NRF5340-CLAA-R7

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NRF5340-CLAA-R7

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IC RF TXRX+MCU 802.15.4 95WLCSP

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Spezifikationen

Attribut Wert
Part Status Active
Type TxRx + MCU
RF Family / Standard 802.15.4, Bluetooth
Protocol Bluetooth v5.2, Thread, Zigbee®
Frequency 2.4GHz
Data Rate (Max) 2Mbps
Power - Output 3dBm
Sensitivity -97.5dBm
Memory Size 1MB Flash, 256kB RAM
Serial Interfaces ADC, I2S, PWM, SPI, UART, USB
Voltage - Supply 1.7V ~ 5.5V
Current - Receiving 2.6mA ~ 7mA
Current - Transmitting 3.2mA
Operating Temperature -40°C ~ 105°C
Mounting Type Surface Mount
Package / Case 95-XFBGA, WLCSP
Supplier Device Package 95-WLCSP (4.39x3.85)
Digi Key Programmable Not Verified
GPIO 48

Übersicht

Description

The NRF5340-CLAA-R7 is a variant of the nRF5340, a high-performance dual-core system-on-chip (SoC) from Nordic Semiconductor, designed for advanced Bluetooth Low Energy (BLE) applications. It features both an application processor and a network processor, allowing for efficient task separation. The application processor is a 128 MHz Arm Cortex-M33 with DSP instructions, while the network processor is a 64 MHz Arm Cortex-M33, optimized for low-power protocols.
This SoC supports Bluetooth 5.2, including Long Range, High Throughput, and Direction Finding features. Additionally, it supports other wireless protocols such as Thread, Zigbee, and NFC, making it highly versatile for IoT applications.
The NRF5340-CLAA-R7 includes advanced security features, such as Arm TrustZone technology and a crypto cell for hardware-accelerated cryptographic operations. It also comes with ample memory, featuring 512 KB RAM and up to 1 MB flash for the application processor, and 256 KB RAM for the network processor.
Ideal for applications in wearables, smart home devices, and industrial IoT, it provides a robust platform for developing secure, efficient, and feature-rich connected products.

Equivalent

The NRF5340-CLAA-R7 is a dual-core wireless SoC by Nordic Semiconductor, featuring Bluetooth 5.2, advanced security, and low power consumption. Equivalent products include:
1. Dialog Semiconductor DA1469x Series: Offers Bluetooth 5.1, low power, and integrated power management.
2. Silicon Labs EFR32BG22: Supports Bluetooth 5.2, strong security features, and energy efficiency.
3. NXP KW38 Series: Provides Bluetooth 5.0 with additional wireless protocols and robust security.
Each alternative varies in features like power management and protocol support.

Features

The NRF5340-CLAA-R7 is a member of the nRF5340 series, which is known for its dual-processor architecture optimized for complex IoT applications. It features a high-performance application processor with an Arm Cortex-M33 core running at 128 MHz and a network processor with an Arm Cortex-M33 running at 64 MHz. This dual-core setup allows efficient power management and seamless handling of complex tasks.
Key features include Bluetooth 5.2 support, including LE Audio, high-throughput 2 Mbps, long-range capabilities, and advanced security features like Arm TrustZone and CryptoCell-312. It supports multiple wireless protocols, including Zigbee, Thread, and NFC.
The device offers extensive memory options, including 1 MB of flash and 512 KB of RAM. It also has a rich set of peripherals, such as GPIOs, SPI, I2C, and UART interfaces, making it highly versatile for a range of applications. The NRF5340-CLAA-R7 is well-suited for applications demanding high processing power and secure, reliable connectivity, such as smart home devices, wearables, and industrial IoT solutions.

Pinout

The NRF5340-CLAA-R7 is a variant of the nRF5340, which is a dual-core wireless SoC developed by Nordic Semiconductor. It is designed for applications requiring advanced processing and low-power wireless connectivity, such as IoT devices, wearables, and smart home products.
The nRF5340 SoC typically comes in a package with a pin count that varies depending on the specific package type chosen. A common package type for this SoC is the aQFN94, which includes 94 pins. These pins are used for various functions, including power supply, ground connections, digital and analog interfaces, GPIOs, and RF connections.
The SoC features two ARM Cortex-M33 processors: one optimized for high-performance applications and the other for low-power operations. It supports multiple wireless protocols, including Bluetooth Low Energy (BLE), Bluetooth 5.2, NFC, and others, through its advanced RF front-end.
For detailed pin configurations and functions, it is best to consult the manufacturer's datasheet or technical reference manual, which provides comprehensive information regarding each pin's specific role and electrical characteristics.

Manufacturer

The NRF5340-CLAA-R7 is manufactured by Nordic Semiconductor. Nordic Semiconductor is a Norwegian company that specializes in the design and manufacture of semiconductor devices. The company is well-known for its development of wireless communication technologies, particularly those that support Bluetooth Low Energy (BLE), a key technology for IoT (Internet of Things) applications. Nordic's products are widely used in various sectors, including consumer electronics, healthcare, and industrial automation, due to their energy efficiency and reliability.

Application

The NRF5340-CLAA-R7 is a versatile Bluetooth System-on-Chip (SoC) particularly suitable for applications requiring concurrent multiprotocol support and high performance with low power consumption. Key application areas include:
1. Wearables: Smartwatches, fitness trackers, and health monitoring devices.
2. IoT Devices: Smart home devices, industrial IoT sensors, and asset tracking.
3. Audio Devices: Wireless earbuds and hearing aids.
4. Medical Devices: Portable medical equipment and remote patient monitoring.
5. Gaming: Wireless gaming peripherals.
6. Beacons: Location-based services and navigation aids.
Its dual Arm Cortex-M33 processors and advanced security features make it ideal for complex, secure, and efficient applications.

Package

The NRF5340-CLAA-R7 is a QFN (Quad Flat No-leads) package type. It is a compact, surface-mount technology package that provides a small footprint and good thermal performance, ideal for space-constrained applications in electronics.

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