XC7Z020-1CLG484C

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XC7Z020-1CLG484C

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IC SOC CORTEX-A9 667MHZ 484BGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7Z020-1CLG484C

  • Paket CSBGA-484

  • Auf Lager6449

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Attribut Wert
Package / Case Tray
Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)

Übersicht

Description

The XC7Z020-1CLG484C is a part of the Xilinx Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. This SoC (System on Chip) is designed to offer high performance and flexibility for embedded systems. It features 85K logic cells, 220 DSP slices, and 560 KB of block RAM, making it suitable for a wide range of applications requiring intensive computational tasks and real-time processing. The chip operates at a maximum clock frequency of 667 MHz for the processor and has a wide array of connectivity options, including USB, Ethernet, and various serial interfaces.
The package type is CLG484, which refers to a 484-ball grid array (BGA) configuration, optimizing the balance between size and pin count. The device is suitable for applications in areas such as automotive, industrial automation, and communications. With its combination of processing power and programmable logic, the XC7Z020-1CLG484C offers a versatile platform for developers looking to implement complex algorithms or custom hardware accelerators.

Equivalent

The XC7Z020-1CLG484C is part of the Xilinx Zynq-7000 SoC series. Equivalent products could include:
1. Intel Cyclone V series (e.g., 5CSXFC6D6F31C8) - offers similar ARM processor integration.
2. Microsemi SmartFusion2 (e.g., M2S050TS-FG484) - integrates ARM Cortex-M3 with FPGA.
3. Lattice Semiconductor's ECP5 series - provides comparable logic density and performance.
Ensure that the specific requirements (e.g., I/O count, performance) are met when choosing an equivalent.

Features

The XC7Z020-1CLG484C is a part of Xilinx's Zynq-7000 series of all programmable system-on-chips (SoCs). It integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7 series FPGA fabric. Key features include:
1. Processor System: Dual-core ARM Cortex-A9 MPCore processors, with NEON and FPU support, operating up to 866 MHz.
2. FPGA Fabric: Offers 85,000 logic cells, 220 DSP slices, and 560 KB of block RAM.
3. High Bandwidth: Features a high-bandwidth AMBA AXI interconnect between the processor system and the programmable logic.
4. I/O Interfaces: Includes multiple I/O options such as USB, Gigabit Ethernet, SDIO, and CAN.
5. Memory: Supports DDR3, DDR3L, DDR2, and LPDDR2 memory types.
6. Package: Comes in a CLG484 package with 484 pins.
7. Applications: Ideal for applications requiring extensive processing power and flexibility, such as automotive, industrial, and communications.
This combination of processor and FPGA capabilities allows for highly customizable solutions, making it suitable for a wide range of embedded applications.

Pinout

The XC7Z020-1CLG484C is a part of the Xilinx Zynq-7000 family of SoCs (System on Chips). It features a dual-core ARM Cortex-A9 processor integrated with 7-series FPGA logic. The device comes in a CLG484 package, which denotes a 484-ball BGA (Ball Grid Array) package.
The pin count for the XC7Z020-1CLG484C is 484. The functions of these pins include:
1. Power and Ground Pins: Supply power and ground to the system.
2. I/O Pins: General-purpose input/output pins for interfacing with peripheral devices.
3. Dedicated Pins: Include JTAG for programming and configuration, clock inputs for driving system clocks, and reset pins.
4. Peripheral Interface Pins: Support interfaces such as UART, SPI, I2C, CAN, and others.
5. Memory Interface Pins: Connect to external memory devices like DDR3/DDR3L.
6. Analog Pins: For analog interfaces like ADCs.
These pins enable the integration and connectivity of the device with various external components, making it suitable for diverse applications ranging from embedded systems to complex processing tasks.

Manufacturer

The XC7Z020-1CLG484C is manufactured by Xilinx, Inc. Xilinx is a semiconductor company known for its development of highly flexible and adaptive processing platforms. It specializes in designing and producing complex programmable logic devices (CPLDs) and field-programmable gate arrays (FPGAs). These products are widely used in various applications, including telecommunications, automotive, industrial, and consumer electronics, due to their ability to be programmed and reconfigured after manufacturing to meet specific application requirements. Xilinx is recognized for its innovation in creating processing solutions that provide a high degree of customization and performance, which makes them a leader in the FPGA market. As of 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a significant player in the semiconductor industry, expanding its reach in adaptive computing and bringing together complementary technologies.

Application

The XC7Z020-1CLG484C is a Zynq-7000 series System on Chip (SoC) from Xilinx that combines a dual-core ARM Cortex-A9 processor with FPGA capabilities. Its application areas include:
1. Embedded Systems: Used in industrial automation, automotive systems, and robotics for real-time processing and control.
2. Digital Signal Processing (DSP): Suitable for high-performance audio, video, and image processing tasks.
3. Communications: Employed in networking and telecommunications for protocol processing and data handling.
4. Consumer Electronics: Utilized in devices requiring low power and high performance, such as cameras and set-top boxes.
5. IoT and Smart Devices: Facilitates edge computing and sensor data processing.
This chip's versatility makes it ideal for applications requiring a combination of processing power and reconfigurable logic.

Package

The XC7Z020-1CLG484C is a Xilinx Zynq-7000 SoC with a CLG484 package type, which indicates a fine-pitch ball grid array (BGA) with 484 balls. This type of package is used for integrating programmable logic with a dual-core ARM Cortex-A9 processor, offering high performance and flexibility for embedded systems.

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