Part A
10M25DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4600 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M25DAF256I7G and 10M25DCF256A7G are both Intel MAX 10 FPGA devices sharing the same 25,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable in many designs. However, the 10M25DCF256A7G is a commercial-grade, single-supply device with integrated analog-to-digital converter capability, while the 10M25DAF256I7G is an industrial-grade, dual-supply device without ADC functionality. Designers must validate power supply architecture, thermal operating range, and ADC requirements before substituting.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Supply Voltage
Not compatible
Parts at a glance
Part B
10M25DCF256A7G
Intel
- Lifecycle
- Active
- Stock
- 5194 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF256I7G | 10M25DCF256A7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 25,000 | 25,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package and pin count allow the same PCB footprint and board layout to be reused. |
| Temperature Grade | Industrial (I) | Automotive (A) | The temperature grade suffix determines the operating range and qualification level; industrial and automotive grades are not interchangeable in all applications. |
| Speed Grade | 7 | 7 | The speed grade affects maximum operating frequency and timing closure; matching grades preserves performance characteristics. |
| Feature Variant | DA (Analog + Flash) | DC (Compact Flash) | The feature variant letter indicates differences in integrated features such as analog-to-digital converters and flash configuration options, which directly affect functional substitutability. |
| Integrated ADC | Yes | No | The presence of an integrated ADC in the DA variant enables analog signal acquisition without external components, which the DC variant cannot provide. |
| Configuration Flash | Yes | Yes | Both variants include on-chip configuration flash, allowing single-chip operation without external configuration memory. |
| Supply Voltage | 1.2 V core | 1.2 V core | Matching core supply voltage ensures compatibility with the same power delivery design. |
| RoHS Compliance | Yes | Yes | Both parts meet RoHS requirements, which is important for regulatory compliance in most markets. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF256I7G | 10M25DCF256A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the 10M25DAF256I7G and 10M25DCF256A7G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 256-ball FineLine BGA (FBGA) package. The 10M25DAF256I7G is a dual-supply, instant-on, non-volatile FPGA with 25,000 logic elements, while the 10M25DCF256A7G is a single-supply variant of the same MAX 10 25K LE family in the same 256-ball FBGA package.
What is the difference between the "DA" and "DC" suffixes in these part numbers?
In Intel MAX 10 ordering codes, the "DA" and "DC" designators indicate different feature/configuration options within the same 25K logic element family. The 10M25DAF256I7G uses the dual-supply analog and flash feature set, while the 10M25DCF256A7G uses the single-supply configuration. Designers must confirm the exact feature set in the Intel MAX 10 device datasheet before substituting one for the other.
Do the 10M25DAF256I7G and 10M25DCF256A7G have the same package and pinout?
Yes. Both devices are offered in the 256-ball FineLine BGA (FBGA) package with the same 256-pin footprint. However, pin function assignments can differ between the DA and DC variants, so the pinout must be verified against the specific device pin-out files from Intel before layout or replacement.
What is the difference in operating temperature range between the two parts?
The 10M25DAF256I7G is specified with the "I7" speed grade and industrial temperature range, while the 10M25DCF256A7G carries the "A7" speed grade and automotive temperature range. The industrial and automotive temperature grades differ in their qualified ambient temperature limits, so the target application's thermal requirements must be checked against the Intel MAX 10 datasheet.
Can the 10M25DAF256I7G and 10M25DCF256A7G be used interchangeably in the same design?
Not automatically. Although both are 25K logic element MAX 10 FPGAs in the same 256-ball FBGA package, they differ in supply configuration, speed grade, and temperature grade. A direct substitution requires validating the power supply scheme, timing closure at the applicable speed grade, and thermal margin against the Intel MAX 10 device datasheet and pin-out files.
What logic capacity do the 10M25DAF256I7G and 10M25DCF256A7G provide?
Both devices belong to the Intel MAX 10 25K logic element family, providing approximately 25,000 logic elements (LEs). They also integrate non-volatile flash configuration memory, which allows instant-on operation without an external configuration device.
Which configuration methods are supported by these MAX 10 devices?
Intel MAX 10 devices, including the 10M25DAF256I7G and 10M25DCF256A7G, support internal configuration from on-chip flash, as well as external configuration via JTAG and other supported configuration schemes. The exact configuration options and supported modes should be confirmed in the Intel MAX 10 General Purpose I/O and configuration user guides.
Are the 10M25DAF256I7G and 10M25DCF256A7G RoHS compliant?
Intel MAX 10 devices in the 256-ball FBGA package are generally offered as RoHS-compliant lead-free packages. The specific compliance status, including any exemptions, must be verified from the Intel product material declaration or the distributor's product page for each ordering code.