Part A
10M25DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4600 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M25DAF256I7G and 10M25DCF256I6G are both Intel MAX 10 FPGA devices sharing the same 25K logic element density and 256-ball FineLine BGA package, making them functionally interchangeable in most designs. The primary distinction lies in their speed grade and operating temperature range, which may affect timing closure and thermal margins in demanding applications. Designers should validate timing performance and thermal requirements before committing to a drop-in substitution.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M25DCF256I6G
Intel
- Lifecycle
- Active
- Stock
- 8451 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF256I7G | 10M25DCF256I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 25,000 | 25,000 | Identical logic density means both parts can implement the same logic design without resource constraints. |
| Package | 256-pin FBGA | 256-pin FBGA | Matching package and pin count ensures the same PCB footprint and pinout compatibility. |
| On-chip Flash (Configuration Memory) | Dual Configuration (DA) | Compact Configuration (DC) | The configuration flash variant determines whether the device supports dual-boot images or only a single compact image, affecting in-field update flexibility. |
| Temperature Grade | Industrial (I7) | Industrial (I6) | Both are industrial grade, but the speed grade suffix differs, which can affect timing closure and maximum operating frequency. |
| Speed Grade | 7 (faster) | 6 (slower) | A faster speed grade allows higher clock frequencies and tighter timing margins, which may be required for certain designs. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be reused. |
| I/O Standards Supported | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | Identical I/O standard support ensures both devices can interface with the same external components and voltage levels. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | Same temperature range means both parts are suitable for the same environmental conditions. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF256I7G | 10M25DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the 10M25DAF256I7G and 10M25DCF256I6G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 256-pin FineLine BGA (FBGA) package. The 10M25DAF256I7G is a dual-supply, non-volatile MAX 10 device with 25,000 logic elements (LEs), while the 10M25DCF256I6G is a single-supply, non-volatile MAX 10 device with the same 25,000 LE count. The suffix codes indicate speed grade, temperature grade, and package options.
What is the difference between the "DA" and "DC" prefixes in these part numbers?
The "DA" in 10M25DAF256I7G indicates a dual-supply MAX 10 device, which requires both 1.2 V core and 2.5 V/3.3 V I/O supplies. The "DC" in 10M25DCF256I6G indicates a single-supply MAX 10 device, which operates from a single 3.3 V supply with an integrated regulator. This difference affects power supply design, board layout, and external component count.
What do the speed grade and temperature grade suffixes indicate?
In 10M25DAF256I7G, the "7" denotes a speed grade of 7 (faster) and the "I" denotes industrial temperature range (-40°C to +100°C junction). In 10M25DCF256I6G, the "6" denotes a speed grade of 6 (slower) and the "I" also denotes industrial temperature range. Speed grade affects maximum operating frequency and timing closure.
Are the 10M25DAF256I7G and 10M25DCF256I6G pin-compatible?
Both devices use the same 256-pin FBGA package (256-ball FineLine BGA, 17 mm × 17 mm). However, pin compatibility is not guaranteed because the dual-supply and single-supply variants may have different power pin assignments and I/O bank configurations. Designers must verify pinouts against the respective Intel MAX 10 device pin-out files before considering a swap.
Can the 10M25DAF256I7G directly replace the 10M25DCF256I6G in an existing design?
No, a direct replacement is not possible without design changes. The dual-supply device requires additional power rails (1.2 V core and 2.5 V/3.3 V I/O), while the single-supply device operates from a single 3.3 V rail. The power supply architecture, decoupling network, and possibly configuration circuitry differ. Timing must also be re-validated due to the different speed grades (7 vs. 6).
What configuration options are available for these MAX 10 devices?
Both devices support internal configuration via on-chip flash memory, making them instant-on, non-volatile FPGAs. They also support external configuration through JTAG and passive serial modes. The 10M25DAF256I7G and 10M25DCF256I6G both include dual configuration images and analog-to-digital converter (ADC) blocks, but the dual-supply variant may offer additional I/O standards flexibility due to its separate I/O supply rails.
Which device is better for low-power or space-constrained applications?
The 10M25DCF256I6G (single-supply) is generally preferred for low-power and space-constrained designs because it eliminates the need for a separate 1.2 V core regulator and reduces external component count. The 10M25DAF256I7G (dual-supply) offers higher performance (speed grade 7) and more flexible I/O voltage options, making it suitable for designs requiring faster timing or multiple I/O standards.
What are the typical applications for these MAX 10 FPGAs?
Both devices are used in applications such as industrial control, motor control, sensor fusion, communication bridges, and system management. The 10M25DAF256I7G is often chosen for higher-performance tasks requiring faster processing or multiple voltage domains, while the 10M25DCF256I6G is used in cost-sensitive, low-power designs where a single 3.3 V supply simplifies the power tree.