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16Gbit 2.133GHz LPDDR4X SDRAM FBGA-200 Memory (ICs) RoHS
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HerstellerSamsung
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Herstellerteil #K4U6E3S4AA-MGCL
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Datenblatt K4U6E3S4AA-MGCL DataSheet
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Auf Lager10156
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Spezifikationen
| Attribut | Wert |
| Packaging | FBGA-200 |
| Clock Frequency | 2.133GHz |
| Supply Current | 10mA;65mA;500uA |
| Memory Format | LPDDR4X SDRAM |
| Memory Size | 16Gbit |
| Operating Temperature | -25℃~+85℃ |
| Refresh Current | 1mA;2.7mA;400uA |
| Voltage - Supply | 570mV~650mV;1.06V~1.17V;1.7V~1.95V |
Übersicht
Description
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Equivalent
1. Micron: MT42L128M32D2
2. SK Hynix: H9TKNNN2GDMPLR
3. Toshiba: THGBMHG7C1LBAIL
These equivalents may vary slightly in specifications such as speed and power consumption, so always verify compatibility with your specific application.
Features
Key features include:
1. Low Power Consumption: As an LPDDR4 module, it is optimized to use less power compared to previous generations, extending battery life in mobile devices.
2. High Performance: Offers improved bandwidth and speed compared to LPDDR3, enhancing multitasking and overall device performance.
3. Density: This model typically provides a denser memory package, allowing for more storage in a smaller physical size, which is important for compact mobile devices.
4. Reliability and Speed: Provides faster data access speeds and improved reliability, supporting demanding applications and tasks.
This memory module is suitable for high-performance mobile devices, enabling efficient operation, smooth multitasking, and optimal power use.
Pinout
This chip typically comes in a standard JEDEC-compliant FBGA (Fine-pitch Ball Grid Array) package, which is common for mobile DRAM. The specific pin count for the K4U6E3S4AA-MGCL is 134 pins. The pin configuration supports various functions such as power supply pins, ground pins, data input/output, address lines, control signals, and clock inputs necessary for the operation of the memory module.
The part is designed to provide low-power consumption and high performance, which makes it suitable for mobile applications where power efficiency and space saving are crucial. It supports a range of features such as deep power down, partial-array self-refresh, and auto temperature-compensated self-refresh to enhance its performance and efficiency in mobile environments.
Manufacturer
Samsung Electronics specializes in the manufacture of a wide range of electronic components, consumer electronics, and digital media devices. These include memory chips, semiconductors, displays, televisions, smartphones, and home appliances. The company has a strong presence in the global market and is recognized for its innovation, particularly in the fields of memory technology and mobile devices.
Samsung's operations are extensive, with significant investments in research and development, allowing it to maintain a competitive edge in technology design and production. It is known for its robust supply chain and manufacturing capabilities. Overall, Samsung Electronics is a major player in the technology industry, influencing both consumer markets and the larger electronics supply chain globally.
Frequently Asked Questions
Q: What is the memory format and density of the K4U6E3S4AA-MGCL?
A: It is an LPDDR4X SDRAM with a density of 16Gbit, suitable for high-bandwidth mobile applications.
Q: What is the operating clock frequency of this LPDDR4X component?
A: The clock frequency is 2.133GHz, enabling high-speed data transfer for memory-intensive tasks.
Q: What are the required supply voltage rails for this chip?
A: It requires three voltage supplies: VDD1 570-650mV, VDD2 1.06-1.17V, and VDDQ 1.7-1.95V.
Q: What is the temperature range for this device?
A: It operates over a commercial-industrial temperature range of -25°C to +85°C.
Q: What does the typical supply current draw look like?
A: Active current is 10mA (IDD1), burst read/write 65mA, and standby at 500μA, with refresh current up to 2.7mA.
Q: In which package is this Samsung memory offered?
A: It is housed in a FBGA-200 package, commonly used for space-constrained PCB layouts.