KLM8G1GETF-B041006

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KLM8G1GETF-B041006

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  • HerstellerSamsung Electronics

  • Herstellerteil #KLM8G1GETF-B041006

  • Auf Lager23139

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Spezifikationen

Attribut Wert
EU Ro HS Compliant
ECCN (US) 3A991.b.1.a
Part Status Active
HTS 8542.32.00.71
Automotive No
PPAP No
Cell Type MLC NAND
Chip Density (bit) 64G
Architecture Sectored
Boot Block Yes
Number of Bits / Word (bit) 1/4/8
Number of Words 64G/16G/8G
Programmability Yes
Timing Type Synchronous
Maximum Erase Time (S) 0.02
Interface Type Serial e-MMC
Maximum Operating Frequency (M Hz) 200
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (m A) 50
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Command Compatible Yes
ECC Support Yes
Support of Page Mode No
Mounting Type Surface Mount
Package Height 0.49
Package Width 11.5
Package Length 13
PCB changed 153
Package / Case BGA
Supplier Device Package FBGA
Pin Count 153
Lead Shape Ball

Übersicht

Description

The KLM8G1GETF-B041006 is a memory chip produced by Samsung, typically used in various electronic devices for data storage purposes. It is a type of NAND flash memory, which is known for its high storage capacity, speed, and reliability. This specific model is likely part of the eMMC (embedded MultiMediaCard) lineup, designed to provide efficient performance and a compact size, ideal for smartphones, tablets, and other portable devices.
The chip integrates both flash memory and a flash memory controller within a single package, streamlining data management and enhancing processing speed. With the evolution of storage technology, components like the KLM8G1GETF-B041006 play a crucial role in meeting the increasing demands for higher storage capacities and faster data transfer rates. Its design is tailored to support modern applications that require rapid access to large volumes of data, contributing significantly to the performance and functionality of consumer electronics.

Equivalent

The KLM8G1GETF-B041006 is a Samsung eMMC (embedded MultiMediaCard) memory chip. Equivalent products would be other eMMC chips from different manufacturers with similar specifications in terms of storage capacity, speed, and compatibility. Examples include:
1. Micron eMMC chips such as the MTFC8GACAAAM or MTFC8GLADAD.
2. Toshiba (now Kioxia) eMMC products like the THGBMBG5D1KBAIL.
3. Kingston eMMC solutions, such as the KE4CN2H5A or KE4CN3H5A.
These equivalents should be verified for specific use requirements, as specifications can vary.

Features

The KLM8G1GETF-B041006 is a type of NAND flash memory commonly used in various electronic devices, such as smartphones, tablets, and other embedded systems. It is manufactured by Samsung and is part of their eMMC (embedded MultiMediaCard) lineup, which integrates NAND flash memory with a controller for efficient storage management. Here are some of its key features:
1. Capacity: Typically offers an 8GB storage capacity.
2. eMMC Standard: Complies with the eMMC 4.41 or later standard, ensuring compatibility with a wide range of devices.
3. Interface: Uses an 8-bit interface to facilitate fast data transfer.
4. Performance: Provides reliable read and write speeds, which are essential for smooth device performance.
5. Reliability: Features wear-leveling and error correction mechanisms to enhance data integrity and longevity.
6. Form Factor: Compact package design suitable for integration in small devices.
7. Voltage: Operates at low voltage levels for power efficiency, often around 3.3V for the I/O and 1.8V for the core.
This component is ideal for applications requiring compact, efficient, and reliable storage solutions.

Pinout

The KLM8G1GETF-B041006 is a part of Samsung's eMMC (embedded MultiMediaCard) lineup, specifically an 8GB NAND flash memory module. While the exact pin count can vary depending on the specific package, eMMC modules like this typically use a standard BGA (Ball Grid Array) package for connection. Common eMMC configurations feature around 153 to 169 pins, though this can differ slightly based on the specific version and physical configuration.
The primary function of the KLM8G1GETF-B041006 is to serve as embedded storage in electronic devices such as smartphones, tablets, and other portable devices. It combines NAND flash memory with a flash memory controller in a single package to manage the complexities of NAND operation. This integration provides a simple, high-performance, and space-saving storage solution. It supports standard eMMC features including boot partitions, replay-protected memory block, and secure erase functionalities, among others.

Manufacturer

The part number KLM8G1GETF-B041006 is associated with Samsung. Samsung is a multinational conglomerate headquartered in South Korea. It operates as a diversified company with numerous subsidiaries and affiliated businesses, primarily under the Samsung brand. The company is best known for its consumer electronics products, such as smartphones, televisions, and home appliances. It is also a leading manufacturer in the fields of semiconductors, memory chips, and display panels. Samsung's semiconductor business is one of the largest in the world, producing a wide range of components, including NAND flash memory and DRAM, which are used in various electronic devices. Samsung is a key player in the technology and electronics industry, with a global presence and significant influence in the market.

Application

The KLM8G1GETF-B041006 is a high-density embedded NAND flash memory module typically used in applications requiring reliable and efficient data storage solutions. Common application areas include smartphones, tablets, and other mobile devices, where it supports fast data processing and storage. It is also employed in consumer electronics like smart TVs and digital cameras, providing essential storage capabilities. Additionally, it finds usage in automotive infotainment systems and industrial devices, where durability and performance are critical. The module's embedded design allows for compact and efficient integration into various devices, enhancing their overall performance and storage capacity.

Package

The KLM8G1GETF-B041006 is an eMMC (embedded MultiMediaCard) memory module produced by Samsung. It is typically housed in a small BGA (Ball Grid Array) package, which is common for such memory components, providing a compact form factor suitable for mobile and embedded applications.

Frequently Asked Questions


Q: What is the primary application for this MLC NAND e-MMC?
A: This component integrates MLC NAND with e-MMC interface, ideal for embedded storage in mobile, IoT, and consumer electronics requiring high-density boot and data storage.


Q: Does this part support ECC for reliable data integrity?
A: Yes, the specifications confirm ECC support is included, enhancing memory reliability in demanding write/erase cycles typical of MLC NAND.


Q: What is the maximum operating frequency and voltage range?
A: It operates at up to 200 MHz with a supply voltage range of 2.7V to 3.6V, typical at 3.0V or 3.3V, balancing speed with power efficiency.


Q: Is this device suitable for automotive or industrial temperature ranges?
A: No, its temperature range is -25°C to +85°C, and it is not rated for automotive use; it targets consumer and commercial applications.


Q: What interface protocol does this flash memory use?
A: It uses a serial e-MMC interface, enabling synchronous timing with command compatibility for simplified integration with embedded processors.


Q: How do I handle the 153-ball FBGA package during assembly?
A: It is a surface-mount FBGA with 0.49mm height and 13x11.5mm body; standard BGA reflow profiles are recommended with careful handling due to lead-free ball finish.


Q: What is the erase time and does it support boot block functionality?
A: Maximum erase time is 0.02 seconds, and it features a boot block for secure system startup, along with programmable sectored architecture.


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