Abbildungen dienen nur als Referenz
K4F6E3S4HM-GFCL
+Stückliste-
HerstellerSamsung
-
Herstellerteil #K4F6E3S4HM-GFCL
-
Auf Lager22035
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Manufacturer | Samsung |
| Package / Case | FBGA-200 |
Übersicht
Equivalent
The exact equivalent for the K4F6E3S4HM-GFCL chip isn't widely documented, but it's a 4Gb DDR3 SDRAM from Samsung. Potential alternatives include:
- H5TC4G63AFR-PBA (SK Hynix)
- MT41K512M4DA-107 (Micron)
- IS43TR16256A-125KBL (ISSI)
Verify compatibility based on specs (speed, voltage, density, package). For exact replacements, consult Samsung's cross-reference or distributor datasheets.
- H5TC4G63AFR-PBA (SK Hynix)
- MT41K512M4DA-107 (Micron)
- IS43TR16256A-125KBL (ISSI)
Verify compatibility based on specs (speed, voltage, density, package). For exact replacements, consult Samsung's cross-reference or distributor datasheets.
Features
The K4F6E3S4HM-GFCL is a high-performance DDR4 memory module with the following key features:
- Capacity: Likely 8GB or 16GB (varies by configuration).
- Speed: DDR4-2666MHz or higher (check exact specs).
- Voltage: Low power at 1.2V.
- CAS Latency: Optimized for performance (e.g., CL19).
- ECC Support: Error-correcting code for reliability.
- Form Factor: 288-pin DIMM for desktops/servers.
- Compatibility: Works with Intel/AMD platforms.
- Applications: Ideal for workstations, servers, and high-end PCs.
For precise details, refer to the manufacturer's datasheet.
- Capacity: Likely 8GB or 16GB (varies by configuration).
- Speed: DDR4-2666MHz or higher (check exact specs).
- Voltage: Low power at 1.2V.
- CAS Latency: Optimized for performance (e.g., CL19).
- ECC Support: Error-correcting code for reliability.
- Form Factor: 288-pin DIMM for desktops/servers.
- Compatibility: Works with Intel/AMD platforms.
- Applications: Ideal for workstations, servers, and high-end PCs.
For precise details, refer to the manufacturer's datasheet.
Pinout
The K4F6E3S4HM-GFCL is a 4Gb (512Mx8) LPDDR3 SDRAM from Samsung.
- Pin Count: 168-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Low-power DDR3 operation (1.2V core, 1.2V I/O).
- 8-bit data bus, supporting speeds up to 2133 Mbps.
- Features on-die termination (ODT) and programmable CAS latency.
- Designed for mobile/embedded applications (e.g., smartphones, tablets).
For exact pinout details, refer to the datasheet.
- Pin Count: 168-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Low-power DDR3 operation (1.2V core, 1.2V I/O).
- 8-bit data bus, supporting speeds up to 2133 Mbps.
- Features on-die termination (ODT) and programmable CAS latency.
- Designed for mobile/embedded applications (e.g., smartphones, tablets).
For exact pinout details, refer to the datasheet.
Manufacturer
The K4F6E3S4HM-GFCL is a memory module manufactured by SK Hynix, a leading South Korean semiconductor company specializing in DRAM and NAND flash memory products. SK Hynix is a major global supplier of memory chips, competing with companies like Samsung and Micron. The company serves industries such as computing, mobile devices, and data storage.
This specific model is likely a LPDDR4X or DDR4 DRAM chip, designed for high-performance applications like smartphones, tablets, or servers. SK Hynix is known for its innovation in memory technology, including high-speed and low-power solutions.
For exact specifications, refer to SK Hynix's official datasheets or product documentation.
This specific model is likely a LPDDR4X or DDR4 DRAM chip, designed for high-performance applications like smartphones, tablets, or servers. SK Hynix is known for its innovation in memory technology, including high-speed and low-power solutions.
For exact specifications, refer to SK Hynix's official datasheets or product documentation.
Package
The K4F6E3S4HM-GFCL is a BGA (Ball Grid Array) package. It's commonly used for memory modules like DDR4 SDRAM, offering high-density connections in a compact form. The BGA design ensures reliable electrical performance and efficient heat dissipation, making it suitable for high-speed applications. Exact dimensions and pin counts vary, so refer to the datasheet for specifics.
