K4A8G165WC-BCRC is a model of dynamic random-access memory (DRAM) produced by Samsung. It is part of the company's LPDDR4 (Low Power Double Data Rate 4) line, known for its efficient power consumption and high performance, which makes it ideal for mobile and portable devices. This specific model is an 8 Gb (gigabit) memory chip, designed to support high-speed data processing and multitasking capabilities in devices such as smartphones, tablets, and other mobile computing platforms.
Key features of the K4A8G165WC-BCRC include a low operating voltage, which helps in reducing battery drain, and a high data transfer rate, which enhances overall device performance. Its small form factor is particularly advantageous for the compact design needs of modern portable devices. As part of the LPDDR4 series, it also supports advanced memory features like deep sleep mode, further optimizing power efficiency. This memory chip is crucial for manufacturers aiming to deliver devices that balance power efficiency with high-speed performance requirements.

Equivalent

The K4A8G165WC-BCRC is a 8Gb LPDDR4 DRAM chip by Samsung. Equivalent products include:
1. SK Hynix H9HCNNNBKUMLHR-NME: 8Gb LPDDR4 DRAM.
2. Micron MT53B512M64D4: 8Gb LPDDR4 DRAM.
3. Winbond W632GU8MBX7IN: 8Gb LPDDR4 DRAM.
These chips offer similar specifications and functionalities, serving similar applications in mobile and embedded systems. Always check specific datasheets for exact compatibility and performance details.

Features

The K4A8G165WC-BCRC is a DRAM module manufactured by Samsung, specifically a 8Gb (gigabit) LPDDR4 (Low Power Double Data Rate 4) memory chip. Key features include:
1. Capacity: 8Gb per chip, typically used in configurations to achieve desired memory size.
2. Technology: LPDDR4, designed for mobile and embedded applications, offering improvements in speed and power efficiency over its predecessors.
3. Data Rate: Operates at high data rates, often up to 3200 MT/s (megatransfers per second), allowing for faster data processing.
4. Voltage: Low operating voltage around 1.1V, reducing power consumption and heat generation, crucial for battery-powered devices.
5. Interface: Features a 16-bit I/O, supporting wide data bandwidth.
6. Package: Available in a compact FBGA (Fine Ball Grid Array) package, facilitating integration in space-constrained environments.
These features make the K4A8G165WC-BCRC suitable for a range of applications like smartphones, tablets, and other mobile devices, where performance and power efficiency are critical.

Pinout

The K4A8G165WC-BCRC is a 16Gb DDR4 SDRAM chip manufactured by Samsung. It follows the standard DDR4 layout and typically comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. The pin count can vary slightly depending on the specific configuration; however, a common configuration for DDR4 memory chips like this one includes 96 pins or balls.
This memory chip is used for providing high-speed data transfer and is often utilized in computing applications requiring large memory capacities and efficient energy use. It supports standard DDR4 functionalities such as bank interleaving, burst length extension, and on-die termination. Additionally, it operates at a low voltage of 1.2V, which contributes to energy efficiency.
For precise technical details, including the exact pin diagram and functions, referring to the official datasheet from Samsung or documentation specific to the K4A8G165WC-BCRC is recommended.

Manufacturer

The K4A8G165WC-BCRC is manufactured by Samsung Electronics. Samsung Electronics is a South Korean multinational electronics company and is part of the larger Samsung Group. The company is one of the world's largest manufacturers of electronic devices and specializes in the production of a wide range of consumer and industrial electronics, including semiconductors, memory chips, and other electronic components. Samsung is renowned for its innovation and significant contributions to the technology sector, making it a leading player in the global electronics industry.

Application

The K4A8G165WC-BCRC is a DRAM module from Samsung, specifically an 8Gb LPDDR4 (Low Power Double Data Rate 4) chip. Its primary application areas include mobile devices such as smartphones and tablets, where energy efficiency and high performance are crucial. Additionally, it is used in laptops, wearables, and other portable electronics, providing fast data processing while conserving battery life. It may also be employed in automotive electronics and IoT devices, offering reliable memory solutions in environments that require robust, low-power operations.

Package

The K4A8G165WC-BCRC is a DRAM chip by Samsung. It typically comes in a Fine Ball Grid Array (FBGA) package, which is designed for high-density memory applications.

Frequently Asked Questions


Q: What is the memory format and density of the K4A8G165WC-BCRC?
A: It is a DDR4 SDRAM with a density of 8Gbit, suitable for high-bandwidth computing and server applications.


Q: What is the operating temperature range for this Samsung DDR4 chip?
A: The component operates from 0°C to +95°C, covering commercial and extended temperature ranges for reliable performance.


Q: What is the required voltage supply for this memory module?
A: It requires a VDD supply between 1.14V and 1.26V, typical for DDR4 SDRAM to ensure low power consumption.


Q: What is the clock frequency and data rate capability of this part?
A: It supports a clock frequency of 1.333GHz, translating to a data rate of 2666 Mbps per pin for fast data transfer.


Q: What is the typical supply current and refresh current for this device?
A: The typical supply current is 64mA, and the refresh current is 2mA, indicating efficient power management during operation and standby.


Q: Is this DDR4 component suitable for high-density server memory modules?
A: Yes, with 8Gbit density, FBGA-96 packaging, and DDR4 interface, it is ideal for high-performance servers, networking, and data center applications.


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