Abbildungen dienen nur als Referenz
K4F8E3S4HD-GFCL
+Stückliste8Gbit x32 LPDDR4 FBGA-200 Memory (ICs) RoHS
-
HerstellerSamsung
-
Herstellerteil #K4F8E3S4HD-GFCL
-
Auf Lager5573
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | FBGA-200 |
| Interface | LPDDR4 |
| Memory Format | x32 |
| Memory Size | 8Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.8V;1.1V |
Übersicht
Description
Understanding K4F8E3S4HD-GFCL requires knowledge of its context, such as the manufacturer or sector it pertains to. Often, such codes include information on dimensions, materials, performance characteristics, or compatibility with other products.
For a thorough introduction, it would be essential to look at the relevant documentation or resources linked to this code, which can provide detailed insights into its functionality, applications, and any associated technical standards. Without specific context, it’s challenging to provide a precise overview, but this type of designation typically signifies a unique identifier critical for product identification and specifications.
Equivalent
Features
1. Capacity: 4GB memory, providing sufficient space for everyday applications and gaming.
2. Type: DDR3 SDRAM, which is known for its speed and energy efficiency.
3. Speed: Typically operates at 1600 MT/s, enhancing overall system performance.
4. Form Factor: SO-DIMM, suitable for compact devices like laptops.
5. Voltage: Operates at 1.5V, optimizing power consumption.
6. Compatibility: Compatible with a wide range of motherboards that support DDR3 RAM, ensuring easy upgrades.
7. Reliability: Built to meet stringent industry standards for durability and longevity.
This memory module is ideal for users seeking improved system responsiveness and multitasking capabilities in their computing devices.
Pinout
The primary function of this chip is to serve as a memory component in electronic devices, providing volatile storage for data and programs. It operates as a synchronous DRAM (SDRAM), which means it synchronizes its operations with the system clock to improve performance.
This particular model is often used in applications such as mobile devices, tablets, and other consumer electronics due to its efficiency and speed. The chip supports a 1.8V operating voltage and features a 4-bank architecture for enhanced data access rates.
Manufacturer
Specifically, the K4F8E3S4HD-GFCL is a DRAM (Dynamic Random-Access Memory) chip used in various electronic devices. Samsung's semiconductor division is a leader in the global memory market, producing high-performance memory products that cater to a wide array of applications, from consumer electronics to high-end computing systems. The company emphasizes research and development, pushing advancements in technology to maintain its competitive edge.
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the K4F8E3S4HD-GFCL?
A: It is an 8Gbit LPDDR4 device organized as 256M x32, suitable for high-bandwidth mobile and embedded applications.
Q: What voltage supplies does this LPDDR4 component require?
A: It requires dual supplies: VDD1 at 1.8V for core and VDD2 at 1.1V for I/O, ensuring low-power operation.
Q: What is the operating temperature range of this Samsung memory?
A: It operates from -40°C to +95°C, making it suitable for industrial and automotive-grade thermal environments.
Q: What package type does the K4F8E3S4HD-GFCL use?
A: It comes in a 200-ball FBGA package, enabling compact PCB layout for space-constrained designs.
Q: What is the interface width of this LPDDR4 memory?
A: The memory format is x32, providing a 32-bit data bus for efficient parallel data transfer.
Q: Can this component be used in low-power portable devices?
A: Yes, LPDDR4 is optimized for low power consumption, with 1.1V I/O voltage ideal for smartphones, tablets, and IoT modules.
Q: What applications are best suited for this Samsung LPDDR4?
A: It is designed for high-speed mobile DRAM applications, including AI edge computing, automotive infotainment, and networking equipment.