MT47H64M16NF-25E IT:M TR

The MT47H64M16NF-25E IT:M TR is a DRAM (Dynamic Random-Access Memory) component, specifically a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic RAM) from Micron Technology. It is designed to provide high-speed data access and is typically used in computing and electronic devices for efficient data handling and processing. The designation "64M16" indicates the memory configuration, which means it has a storage capacity of 64M words (mega-words) with each word being 16 bits wide.
The "25E" in the part number refers to its speed grade, with the "-25E" indicating a specific data transfer rate and operating speed that aligns with industry standards for DDR2 modules. The "IT" denotes the industrial temperature range, meaning the chip can operate in more extreme conditions compared to standard memory components, making it suitable for industrial applications. The "M TR" suffix typically refers to the packaging and shipping method, with "TR" often signifying that the chips are provided in tape and reel packaging for automated manufacturing processes.

The MT47H64M16NF-25E IT:M TR is a DDR2 SDRAM chip. Equivalent products include:
1. Hynix HY5PS1G1631C: Similar DDR2 SDRAM with comparable speed and capacity.
2. Samsung K4T1G164QF: Offers similar specifications in DDR2 technology.
3. Nanya NT5TU32M16DG: Another DDR2 SDRAM with equivalent performance.
4. Micron MT47H64M16HR-25E: A direct equivalent from the same manufacturer.
These alternatives match in terms of technology, capacity, and speed. Always verify the specific needs and compatibility with your system.

The MT47H64M16NF-25E IT:M TR is a DRAM module manufactured by Micron Technology. Key features include:
1. Density and Configuration: This module has a density of 1 Gb and is organized as 64 Meg x 16 bits.
2. Technology: It is based on DDR2 SDRAM technology, which offers improved performance over DDR.
3. Speed: The module supports a maximum data rate of 800 MT/s, with a clock speed of 400 MHz.
4. Latency: Typical CAS latency settings for this module include CL=5.
5. Operating Voltage: It operates at a voltage of 1.8V, which helps reduce power consumption compared to older DRAM technologies.
6. Temperature Range: The "IT" designation indicates it is suitable for industrial temperature ranges, typically from -40°C to +85°C.
7. Packaging: The module comes in a 60-ball FBGA package, known for its compact size and efficient heat dissipation.
8. Applications: It is commonly used in applications requiring reliable performance in challenging environments, such as industrial systems.
Overall, the MT47H64M16NF-25E IT:M TR is a versatile and efficient DRAM module ideal for various industrial applications.

The MT47H64M16NF-25E IT:M TR is manufactured by Micron Technology, Inc. Micron is a global corporation that specializes in the production of semiconductor devices, primarily focusing on memory and storage solutions. Their product lineup includes dynamic random-access memory (DRAM), flash memory, and solid-state drives (SSDs). Micron is known for its role in advancing memory technology and providing high-performance, reliable solutions for a wide range of applications including consumer electronics, mobile devices, data centers, and automotive systems. The company is recognized for its innovation in semiconductor memory and is one of the leading memory manufacturers worldwide.

The MT47H64M16NF-25E IT:M TR is a DDR2 SDRAM memory chip commonly used in various electronic applications. Its primary application areas include consumer electronics, computers, and networking devices. It is often utilized in desktop and laptop computers, gaming consoles, and set-top boxes to improve data processing speed and efficiency. Additionally, the chip can be found in communication equipment like routers and switches, where it helps manage data flow. Its robust performance and reliability make it suitable for industrial applications that require stable memory solutions under different environmental conditions.

The MT47H64M16NF-25E IT:M TR is a DRAM memory chip package known as a Fine-Pitch Ball Grid Array (FBGA). This packaging is compact and used to accommodate high-density memory chips with efficient thermal and electrical performance. The "TR" typically denotes that the product is supplied in tape and reel format for automated manufacturing processes.