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XCF04SVOG20C
+StücklisteIC PROM SRL FOR 4M GATE 20-TSSOP
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HerstellerAMD
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Herstellerteil #XCF04SVOG20C
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Auf Lager3599
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Part Status | Obsolete |
| Base Product Number | XCF04 |
| DigiKey Programmable | Verified |
| Programmable Type | In System Programmable |
| Memory Size | 4Mb |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package | 20-TSSOP (0.173", 4.40mm Width) |
| Supplier Device Package | 20-TSSOP |
| Packaging | Tube |
Übersicht
Description
One of the key features of the XCF04SVOG20C is its ability to retain data even when power is removed, which is essential for ensuring that the FPGA can be quickly and accurately programmed upon startup. It also supports multiple reprogramming cycles, providing flexibility for iterative design processes. The "VOG20C" in the name often refers to specific packaging and temperature range specifications, which can be critical depending on the intended application. This PROM is frequently used in applications where reliable and efficient FPGA configuration is required, such as in embedded systems, telecommunications, and industrial automation.
Equivalent
Features
1. Storage Capacity: It usually has a storage capacity of 4 megabits, suitable for storing configuration data for FPGAs.
2. Architecture: It uses a Flash-based memory structure, which allows for non-volatile storage, meaning the data is retained even when power is lost.
3. Interface: The device commonly supports a Serial Peripheral Interface (SPI), enabling easy communication with other components and systems.
4. Reliability: It provides a high level of data retention and endurance, crucial for long-term and repeated use in various applications.
5. Package: It is often available in a compact 20-pin VQFN package, facilitating efficient use of PCB space.
6. Temperature Range: Designed to operate effectively across a wide temperature range, suitable for diverse applications.
7. Security: It may include basic security features to protect the stored configuration data from unauthorized access or tampering.
These features make it a versatile choice for FPGA configuration needs.
Pinout
The key functions of the pins in this package are:
1. Power and Ground: A few pins are dedicated for power supply (VCC) and ground (GND).
2. Configuration Interface: Includes pins for JTAG (Joint Test Action Group) interface such as TCK (Test Clock), TDI (Test Data In), TDO (Test Data Out), and TMS (Test Mode Select) for programming and testing.
3. Control and Clock: Pins for control signals like CCLK (Configuration Clock) and appropriate enable signals.
4. I/O Pins: For communication and data transfer, which might include D0 (Data) and similar pins for handling configuration data.
This device is mainly used for non-volatile storage of FPGA configuration data, enabling the FPGA to be configured upon power-up or reset.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company known for its CPUs, GPUs, and other computer hardware. The acquisition was completed in 2022, allowing AMD to expand its product offerings and enter new markets with Xilinx’s expertise in FPGAs and adaptive computing. As a result, Xilinx now operates as a subsidiary of AMD, continuing to develop cutting-edge programmable logic solutions while benefiting from AMD's extensive resources and market presence.
Application
Package
Frequently Asked Questions
Q: What is the memory size of the XCF04SVOG20C?
A: It has a 4Mb (megabit) memory capacity, suitable for storing FPGA configuration data in moderate-complexity designs.
Q: Is this device in-system programmable?
A: Yes, it supports in-system programming (ISP), allowing configuration updates without removal from the PCB.
Q: What is the operating voltage range for this part?
A: The supply voltage range is 3V to 3.6V, making it compatible with 3.3V logic systems.
Q: What is the operating temperature range?
A: It operates from -40°C to 85°C, suitable for industrial temperature environments.
Q: What package does this component use?
A: It comes in a 20-lead TSSOP package (0.173" width, 4.40mm), surface-mount, with supplier device package 20-TSSOP.
Q: Is the XCF04SVOG20C still in active production?
A: According to its specifications, the part status is marked as "Obsolete." Please verify current availability with your supplier.