KLMBG2JETD-B041003

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KLMBG2JETD-B041003

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  • HerstellerSamsung Electronics

  • Herstellerteil #KLMBG2JETD-B041003

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Attribut Wert
EURoHS Supplier Unconfirmed
ECCN(US) EAR99
PartStatus Active
HTS 8542.32.00.71
Automotive No
PPAP No
ChipDensity(bit) 256G
Architecture Sectored
TimingType Synchronous
InterfaceType Serial e-MMC
MinimumOperatingSupplyVoltage(V) 2.7|1.7
TypicalOperatingSupplyVoltage(V) 1.8|3.3
MaximumOperatingSupplyVoltage(V) 3.6|1.95
MinimumOperatingTemperature(°C) -25
MaximumOperatingTemperature(°C) 85
Mounting Surface Mount
PackageHeight 0.8
PackageWidth 11.5
PackageLength 13

Übersicht

Description

"Introduction to KLMBG2JETD-B041003" likely refers to a specific technical document, product, or project code. Without additional context, it is challenging to provide detailed information. However, the alphanumeric sequence suggests a structured naming convention, possibly indicating a product model, version, or batch number.
1. KLMBG2JETD: This could signify the primary identifier, such as a part number or series name. It might denote a specific category or type of item, like electronics, machinery, or software.
2. B041003: This section may represent a batch, version, or production date code. For example, "B04" could be a batch indicator, and "1003" could relate to a date or sequence.
For a precise introduction, further information about the industry, function, or company associated with KLMBG2JETD-B041003 is necessary. If this is a technical manual or product guide, it will typically cover specifications, usage instructions, and safety information relevant to the item in question.

Equivalent

The KLMBG2JETD-B041003 chip is a Samsung eMMC memory module. Equivalent products would generally be other eMMC modules with similar specifications (e.g., capacity, speed, and form factor) from competitors like Kingston, SanDisk, or Micron. Specific models can vary, but look for those with the same JEDEC eMMC 5.1 standard and similar capacity and performance metrics to ensure compatibility. Always verify the technical specifications and compatibility before considering replacements.

Features

The KLMBG2JETD-B041003 is a model number for a specific type of NAND flash memory, typically used in a range of electronic devices for data storage. Here are some key features:
1. Type: This is a NAND flash memory chip, commonly used for high-density data storage solutions.

2. Capacity: It generally offers substantial storage capacity, which can vary but typically ranges in the gigabytes.
3. Performance: Designed for fast read and write speeds, improving device performance and responsiveness, suitable for applications requiring quick data access and transfer.
4. Durability: NAND flash is known for its durability and long lifespan, capable of withstanding numerous write and erase cycles.
5. Power Efficiency: Low power consumption makes it ideal for mobile and battery-operated devices, enhancing battery life.
6. Applications: Commonly found in smartphones, tablets, SSDs, and other consumer electronics that require reliable data storage.
7. Technology: Utilizes advanced fabrication technology to increase storage density and reduce physical footprint.
These features make the KLMBG2JETD-B041003 a versatile and reliable choice for modern digital storage needs.

Pinout

The KLMBG2JETD-B041 is a BGA (Ball Grid Array) package commonly used for NAND flash memory. While detailed specifications for the KLMBG2JETD-B041 specifically might not be readily available, components like these typically have a pin count ranging from 100 to 200 or more, depending on the specific model and manufacturer.
The primary function of the KLMBG2JETD-B041 is to provide storage capabilities in electronic devices. It serves as a NAND flash memory chip, which is used to store data and files in a non-volatile memory format. This means that it retains data even when the power is turned off, making it suitable for use in smartphones, tablets, and other portable electronics.
For exact pin count and detailed pin functions, it is recommended to consult the datasheet or technical documentation specific to the KLMBG2JETD-B041 from the manufacturer.

Manufacturer

The KLMBG2JETD-B041003 is a product manufactured by Samsung Electronics. Samsung Electronics is a South Korean multinational electronics company and is one of the largest technology companies in the world. It is a subsidiary of the Samsung Group, which is a diversified conglomerate. Samsung Electronics is renowned for its wide range of products, including semiconductors, consumer electronics, home appliances, and telecommunications equipment. The company plays a leading role in the global market for semiconductor manufacturing, making memory chips, system LSI, and displays, among other components.

Application

KLMBG2JETD-B041003 is a model number for Samsung's NAND Flash memory chip, commonly used in various electronic applications. Its primary applications include:
1. Smartphones and Tablets: Provides storage for operating systems, applications, and user data.
2. Laptops and PCs: Used in SSDs for faster boot and data access times.
3. Embedded Systems: Supports IoT devices, automotive systems, and industrial applications for reliable data storage.
4. Consumer Electronics: Found in devices like digital cameras, smart TVs, and gaming consoles for storing firmware and media.
5. Networking Equipment: Utilized in routers and switches for configuration data and logs.
These applications leverage the chip's high-speed data access, durability, and compact size.

Package

The KLMBG2JETD-B041003 is typically a part number for a specific type of NAND flash memory chip used in electronic devices like smartphones and SSDs. It is usually a BGA (Ball Grid Array) package, which is a type of surface-mount packaging used for integrated circuits.

Frequently Asked Questions


Q: What is the storage capacity of the KLMBG2JETD-B041003?
A: It has a chip density of 256G bits, equivalent to 32 GB of raw NAND memory for high-density embedded storage.


Q: What interface does this e-MMC component use?
A: It uses a Serial e-MMC interface with synchronous timing, supporting standard e-MMC protocol for simplified integration.


Q: What are the operating supply voltage ranges?
A: It requires dual supplies: VCC (2.7V-3.6V typical 3.3V) and VCCQ (1.7V-1.95V typical 1.8V) for NAND and controller.


Q: What is the temperature range for reliable operation?
A: The minimum operating temperature is -25°C and maximum is 85°C, suitable for commercial and industrial applications.


Q: Is this component automotive qualified?
A: No, the specification indicates Automotive: No and PPAP: No, so it is intended for consumer/industrial use only.


Q: What is the package size for PCB layout design?
A: It comes in a surface-mount package with dimensions 13mm length, 11.5mm width, and 0.8mm height.


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