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XC7Z020-2CLG484I
+StücklisteIC SOC CORTEX-A9 766MHZ 484BGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7Z020-2CLG484I
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Paket CSBGA-484
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Auf Lager2384
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 766MHz |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. ARM Cortex-A9 Processor: Dual-core, up to 866 MHz, providing robust computational power.
2. FPGA Fabric: Contains 85,000 logic cells, supporting custom hardware acceleration.
3. I/O Capabilities: Comes in a CLG484 package with 484 pins, offering extensive I/O options for interfacing.
4. DSP Slices and Block RAM: Includes 220 DSP slices and 4.9 Mb of block RAM for intensive processing tasks.
5. Industrial Grade: The 'I' in its part number indicates it's designed for industrial temperature ranges.
This device is commonly used in applications like automotive, industrial automation, and video processing due to its integration of programmable logic and processor cores in a single chip.
Equivalent
1. Xilinx Zynq-7000 series (similar models with different packages/speed grades).
2. Intel Cyclone V SoC series (for comparable ARM+FPGA integration).
3. Microchip PolarFire SoC (FPGA with embedded RISC-V cores).
4. Altera (now Intel) Arria V SoC series for similar applications.
These alternatives vary by specific application requirements and should be evaluated based on performance, power, and cost needs.
Features
1. Processor System: Dual-core ARM Cortex-A9 MPCore, integrated with NEON and FPU, running up to 866 MHz.
2. Programmable Logic: Approximately 85,000 logic cells, offering significant flexibility for custom hardware acceleration and parallel processing.
3. Memory: 220 DSP slices, 560 KB of block RAM, and support for DDR3, DDR3L, LPDDR2, and DDR2 memory interfaces.
4. Connectivity: Multiple connectivity options, including USB 2.0, Gigabit Ethernet, and high-speed serial connectivity.
5. Package and Temperature: CLG484 package; industrial temperature range (-40°C to +100°C).
6. I/O: 200 user I/Os for versatile connectivity to a wide range of peripherals.
These features make the XC7Z020-2CLG484I well-suited for applications requiring a combination of high-performance processing, custom logic, and wide-ranging connectivity, such as automotive, industrial, and communication systems.
Pinout
The device's pin functionalities include:
1. Power Supply Pins: For core, I/O banks, DDR, and auxiliary voltage supplies.
2. Configuration Pins: Used for initializing and configuring the device.
3. I/O Pins: General-purpose I/O pins that can be configured for various interfaces.
4. Clock Pins: For supplying clock signals to the device.
5. Dedicated Pins: For specific functions such as JTAG and multi-gigabit transceivers.
6. Memory Interface Pins: For connecting to external DDR3/DDR2 memory.
7. Peripheral Interface Pins: Support for communication protocols like SPI, I2C, UART, CAN, and Ethernet.
These pin functionalities enable the Zynq-7000 SoC to be used in diverse applications, offering flexibility through its combination of processing and programmable logic resources.
Manufacturer
Xilinx operates as part of the semiconductor industry and has a significant impact on enabling innovation across a broad set of industries due to the versatility and adaptability of their programmable technologies. As of October 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another major player in the semiconductor space known for its CPUs and GPUs, expanding AMD's product offerings and market reach.
Application
1. Embedded Systems: Used for customizable embedded solutions with real-time processing needs.
2. Industrial Automation: Suitable for control systems and robotics due to its processing power and flexibility.
3. Telecommunications: Used in modems and baseband processing for enhanced signal handling.
4. Automotive Systems: Supports advanced driver-assistance systems (ADAS) and infotainment.
5. Medical Devices: Powers imaging systems and diagnostic equipment requiring real-time data processing.
6. Consumer Electronics: Used in smart devices and entertainment systems for multimedia processing.