Abbildungen dienen nur als Referenz
XC7Z020-2CLG400I
+StücklisteIC SOC CORTEX-A9 766MHZ 400BGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC7Z020-2CLG400I
-
Paket CSBGA-400
-
Auf Lager1912
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 766MHz |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
- Dual-core ARM Cortex-A9, running up to 866 MHz
- Programmable logic equivalent to Artix-7 FPGAs
- 85k logic cells, 220 DSP slices, and 560 KB of block RAM
- 133 I/O pins
- Comprehensive set of peripherals, including USB, Ethernet, and CAN
- Advanced power management and security features
This device is suitable for a range of applications, from embedded systems to high-performance computing in sectors such as automotive, industrial, and telecommunications. Its ability to integrate software and hardware on a single chip allows for optimized performance, reduced power consumption, and lower system cost.
Equivalent
Features
1. Processor System: Dual-core ARM Cortex-A9 MPCore with NEON extensions and a rich set of peripherals.
2. Programmable Logic: Equivalent of 85K logic cells, approximately 430K system gates.
3. Memory: 220 DSP slices and 560 KB Block RAM.
4. I/O: 200 user I/O pins.
5. Interfaces: Supports various interfaces, including USB, Ethernet, and UART.
6. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C.
7. Package: CLG400 package with a compact footprint suitable for space-constrained applications.
8. Power Management: Advanced power management features for efficient energy use.
9. Applications: Ideal for applications in automotive, industrial, and consumer electronics where both high processing power and flexible logic are required.
This SoC provides a powerful platform for embedded system design, offering both processing capabilities and programmable logic in a single device.
Pinout
Key functions include:
1. Processor System (PS): Includes a dual-core ARM Cortex-A9 processor, interfaces for external memory, and various connectivity peripherals like USB, Ethernet, and UART.
2. Programmable Logic (PL): Provides the FPGA fabric with configurable logic blocks, DSP slices, block RAM, and I/O pins for designing custom hardware accelerators and peripherals.
3. Interconnect: Offers high-bandwidth communication between the PS and PL, enabling efficient data exchange.
4. I/O Capabilities: The package provides numerous general-purpose I/O pins, specific interface pins for DDR memory, and high-speed connectivity options.
This configuration allows the XC7Z020-2CLG400I to be used in a wide range of applications from embedded systems to complex digital signal processing tasks.
Manufacturer
Xilinx was founded in 1984 and has been a leader in the semiconductor industry, known for pioneering the development of FPGAs. FPGAs are integrated circuits that can be configured by the customer or designer after manufacturing, allowing for flexible and adaptable hardware solutions that can be optimized for specific tasks or applications.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another major player in the semiconductor industry known for its processors and graphics technologies. This acquisition was completed in early 2022, and Xilinx now operates as part of AMD, expanding AMD's portfolio and capabilities in adaptive computing and embedded processing solutions.
Application
1. Embedded Systems: Used in industrial control, automotive infotainment, and robotics.
2. Digital Signal Processing: Ideal for applications like software-defined radio, video processing, and medical imaging.
3. IoT and Smart Devices: Suitable for edge computing and connected devices.
4. Networking and Communication: Used in network interface cards and communication infrastructure.
This versatility makes it suitable for a wide range of high-performance, low-power applications.