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XCZU11EG-2FFVC1156E
+StücklisteIC SOC CORTEX-A53 1156FCBGA
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HerstellerAMD
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Herstellerteil #XCZU11EG-2FFVC1156E
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Spezifikationen
| Attribut | Wert |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Base Product Number | XCZU11 |
Übersicht
Description
Designed for applications requiring high performance and flexibility, it is suited for areas like artificial intelligence, image processing, and communications. The device supports advanced features including dynamic power management, secure processing, and various connectivity protocols, making it ideal for industrial, automotive, and telecommunications applications.
With a 2.5D packaging technology, it enables high bandwidth and low latency interactions between the processors and the FPGA, providing a versatile platform for developers looking to implement complex algorithms and designs efficiently. The XCZU11EG is particularly valued for its scalability and robust ecosystem encompassing development tools and support.
Equivalent
Features
1. Processing Power: Quad-core ARM Cortex-A53 (up to 1.5 GHz) and dual-core Cortex-R5 for real-time applications.
2. FPGA Fabric: 1156 logic cells with extensive FPGA resources for custom hardware acceleration.
3. Memory Support: Supports DDR4 and LPDDR4 memory interfaces.
4. High-Speed Interfaces: Includes PCIe, USB 3.0, and Ethernet connectivity.
5. Digital Signal Processing: Integrated DSP slices for efficient signal processing tasks.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Security Features: Built-in security capabilities for secure boot and data protection.
8. Development Ecosystem: Supported by Vivado Design Suite and Vitis Unified Software Platform for easy development.
This versatile SoC is suitable for applications in telecommunications, automotive, industrial, and IoT.
Pinout
The pin functions are categorized into multiple types, including power, ground, configuration, and I/O pins. The I/O pins support a range of standards such as LVDS, LVCMOS, and more, facilitating connectivity for various peripherals and external devices. The device also includes dedicated pins for JTAG, clock input, and other control functions.
Overall, the XCZU11EG-2FFVC1156E is designed for high-performance applications requiring extensive processing capabilities and flexibility in hardware configuration.
Manufacturer
Founded in 1984, Xilinx was a pioneer in the FPGA market and has established itself as a leader in the semiconductor industry. The company focuses on innovation and versatility, allowing customers to leverage its products for rapidly evolving technological needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and expanding its reach in the market. Xilinx's products, including the XCZU11EG-2FFVC1156E, are widely used in numerous applications due to their flexibility, performance, and ability to be reprogrammed to meet specific requirements.
Application
1. Embedded Systems: For real-time processing and control.
2. Telecommunications: Used in base stations and network infrastructure.
3. Industrial Automation: Applications in robotics and control systems.
4. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
5. Machine Learning: Accelerating AI inference and data processing.
6. Video and Image Processing: High-performance processing for cameras and displays.
Its high performance, integration, and flexibility make it ideal for complex, data-intensive applications.