XC7Z020-2CLG400E

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XC7Z020-2CLG400E

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IC SOC CORTEX-A9 766MHZ 400BGA

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  • Herstellerteil #XC7Z020-2CLG400E

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Spezifikationen

Attribut Wert
Series Zynq®-7000
Part Status Active
Base Product Number XC7Z020
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 766MHz
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 400-LFBGA, CSPBGA
Supplier Device Package 400-CSPBGA (17x17)
Packaging Tray

Übersicht

Equivalent

The XC7Z020-2CLG400E, a Zynq-7000 SoC, has equivalents like:
- XC7Z010-1CLG400C (lower specs)
- XC7Z030-1SBG485C (higher specs)
- Altera Cyclone V SE (5CSEBA6U23I7) (Intel alternative)
- Microchip PolarFire SoC MPFS250T (RISC-V alternative)
For exact replacements, check Xilinx's (now AMD) product tables or distributors like Digi-Key/Mouser.

Features

The XC7Z020-2CLG400E is a Zynq-7000 SoC from Xilinx (now AMD), combining an ARM Cortex-A9 dual-core processor with FPGA logic. Key features:
- Processor: Dual-core ARM Cortex-A9 @ 667MHz (with NEON, FPU).
- FPGA Logic: 85K logic cells, 4.9Mb BRAM, 220 DSP slices.
- Memory: Supports DDR3, DDR2, LPDDR2 (up to 1GB).
- I/O: 400-pin CLG400 package, 200+ user I/Os (supports LVDS, LVCMOS).
- Peripherals: Gigabit Ethernet, USB 2.0, UART, SPI, I2C, CAN, SD/SDIO.
- On-Chip ADC: XADC for monitoring.
- Power: 0.85V–1.0V core voltage, ~2W typical power.
- Applications: Embedded vision, motor control, IoT, industrial automation.
Compact, power-efficient, and versatile for embedded designs.

Pinout

The XC7Z020-2CLG400E is a Zynq-7000 SoC from Xilinx (now AMD), integrating a dual-core ARM Cortex-A9 processor with FPGA fabric.
- Pin Count: 400 pins (CLG400 package).
- Key Functions:
- Processing System (PS): Dual-core ARM Cortex-A9 (up to 766 MHz), DDR3/LPDDR2 memory controllers, peripherals (USB, UART, SPI, I2C, GPIO).
- Programmable Logic (PL): 85K logic cells, 4.9 Mb BRAM, 220 DSP slices.
- Interfaces: Gigabit Ethernet, PCIe Gen2, CAN, SD/SDIO.
- I/O Support: LVDS, LVCMOS, HSTL, SSTL.
Used in embedded systems requiring high-performance processing and flexible logic.

Manufacturer

The XC7Z020-2CLG400E is manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and SoCs (System-on-Chips). The XC7Z020-2CLG400E is part of the Zynq-7000 family, combining an FPGA with an ARM Cortex-A9 processor for embedded applications.
Xilinx (now AMD) is known for high-performance, flexible solutions used in industries like telecommunications, automotive, aerospace, and AI.

Application

The XC7Z020-2CLG400E, a Zynq-7000 SoC from Xilinx (now AMD), integrates dual-core ARM Cortex-A9 processors with FPGA logic. Key application areas include:
- Embedded Systems: Industrial automation, robotics, and IoT edge devices.
- Automotive: ADAS, infotainment, and vehicle networking.
- Communications: Software-defined radio (SDR), baseband processing.
- Consumer Electronics: Smart cameras, drones, and multimedia processing.
- Medical Devices: Portable diagnostics and imaging systems.
Its hybrid architecture enables high-performance processing with flexible programmability, making it ideal for real-time, low-power, and high-reliability applications.

Package

The XC7Z020-2CLG400E is packaged in a 400-pin Ceramic Fine-Pitch Ball Grid Array (FBGA), designated as CLG400. This package is lead-free, RoHS-compliant, and features a 0.8mm ball pitch, suitable for high-performance embedded applications. The "E" suffix indicates an extended industrial temperature range (-40°C to +100°C).

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