Part A
5CEFA7F23I7N
Intel
- Lifecycle
- Active
- Stock
- 7313 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA9F23I7N and 5CEFA7F23I7N are both Intel Cyclone V F-series FPGAs in the same 484-pin FBGA package with identical I/O count, supply voltage, and industrial temperature range, making them strong functional replacement candidates. The primary distinction is logic density, where the 5CEFA9F23I7N offers substantially more ALMs, registers, and embedded memory than the 5CEFA7F23I7N. Designers must confirm that the target design fits within the smaller device's logic and memory resources before substituting the 5CEFA7F23I7N for the 5CEFA9F23I7N.
Package Type
High match
I/O Count
High match
Supply Voltage
High match
Logic Density
Validation required
Parts at a glance
Part B
5CEFA9F23I7N
Intel
- Lifecycle
- Active
- Stock
- 4366 Stückzahl
- Package
- BGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA7F23I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 149500 | Logic element count determines the amount of programmable logic available for implementing user designs; a higher count allows more complex functionality. |
| Total RAM Bits | 14251008 | 7880704 | Embedded memory capacity affects how much data can be buffered or stored on-chip, impacting applications requiring large memory footprints. |
| Number of DSP Blocks | 684 | 312 | DSP blocks are dedicated hardware multipliers/accumulators; more blocks enable higher digital signal processing throughput. |
| Number of I/O Pins | 480 | 480 | I/O pin count determines how many external signals the device can interface with; identical counts mean the same external connectivity is possible. |
| Number of LABs/CLBs | 113560 | 56480 | Logic array blocks are the fundamental building blocks of the FPGA fabric; more LABs provide greater logic density. |
| Package / Case | FBGA-484 | FBGA-484 | Package type and pin count must match for physical board compatibility; identical packages allow drop-in replacement. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Temperature range determines the environments in which the device can reliably operate; identical ranges ensure the same thermal suitability. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board's power delivery design; identical voltages simplify power supply compatibility. |
| Speed Grade | 7 (Slowest) | 7 (Slowest) | Speed grade indicates maximum operating frequency and timing performance; identical grades ensure the same timing closure characteristics. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA9F23I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 113560 |
| Number of Logic Elements/Cells | 149500 | 301000 |
| Total RAM Bits | 7880704 | 14251008 |
| Number of I/O | 240 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the 5CEFA9F23I7N and 5CEFA7F23I7N devices?
Both are Intel (formerly Altera) Cyclone V F-series field-programmable gate arrays (FPGAs) in the 23 mm x 23 mm FBGA package with 484 balls, specified for industrial temperature grade (I7) and lead-free/RoHS-compliant construction. The 5CEFA9F23I7N is the larger logic-density member of the pair, while the 5CEFA7F23I7N is the smaller logic-density member of the same Cyclone V F-series family.
What is the primary difference between the 5CEFA9F23I7N and 5CEFA7F23I7N?
The primary difference is FPGA logic capacity. The 5CEFA9F23I7N offers a higher number of logic elements (LEs), adaptive logic modules (ALMs), and embedded memory than the 5CEFA7F23I7N. Both share the same package, temperature grade, and Cyclone V F-series architecture, so the difference is density rather than package or family.
Are the 5CEFA9F23I7N and 5CEFA7F23I7N pin-compatible?
Yes. Both devices are offered in the same 484-ball FBGA package (F23) with the same ball map for the Cyclone V F-series. Because the package and pinout are identical, a board designed for one density can generally accommodate the other, provided power, configuration, and I/O requirements are revalidated.
Can the 5CEFA7F23I7N be used as a drop-in replacement for the 5CEFA9F23I7N?
Not as a direct drop-in replacement in all cases. Although the package and pinout match, the 5CEFA7F23I7N has fewer logic elements, ALMs, and embedded memory blocks. A design that fully utilizes the 5CEFA9F23I7N resources may not fit in the 5CEFA7F23I7N, so resource utilization, timing closure, and configuration bitstream must be recompiled and verified before substitution.
Do the 5CEFA9F23I7N and 5CEFA7F23I7N use the same configuration methods?
Yes. Both devices belong to the Cyclone V F-series and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration voltage and MSEL pin settings follow the same Cyclone V device family guidelines for both densities.
Are the 5CEFA9F23I7N and 5CEFA7F23I7N rated for the same operating temperature range?
Yes. Both carry the I7 suffix, which denotes the industrial temperature grade for Cyclone V devices. They are specified for operation over the industrial temperature range defined in the Intel Cyclone V device datasheet, making them suitable for the same industrial application environments.
Do both devices support the same transceiver and I/O standards?
Both are Cyclone V F-series FPGAs in the same package and therefore support the same general-purpose I/O standards and transceiver capabilities defined for that family and package combination. However, the number of available I/O pins and transceiver channels actually bonded out may differ between the two densities, so the specific device pin-out file and datasheet should be consulted for exact counts.
Which device should be selected for a new design, 5CEFA9F23I7N or 5CEFA7F23I7N?
Selection depends on logic, memory, and DSP resource requirements. Choose the 5CEFA9F23I7N when higher logic element count, more embedded memory, or more multiplier resources are needed. Choose the 5CEFA7F23I7N when the design fits within its smaller resource budget and lower cost or power is preferred. Both share the same package and family, so migration between them is straightforward if resource headroom is maintained.