MT41K512M16HA-125:A

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MT41K512M16HA-125:A

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IC DRAM 8GBIT PARALLEL 96FBGA

  • HerstellerMicron Technology Inc.

  • Herstellerteil #MT41K512M16HA-125:A

  • Auf Lager7379

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Spezifikationen

Attribut Wert
Part Status Obsolete
Base Product Number MT41K512M16
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 8Gbit
Memory Organization 512M x 16
Memory Interface Parallel
Clock Frequency 800 MHz
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 96-TFBGA
Supplier Device Package 96-FBGA (9x14)
Packaging Tray
Access Time 13.5 ns

Übersicht

Description

The MT41K512M16HA-125:A is a type of DRAM (Dynamic Random Access Memory) chip, specifically a DDR3 SDRAM model manufactured by Micron Technology. It is a high-speed memory component used in various electronic devices to improve their performance by providing fast data access and storage. The "512M16" in its designation refers to the memory configuration: it has 512 megabits organized in a 16-bit wide configuration. This chip operates at a clock speed of 800 MHz, which is effectively doubled to 1600 MT/s due to the DDR (Double Data Rate) technology, allowing for efficient data processing.
The "-125:A" part of the name typically refers to specific characteristics like the CAS latency and voltage requirements, which in this case, generally indicates a CAS latency of 11 cycles and operating voltage of 1.5V. This chip is commonly used in computers, servers, and other applications where high-performance memory is crucial. It supports features like burst reads and writes, auto precharge options, and a low-power mode, making it suitable for both consumer and industrial implementations.

Equivalent

The MT41K512M16HA-125:A is a DDR3L SDRAM chip. Equivalent products include:
1. Hynix H5TC4G63AFR - A similar DDR3L SDRAM with comparable specifications.
2. Samsung K4B4G1646E - Another DDR3L SDRAM option with similar performance.
3. Kingston D2516EC4BXGGB - Offers similar functionalities in the DDR3L range.
4. Nanya NT5CB256M16BP-DI - Competes within the same category of DDR3L SDRAMs.
These alternatives provide similar memory capacity and speed, suitable for similar applications.

Features

The MT41K512M16HA-125:A is a DRAM chip from Micron Technology, part of their DDR3 SDRAM lineup. Key features include:
1. Density: 8 Gb (gigabits).
2. Organization: 512 Meg x 16 bits.
3. Speed Grade: Can operate at up to 1600 MT/s (Megatransfers per second).
4. Voltage: Standard operating voltage of 1.5V with a reduced voltage option of 1.35V for DDR3L.
5. Package: Available in a FBGA (Fine Ball Grid Array) package, which is compact and suitable for high-density applications.
6. Data Rate: Supports DDR3 data rates of 800, 1066, 1333, and 1600 MT/s.
7. Interface: Uses a 64-bit data bus interface.
8. Temperature Range: Designed for standard commercial and industrial operating temperatures.
9. Applications: Suitable for a variety of computing and consumer electronics applications, such as PCs, laptops, and servers.
These features make it a versatile choice for memory solutions requiring high performance and efficiency.

Manufacturer

The MT41K512M16HA-125:A is a DRAM chip manufactured by Micron Technology, Inc. Micron is a leading American company in the semiconductor industry, specializing in memory and storage solutions. Their product portfolio includes dynamic random-access memory (DRAM), NAND flash memory, and other semiconductor devices used in various computing, networking, and mobile applications. Micron is known for its significant contributions to the development and innovation of memory technologies, serving a wide range of markets including consumer electronics, enterprise storage, data centers, and automotive industries. The company is headquartered in Boise, Idaho, and operates globally with manufacturing sites, sales offices, and research and development centers around the world. Micron is recognized as one of the largest memory manufacturers internationally, alongside competitors like Samsung and SK Hynix.

Application

The MT41K512M16HA-125:A is a DDR3L DRAM memory chip often used in applications requiring reliable, high-speed data processing and storage. It is commonly found in personal computers, laptops, and servers, providing efficient memory solutions for these devices. Additionally, it is used in embedded systems, networking devices, and consumer electronics such as gaming consoles and smart TVs, where it supports improved performance and multitasking capabilities. Its low-voltage operation makes it suitable for mobile devices and other power-sensitive applications, ensuring energy efficiency while maintaining high performance.

Package

The MT41K512M16HA-125:A is a DRAM chip packaged in a 96-ball FBGA (Fine Ball Grid Array) format. This package type is designed for efficient heat dissipation and compact board space usage, making it suitable for high-performance applications in computing and telecommunications.

Frequently Asked Questions


Q: Is this DDR3L memory compatible with 1.5V standard DDR3?
A: Yes, it supports both 1.35V (DDR3L) and 1.5V (DDR3) operation, ensuring backward compatibility with standard DDR3 designs.


Q: What is the maximum operating temperature for this DRAM?
A: The specified operating temperature range is 0°C to 95°C (TC), suitable for commercial and industrial environments with high thermal loads.


Q: Can this component handle 800 MHz clock frequency?
A: Yes, it operates at a clock frequency of 800 MHz, providing a data rate of 1600 MT/s for high-speed memory applications.


Q: What is the memory density and organization?
A: It has 8 Gbit density organized as 512M x 16 bits, ideal for applications requiring large memory bandwidth in a parallel interface.


Q: Is this part suitable for new designs?
A: No, this part is marked as Obsolete. It is best for legacy system repairs or maintenance, not recommended for new designs.


Q: What is the access time for this memory?
A: The access time is 13.5 ns, indicating the latency for read operations from the memory array.


Q: What package type is used and what is its size?
A: It comes in a 96-TFBGA package with a 9x14 mm FBGA footprint, suitable for surface mount assembly in compact layouts.


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