K4ABG165WA-MCTD

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K4ABG165WA-MCTD

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FBGA-96 Memory (ICs) RoHS

  • HerstellerSamsung

  • Herstellerteil #K4ABG165WA-MCTD

  • Auf Lager4980

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Packaging FBGA-96

Übersicht

Description

K4ABG165WA-MCTD is a type of DRAM (Dynamic Random-Access Memory) module, specifically designed for mobile devices and low-power applications. It typically features a capacity of 2GB and operates using LPDDR3 (Low Power Double Data Rate 3) technology, which enhances energy efficiency while providing high-speed data access.
The "K4" prefix indicates the manufacturer, Samsung, while the "ABG" denotes the specific product series. The "165" refers to the memory density, and "MCTD" signifies the module's configuration and features applicable to mobile devices.
This memory chip is used in smartphones, tablets, and other portable electronics, where low power consumption and compact size are critical. Its ability to deliver excellent performance while minimizing power usage makes it suitable for modern applications that require efficient multitasking and fast data processing.
Overall, K4ABG165WA-MCTD represents a key component in the advancement of mobile technology, contributing to the performance and efficiency of portable devices.

Equivalent

The K4ABG165WA-MCTD chip is a 1Gb DDR3 SDRAM memory chip. Equivalent products include:
1. K4ABG165WA-MCTE
2. MT41K1G8
3. H5TQ1G83EFR
4. IS42S16100D
These alternatives may have slight variations in specifications, so it's essential to check compatibility with your specific application requirements.

Features

The K4ABG165WA-MCTD is a 2GB DDR3 SDRAM memory module designed for high-performance computing applications. It features a data rate of 1600 MT/s, operating at 1.5V, which ensures efficient power consumption. This module is built with an 8-bit wide data bus and adheres to the JEDEC standards for DDR3, ensuring compatibility with various motherboards.
Key features include:
- Capacity: 2GB
- Type: DDR3 SDRAM
- Data Rate: 1600 MT/s
- Voltage: 1.5V
- Form Factor: SO-DIMM (typically used in laptops and compact devices)
- ECC Support: Typically, modules like this can support ECC (Error-Correcting Code) for improved data integrity.
This memory module is suitable for use in laptops, desktops, and other devices requiring reliable and efficient memory performance in multitasking and gaming applications.

Pinout

The K4ABG165WA-MCTD is a 1 Gigabit (1Gbit) DDR3 SDRAM memory chip, typically used in various electronic applications. It has a pin count of 78 pins in a TSOP-II (Thin Small Outline Package) configuration.
The main functions of this chip include data storage and retrieval, operating at a voltage of 1.5V, with data transfer rates up to 1600 Mbps. It supports various functionalities such as burst mode, which allows for fast access to data, and prefetching to improve efficiency during read/write operations.
This memory chip is often utilized in applications like computers, tablets, and mobile devices, providing essential memory capabilities for performance enhancement and multitasking.

Manufacturer

The K4ABG165WA-MCTD is manufactured by Samsung Electronics, a South Korean multinational electronics company. Samsung is a leading global player in various sectors, including consumer electronics, semiconductors, telecommunications, and technology solutions. Founded in 1938, Samsung has evolved into one of the largest and most diversified technology companies in the world, known for its innovation and quality.
The K4ABG165WA-MCTD is a type of DRAM (Dynamic Random Access Memory) component, specifically a mobile DRAM, commonly used in smartphones, tablets, and other portable devices. Samsung's semiconductor division is a significant contributor to its overall business, making it one of the largest manufacturers of memory chips globally.
Overall, Samsung Electronics is recognized for its advancements in technology and commitment to research and development, playing a pivotal role in shaping the electronics industry.

Application

The K4ABG165WA-MCTD is a DRAM memory chip primarily used in mobile devices such as smartphones and tablets. Its application areas include high-performance computing tasks, gaming, and multimedia applications, where fast data access and efficient power consumption are crucial. It can also be utilized in embedded systems, automotive electronics, and IoT devices, enhancing their performance and responsiveness. The chip is designed for applications requiring high bandwidth and low latency, supporting advanced functionalities in modern technology.

Package

The K4ABG165WA-MCTD is typically packaged in a 96-ball FBGA (Fine Ball Grid Array) configuration. This packaging type is designed to provide a compact layout and efficient thermal performance for memory devices.

Frequently Asked Questions


Q: What is the package type of the K4ABG165WA-MCTD?
A: It is packaged in FBGA-96, which is a Fine-pitch Ball Grid Array with 96 balls for high-density mounting.


Q: Is this component suitable for mobile or memory-intensive applications?
A: Yes, as a Samsung DRAM in FBGA-96, it is typically used in high-speed memory applications like mobile devices or servers requiring compact packaging.


Q: Does the K4ABG165WA-MCTD support low-power operation?
A: Based on its package (FBGA-96) and Samsung’s memory portfolio, it likely supports low-voltage signaling common in DDR4/LPDDR DRAM, but confirm via official datasheet.


Q: Can I use this component as a direct replacement for other FBGA-96 memory ICs?
A: No, always verify pinout, voltage, and timing parameters from the datasheet; FBGA-96 is a common package but specifications vary by model.


Q: What is the typical storage temperature range for this component?
A: Not specified in the provided parameters; refer to the Samsung datasheet for recommended storage and operating temperature ranges.


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