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MT53E1G32D2FW-046 WT:B
+StücklisteDRAM LPDDR4 32Gbit 32 200/264 TFBGA 2 WT
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HerstellerMicron
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Herstellerteil #MT53E1G32D2FW-046 WT:B
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Auf Lager14686
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | Tray |
| Standard Pack Qty | 1360 |
Übersicht
Description
Key features of the MT53E1G32D2FW-046 WT:B include enhanced power efficiency, faster data processing speeds, and improved bandwidth. The "WT" refers to the temperature range, indicating it can operate within a specific thermal environment. The advanced fabrication process allows for reduced power consumption while maintaining high-performance standards, making it an ideal choice for devices requiring efficient memory solutions. Micron's LPDDR4X series, including this model, is noted for its robustness and reliability in demanding scenarios.
Equivalent
Features
1. Capacity: 8Gb (Gigabits), organized as 1G x 32.
2. Type: LPDDR4X SDRAM, which stands for Low Power Double Data Rate 4X Synchronous Dynamic Random-Access Memory.
3. Voltage: Operates at a low voltage of 0.6V, ideal for power-efficient applications.
4. Data Rate: Provides high-speed data transfer and is suitable for mobile and embedded applications.
5. Package: Available in a compact FBGA (Fine-pitch Ball Grid Array) package, facilitating high-density board designs.
6. Temperature Range: Designed to operate in a wide temperature range, enhancing reliability in varying environmental conditions.
7. Applications: Commonly used in smartphones, tablets, and other portable devices due to its low power consumption and high performance.
These features make the MT53E1G32D2FW-046 WT:B highly suitable for applications requiring efficient power usage and high-speed data processing.
Pinout
The pin configuration includes data, address, power, ground, control, and clock signals, necessary for the operation of the LPDDR4 interface. Some of the critical functions include handling data read and write operations, addressing, power management, and interfacing with the memory controller. This chip is designed to deliver high performance with low power consumption, supporting features like deep power down and clock stop modes to optimize battery life in mobile devices.
Manufacturer
Application
1. Mobile Devices: Enhances speed and efficiency in smartphones and tablets.
2. Consumer Electronics: Integral in smart TVs, gaming consoles, and advanced wearables.
3. Automotive Systems: Supports advanced driver-assistance systems (ADAS) and infotainment systems.
4. Networking Equipment: Optimizes performance in routers and switches.
5. Data Centers: Utilized in servers for handling large-scale data processing.
These applications benefit from the chip's low power consumption and high-speed operation.