XCZU19EG-2FFVD1760I

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XCZU19EG-2FFVD1760I

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IC SOC CORTEX-A53 1760FCBGA

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  • Herstellerteil #XCZU19EG-2FFVD1760I

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Attribut Wert
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Base Product Number XCZU19

Übersicht

Description

The XCZU19EG-2FFVD1760I is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) from Xilinx, designed for advanced computing applications. It combines a powerful ARM Cortex-A53 quad-core processor with a dual-core ARM Cortex-R5 processor for real-time processing. The device features an FPGA fabric that allows for custom hardware acceleration, making it ideal for applications in telecommunications, automotive, aerospace, and industrial automation.
With 19K logic cells, 1.6 MB of block RAM, and 4.5 Mb of UltraRAM, it supports complex algorithms and high-speed data processing. The XCZU19EG also includes multiple high-speed transceivers, enabling fast communication and data transfer rates. It operates at a temperature range suitable for industrial applications and supports various I/O standards.
Designed for flexibility and scalability, the XCZU19EG-2FFVD1760I allows developers to implement sophisticated designs with reduced latency and enhanced performance, making it a preferred choice for cutting-edge technology solutions.

Equivalent

The XCZU19EG-2FFVD1760I is part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU19EG-2FFVC1760I and XCZU19EG-2FFVF1760I, which may differ in package or speed grade. Additionally, products from similar families like the XCZU17EG or XCZU21EG can serve similar functions but vary in performance and features. Always verify specific application requirements and compatibility for exact replacements.

Features

The XCZU19EG-2FFVD1760I is a part of Xilinx's Zynq UltraScale+ MPSoC family, featuring a heterogeneous architecture that combines a processor system with programmable logic. Key features include:
- Processing System: Dual-core ARM Cortex-A53 and a real-time ARM Cortex-R5 processor for efficient multitasking and control.
- FPGA Fabric: Includes 1,024 LUTs, 2,048 flip-flops, and 60 DSP slices for high-performance digital signal processing and custom logic implementation.
- Memory Support: Supports DDR4 and LPDDR4 memory interfaces for high bandwidth.
- I/O Capabilities: Offers a wide range of I/O options, including high-speed transceivers, GPIO, and programmable IO standards.
- Power Efficiency: Designed for low power consumption, making it suitable for embedded applications.
- Thermal Management: Operates efficiently in various temperature ranges.
This device is ideal for applications in communications, automotive, industrial, and more, combining the flexibility of FPGA with the power of a multi-core processor.

Pinout

The XCZU19EG-2FFVD1760I is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a total of 1760 pins. The device is designed for high-performance applications and integrates a multi-core ARM Cortex-A53, a dual-core ARM Cortex-R5, and programmable logic (FPGA) resources.
The pin functions include:
- Power supply pins (VCC, GND)
- I/O pins for general-purpose input/output (GPIO)
- Configuration pins for JTAG and other programming interfaces
- High-speed serial transceivers for communication protocols like PCIe, Gigabit Ethernet, etc.
- Analog and digital signal processing capabilities
- Dedicated pins for memory interfaces (DDR, etc.)
This combination of features makes the XCZU19EG suitable for a wide range of applications, including embedded systems, data processing, and advanced control systems.

Manufacturer

The manufacturer of the XCZU19EG-2FFVD1760I is Xilinx, Inc. Xilinx is a semiconductor company known for its development of Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and adaptive compute acceleration platforms. Founded in 1984, Xilinx has been a pioneer in reprogrammable hardware technology, enabling engineers to develop customized solutions for various applications.
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), expanding AMD's portfolio to include Xilinx's adaptive computing solutions, which cater to markets such as data centers, automotive, industrial, and communications. Xilinx products, such as the XCZU19EG, are widely used for applications requiring high performance, flexibility, and efficiency, including artificial intelligence, machine learning, and high-speed networking. The company is recognized for its innovation in the semiconductor industry, making it a key player in the field of programmable logic devices.

Application

The XCZU19EG-2FFVD1760I, part of Xilinx's Zynq UltraScale+ MPSoC family, is designed for high-performance applications in areas such as industrial automation, robotics, automotive, medical imaging, and telecommunication. Its capabilities support advanced processing tasks in edge computing, machine learning, video processing, and high-speed data acquisition. The integration of programmable logic with ARM Cortex-A53 and Cortex-R5 cores allows for flexible, real-time processing in demanding environments. This versatility makes it suitable for applications requiring both high computational power and customizable hardware acceleration.

Package

The XCZU19EG-2FFVD1760I is packaged in a FFVD1760 (VFBGA) form factor, which features a ball grid array (BGA) design with 1760 balls. This package type enables high-density interconnections and is commonly used in high-performance applications.