XC7Z014S-1CLG400C

Abbildungen dienen nur als Referenz

XC7Z014S-1CLG400C

+Stückliste

IC SOC CORTEX-A9 667MHZ 400BGA

  • HerstellerAMD

  • Herstellerteil #XC7Z014S-1CLG400C

  • Auf Lager4120

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Artix™-7 FPGA, 65K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 400-LFBGA, CSPBGA
Supplier Device Package 400-CSPBGA (17x17)
Base Product Number XC7Z014

Übersicht

Description

The XC7Z014S-1CLG400C is a member of the Xilinx Zynq-7000 family of All Programmable SoCs, featuring a combination of ARM processing and FPGA technology. This particular model integrates a dual-core ARM Cortex-A9 processor with Xilinx's programmable logic, offering a flexible and powerful solution for a wide range of applications. The device is housed in a 400-pin CLG (chip-scale) package and is designed for low-power and high-performance operations.
Key features include up to 85k logic cells, advanced I/O capabilities, and support for high-speed connectivity interfaces. This makes it suitable for applications in industrial automation, automotive, medical devices, and more. The integration of processing and programmable logic allows for efficient handling of complex algorithms, real-time data processing, and custom hardware acceleration.
The XC7Z014S-1CLG400C is supported by Xilinx's comprehensive development tools, including the Vivado Design Suite, which facilitates hardware and software design, simulation, and debugging. This combination of resources enables rapid prototyping and deployment of sophisticated embedded systems.

Equivalent

The XC7Z014S-1CLG400C is part of Xilinx's Zynq-7000 series, featuring a combination of dual-core ARM Cortex-A9 processors with FPGA logic. Equivalent products might include other Zynq-7000 series chips like the XC7Z010 or XC7Z020, depending on specific application requirements. Alternative products from other vendors could include Intel's Cyclone V SoC or Microchip's PolarFire SoC, which also integrate ARM processors with FPGA fabric. However, direct equivalence will depend on the specific use case and required features.

Features

The XC7Z014S-1CLG400C is part of the Xilinx Zynq-7000 SoC family, combining programmable logic with a dual-core ARM Cortex-A9 processor. Key features include:
1. Processor System: Dual-core ARM Cortex-A9 MPCore with NEON extensions, operating at up to 866 MHz.
2. Programmable Logic: Contains Xilinx 7 series FPGA fabric, allowing custom hardware design.
3. Memory Interfaces: DDR3, DDR3L, LPDDR2 support with integrated memory controller.
4. I/O Interfaces: Multiple I/O standards, including high-speed serial transceivers, USB, Ethernet, and CAN.
5. Package: Housed in a 400-ball BGA package.
6. Power Management: Integrated power management features for efficient energy use.
7. Security: On-chip security features, including secure boot and encryption.
8. Development Tools: Supported by Xilinx Vivado Design Suite and SDK for software and hardware co-development.
This device is ideal for applications requiring a combination of processing power and FPGA flexibility, such as industrial automation, automotive, and embedded systems.

Pinout

The XC7Z014S-1CLG400C is part of the Xilinx Zynq-7000 family of SoCs. It is a versatile device designed for applications requiring a combination of processing power and programmable logic. The device comes in a CLG400 package, which has 400 pins.
The function of the XC7Z014S-1CLG400C integrates a dual-core ARM Cortex-A9 processor with the 28nm Xilinx programmable logic, enabling both software and hardware programmability. This makes it suitable for applications that require real-time processing and parallel execution, such as automotive, industrial, and communication systems.
In summary, the XC7Z014S-1CLG400C has 400 pins and serves as a hybrid processing platform combining ARM processing with FPGA programmability, allowing for high flexibility in system design and implementation.

Manufacturer

The XC7Z014S-1CLG400C is manufactured by Xilinx, Inc., which is a company that specializes in the design and development of programmable logic devices. Xilinx is well-known for its field-programmable gate arrays (FPGAs), which are integrated circuits designed to be configured by the customer or designer after manufacturing. These devices are used in a wide range of applications, including telecommunications, data centers, automotive, aerospace, and defense, among others. Xilinx's products are pivotal in enabling adaptive and intelligent computing across various industries. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company that develops computer processors and related technologies for business and consumer markets.

Application

The XC7Z014S-1CLG400C is part of the Xilinx Zynq-7000 SoC series, which integrates a dual-core ARM Cortex-A9 processor with 28nm programmable logic. It is commonly used in applications requiring high processing power combined with flexibility, such as:
1. Embedded Systems: Ideal for industrial automation, robotics, and automotive systems due to its processing capabilities and real-time performance.

2. Communications: Supports wireless infrastructure and wired communication systems through its customizable interfaces.

3. Medical Imaging: Offers the processing power needed for high-resolution imaging and data processing.

4. Aerospace and Defense: Suitable for applications requiring reliability and high performance under demanding conditions.
Overall, it is well-suited for applications needing a combination of software programmability and hardware optimization.

Package

The XC7Z014S-1CLG400C is a System-on-Chip (SoC) from Xilinx's Zynq-7000 family. It features a CLG400 package type, which denotes a 400-ball fine-pitch Ball Grid Array (BGA) package. This package type is designed to accommodate the integration of both the FPGA fabric and ARM processor cores, providing a compact and efficient solution for embedded systems.