STGB19NC60KDT4

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STGB19NC60KDT4

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IGBT 600V 35A D2PAK

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Attribut Wert
Series PowerMESH™
Part Status Active
Base Product Number STGB19
Voltage - Collector Emitter Breakdown (Max) 600 V
Current - Collector (Ic) (Max) 35 A
Current - Collector Pulsed (Icm) 75 A
Vce(on) (Max) @ Vge, Ic 2.75V @ 15V, 12A
Power - Max 125 W
Switching Energy 165µJ (on), 255µJ (off)
Input Type Standard
Gate Charge 55 nC
Td (on / off) @ 25°C 30ns/105ns
Test Condition 480V, 12A, 10Ohm, 15V
Reverse Recovery Time (trr) 31 ns
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Supplier Device Package D2PAK
Packaging Cut Tape (CT), Tape & Reel (TR)

Übersicht

Description

The STGB19NC60KDT4 is a silicon carbide (SiC) MOSFET, a type of semiconductor device used in power electronics. SiC MOSFETs are known for their high efficiency, high voltage capability, and fast switching speeds compared to traditional silicon-based MOSFETs. This makes them ideal for applications requiring high power density and improved thermal performance, such as inverters for solar panels, electric vehicles, and industrial power supplies.
Key features of the STGB19NC60KDT4 include low on-resistance, high temperature operation, and robust short-circuit capability. These attributes contribute to reduced power losses and improved system efficiency. Additionally, the device is designed to handle high frequencies, which helps in reducing the size of passive components in power circuits, leading to more compact and efficient designs.
Overall, the STGB19NC60KDT4 represents a significant advancement in power electronics, offering enhanced performance and reliability for a wide range of demanding applications.

Equivalent

The STGB19NC60KDT4 is an IGBT (Insulated Gate Bipolar Transistor) commonly used in power electronics. Equivalent products might include:
1. Infineon IGBT models with similar voltage and current ratings.
2. Mitsubishi Electric IGBT modules with matching specifications.
3. Fairchild/ON Semiconductor IGBT with comparable ratings.
4. Fuji Electric IGBT models with similar electrical characteristics.
For a precise match, check datasheets to confirm voltage, current, switching speed, and package type.

Features

The STGB19NC60KDT4 is a silicon carbide power MOSFET designed for high-efficiency and high-power applications. Here are some key features:
1. Voltage and Current Ratings: Typically, it has a high voltage rating of around 600V, making it suitable for handling high-power operations efficiently.
2. Low On-Resistance: This feature ensures lower conduction losses, improving the overall efficiency of power conversion systems.
3. High-Speed Switching: Silicon carbide technology allows for rapid switching, which reduces switching losses and improves performance in applications like inverters and converters.
4. Thermal Performance: The device exhibits excellent thermal performance, capable of operating at higher temperatures compared to traditional silicon-based devices.
5. Ruggedness and Reliability: It offers robust performance with high reliability, making it ideal for demanding industrial and automotive applications.
6. Compact Packaging: The device is usually packaged in a compact form factor, facilitating easy integration into various systems without occupying much space.
7. Applications: Commonly used in renewable energy systems, electric vehicle chargers, power supply units, and motor drives.
These features make the STGB19NC60KDT4 a popular choice for high-performance and efficient power management solutions.

Pinout

The STGB19NC60KDT4 is a silicon power IGBT, which is a type of transistor used for switching and amplification in electronic circuits. It typically comes in a TO-263 package, also known as D²PAK, which has 3 pins.
1. Pin 1 (Gate): This pin is used to control the opening and closing of the IGBT. A voltage applied to the gate controls the current flow between the collector and emitter.
2. Pin 2 (Collector): This pin is the main current input of the device. When the IGBT is turned on via the gate, current flows from the collector to the emitter.
3. Pin 3 (Emitter): This is the main current output, serving as the path through which current exits the device.
The primary function of this IGBT is in high-efficiency, high-speed switching applications, often found in power supplies, motor drives, and other power conversion systems.

Manufacturer

The STGB19NC60KDT4 is manufactured by STMicroelectronics. STMicroelectronics is a multinational electronics and semiconductor manufacturer. The company is headquartered in Geneva, Switzerland, and is one of the world's largest semiconductor companies. It designs, develops, and produces a wide range of semiconductor products, including microcontrollers, sensors, power devices, and integrated circuits. STMicroelectronics serves various industries, including automotive, industrial, personal electronics, and communications equipment. Known for its innovation, the company provides solutions that enable smarter mobility, more efficient power and energy management, and the widespread deployment of the Internet of Things (IoT) and 5G technology.

Application

The STGB19NC60KDT4 is an insulated gate bipolar transistor (IGBT) commonly used in various applications requiring efficient power switching. Its primary application areas include:
1. Industrial Motor Drives: Used for controlling electric motors in factories and industrial settings.
2. Power Inverters: Utilized in converting DC to AC power, especially in renewable energy systems like solar and wind.
3. Uninterruptible Power Supplies (UPS): Helps in providing backup power during outages.
4. Electric Vehicle Systems: Employed in power management and motor control.
5. HVAC Systems: Used in heating, ventilation, and air conditioning for efficient energy use.
These applications benefit from the IGBT's high efficiency and fast switching capabilities.

Package

The STGB19NC60KDT4 is an Insulated Gate Bipolar Transistor (IGBT) with a D²PAK (TO-263) package type. This package is a surface-mount device designed for efficient thermal performance and compact size, commonly used in power management applications.

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