Part A
10M25DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4600 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M25DAF256I7G and 10M25DCF256C8G are both Intel MAX 10 FPGA devices sharing the same 25,000 logic element density and 256-ball FineLine BGA package, making them functionally interchangeable at the board level. However, they differ in speed grade and operating temperature range, so the 10M25DCF256C8G can serve as a functional replacement for the 10M25DAF256I7G only when the target application tolerates the faster speed grade and the narrower commercial temperature window. Designers should validate timing closure and thermal margins before committing to this substitution.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M25DCF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4859 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF256I7G | 10M25DCF256C8G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 25,000 | 25,000 | Identical logic density ensures the same amount of user logic can be implemented in either device. |
| Package | 256-pin FBGA | 256-pin FBGA | Matching package and pin count allows the same PCB footprint and assembly process to be reused. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Commercial (0°C to +85°C junction) | The industrial-grade device supports harsher environments, while the commercial-grade part is limited to benign conditions, affecting deployment suitability. |
| Speed Grade | 7 (faster) | 8 (slower) | A faster speed grade allows higher clock frequencies and tighter timing closure, which may be required for certain designs. |
| Configuration Method | Dual Configuration (dual-boot) | Compact Configuration (single-boot) | Dual-configuration supports fail-safe updates and two images, while compact configuration only supports a single image, affecting system reliability and update strategy. |
| On-Chip Flash (User Flash Memory) | Yes (dual configuration flash) | Yes (compact configuration flash) | Both integrate configuration flash, but the amount and organization differ, influencing available user flash memory and configuration flexibility. |
| Analog-to-Digital Converter (ADC) | Yes | Yes | Both include an on-chip ADC, enabling analog monitoring without external components. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage means the same power supply design can be used for both devices. |
| RoHS Compliance | RoHS compliant | RoHS compliant | Both meet RoHS requirements, ensuring environmental regulatory compliance for the end product. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF256I7G | 10M25DCF256C8G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 10M25DAF256I7G and 10M25DCF256C8G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 256-pin FineLine Ball-Grid Array (FBGA) package. The 10M25DAF256I7G is a dual-supply, instant-on, non-volatile FPGA with 25,000 logic elements (LEs), while the 10M25DCF256C8G is a single-supply variant of the same MAX 10 25K LE family. The suffix codes indicate speed grade, temperature grade, and package options.
What is the difference between the "DA" and "DC" prefixes in these part numbers?
The "DA" in 10M25DAF256I7G denotes a dual-supply MAX 10 device, which requires both 1.2 V core (VCC) and 2.5 V or 3.3 V I/O (VCCIO) supplies. The "DC" in 10M25DCF256C8G denotes a single-supply MAX 10 device, which operates from a single 3.3 V supply for both core and I/O. This supply architecture difference affects power design, board layout, and external component count.
What do the speed grade and temperature grade suffixes indicate?
In 10M25DAF256I7G, the "I7" indicates an industrial temperature grade (-40°C to +100°C junction) and speed grade 7. In 10M25DCF256C8G, the "C8" indicates a commercial temperature grade (0°C to +85°C junction) and speed grade 8. Speed grade 7 is faster than speed grade 8, meaning the 10M25DAF256I7G can achieve higher maximum operating frequencies for the same logic design.
Are the 10M25DAF256I7G and 10M25DCF256C8G pin-compatible?
Both devices use the same 256-pin FBGA package (256-ball FineLine BGA, 17 mm x 17 mm). However, pin compatibility depends on the supply architecture: the dual-supply 10M25DAF256I7G uses dedicated VCC and VCCIO pins, while the single-supply 10M25DCF256C8G uses a different power pin arrangement. A direct drop-in replacement is not possible without verifying the power pin assignments and decoupling requirements in the respective datasheets.
Can the 10M25DCF256C8G be used as a substitute for the 10M25DAF256I7G in an existing design?
Not directly. The 10M25DCF256C8G has a lower speed grade (8 vs. 7) and a commercial temperature range (0°C to +85°C) versus the industrial range (-40°C to +100°C) of the 10M25DAF256I7G. Additionally, the single-supply architecture requires different power rail design. Substitution requires re-validating timing closure, thermal margins, and power delivery against the target design requirements.
What are the typical applications for these MAX 10 25K LE devices?
Both devices are used in applications requiring instant-on configuration, non-volatile operation, and moderate logic density. Typical uses include industrial control systems, motor control, human-machine interfaces (HMIs), communication bridges, and system management controllers. The 10M25DAF256I7G is suited for industrial environments with wider temperature swings, while the 10M25DCF256C8G is suited for commercial-grade, cost-sensitive designs with simpler power supplies.
Do both devices support the same configuration and memory features?
Yes. Both are MAX 10 FPGAs with 25,000 LEs, integrated flash configuration memory, and support for instant-on operation. They include embedded memory blocks (M9K), digital signal processing (DSP) blocks, and phase-locked loops (PLLs) as per the MAX 10 device family specifications. The primary differences remain the supply architecture, speed grade, and temperature grade.
What power supply voltages are required for each device?
The 10M25DAF256I7G (dual-supply) requires a 1.2 V core supply (VCC) and 2.5 V or 3.3 V I/O supply (VCCIO), plus auxiliary supplies as specified in the Intel MAX 10 datasheet. The 10M25DCF256C8G (single-supply) operates from a single 3.3 V supply for both core and I/O, with internal regulation generating the required lower core voltage. Designers must follow the respective power-up sequencing and decoupling guidelines in the Intel MAX 10 device documentation.