XCZU11EG-2FFVC1156E

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XCZU11EG-2FFVC1156E

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IC SOC CORTEX-A53 1156FCBGA

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  • Herstellerteil #XCZU11EG-2FFVC1156E

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Spezifikationen

Attribut Wert
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Base Product Number XCZU11

Übersicht

Description

The XCZU11EG-2FFVC1156E is a member of Xilinx's Zynq UltraScale+ MPSoC family, integrating a powerful ARM Cortex-A53 quad-core processor with a dual-core ARM Cortex-R5 real-time processor alongside programmable logic (FPGA). It features 11,880 logic cells, 1,800 DSP slices, and significant onboard resources such as high-speed transceivers, memory controllers, and various I/O options.
Designed for applications requiring high performance and flexibility, it is suited for areas like artificial intelligence, image processing, and communications. The device supports advanced features including dynamic power management, secure processing, and various connectivity protocols, making it ideal for industrial, automotive, and telecommunications applications.
With a 2.5D packaging technology, it enables high bandwidth and low latency interactions between the processors and the FPGA, providing a versatile platform for developers looking to implement complex algorithms and designs efficiently. The XCZU11EG is particularly valued for its scalability and robust ecosystem encompassing development tools and support.

Equivalent

The XCZU11EG-2FFVC1156E is a part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU5EG, XCZU7EG, and XCZU9EG, which offer varying resources, processing capabilities, and I/O options. For similar applications, consider alternatives from other manufacturers, such as Intel's Stratix 10 or Lattice's ECP5, depending on specific requirements like performance, power, and budget. Always confirm compatibility for your specific project needs.

Features

The XCZU11EG-2FFVC1156E is a part of Xilinx's Zynq UltraScale+ MPSoC family, combining a powerful ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor, alongside programmable logic. Key features include:
1. Processing Power: Quad-core ARM Cortex-A53 (up to 1.5 GHz) and dual-core Cortex-R5 for real-time applications.
2. FPGA Fabric: 1156 logic cells with extensive FPGA resources for custom hardware acceleration.
3. Memory Support: Supports DDR4 and LPDDR4 memory interfaces.
4. High-Speed Interfaces: Includes PCIe, USB 3.0, and Ethernet connectivity.
5. Digital Signal Processing: Integrated DSP slices for efficient signal processing tasks.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Security Features: Built-in security capabilities for secure boot and data protection.
8. Development Ecosystem: Supported by Vivado Design Suite and Vitis Unified Software Platform for easy development.
This versatile SoC is suitable for applications in telecommunications, automotive, industrial, and IoT.

Pinout

The XCZU11EG-2FFVC1156E is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a total of 1,156 pins. This device combines a processing system (PS) with programmable logic (PL) in a single chip, providing both ARM Cortex-A53 and Cortex-R5 cores, along with various I/O interfaces.
The pin functions are categorized into multiple types, including power, ground, configuration, and I/O pins. The I/O pins support a range of standards such as LVDS, LVCMOS, and more, facilitating connectivity for various peripherals and external devices. The device also includes dedicated pins for JTAG, clock input, and other control functions.
Overall, the XCZU11EG-2FFVC1156E is designed for high-performance applications requiring extensive processing capabilities and flexibility in hardware configuration.

Manufacturer

The XCZU11EG-2FFVC1156E is manufactured by Xilinx, a company known for its advanced programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms. Xilinx specializes in providing solutions for various applications such as telecommunications, automotive, aerospace, and data centers, enabling engineers to create highly customizable and efficient hardware designs.
Founded in 1984, Xilinx was a pioneer in the FPGA market and has established itself as a leader in the semiconductor industry. The company focuses on innovation and versatility, allowing customers to leverage its products for rapidly evolving technological needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and expanding its reach in the market. Xilinx's products, including the XCZU11EG-2FFVC1156E, are widely used in numerous applications due to their flexibility, performance, and ability to be reprogrammed to meet specific requirements.

Application

The XCZU11EG-2FFVC1156E is a versatile FPGA from Xilinx's Zynq UltraScale+ family, suitable for various applications. Key areas include:
1. Embedded Systems: For real-time processing and control.
2. Telecommunications: Used in base stations and network infrastructure.
3. Industrial Automation: Applications in robotics and control systems.
4. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
5. Machine Learning: Accelerating AI inference and data processing.
6. Video and Image Processing: High-performance processing for cameras and displays.
Its high performance, integration, and flexibility make it ideal for complex, data-intensive applications.

Package

The XCZU11EG-2FFVC1156E is packaged in a FFG (Flip-Chip Ball Grid Array) package, specifically designed for high-performance applications. It features a 1156-ball configuration, allowing for increased connectivity and efficient thermal management.

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