XCZU2CG-1SBVA484E

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XCZU2CG-1SBVA484E

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IC SOC CORTEX-A53 484FCBGA

  • HerstellerAMD

  • Herstellerteil #XCZU2CG-1SBVA484E

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Spezifikationen

Attribut Wert
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Base Product Number XCZU2

Übersicht

Description

The XCZU2CG-1SBVA484E is a member of the Zynq UltraScale+ MPSoC family by Xilinx, designed to provide a versatile processing platform that combines powerful processing capabilities with programmable logic. This device integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and a Mali-400MP2 graphics processing unit. It also includes a range of peripherals and interfaces, making it suitable for a variety of applications, including embedded systems, automotive, and industrial automation.
The "1" in the part number indicates the speed grade, while "SBVA484" refers to the package type and pin count. The device is built on a 16nm FinFET process technology, offering improved performance and power efficiency.
The XCZU2CG-1SBVA484E is part of the cost-optimized ZU2CG variant, which provides a balance of performance and cost, targeting applications that require moderate logic density and processing power. It is equipped with programmable logic cells, DSP slices, and memory resources, providing flexibility for customized implementations.

Equivalent

The XCZU2CG-1SBVA484E is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products would be other models within the Zynq UltraScale+ MPSoC range with similar resources and configurations, or comparable SoCs from other vendors like the Intel (formerly Altera) Cyclone V SoC series or Microchip’s PolarFire SoC. Each of these platforms offers integrated processing systems with programmable logic, though exact equivalency would depend on specific application requirements such as processing power, logic cells, and I/O options.

Features

The XCZU2CG-1SBVA484E is a part of Xilinx's Zynq UltraScale+ series, which integrates a processing system with programmable logic. Key features include:
1. Processing System: It combines a dual-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 graphics processor.
2. Programmable Logic: The device features approximately 103K system logic cells, offering flexibility for custom hardware designs.
3. I/O and Communication: Supports high-speed connectivity with interfaces like PCIe, Gigabit Ethernet, USB, and more.
4. Memory Interface: Includes support for DDR4/3 memory, providing high-speed memory access.
5. Integrated Peripherals: Features on-chip ADCs for mixed-signal designs and DSP slices for digital signal processing.
6. Security: Offers secure boot and encryption features to protect designs and data.
7. Package: Comes in a BGA package with 484 pins, suitable for compact designs.
This combination of features makes the XCZU2CG-1SBVA484E ideal for applications requiring high performance, flexibility, and secure processing, such as automotive, industrial, and communication systems.

Pinout

The XCZU2CG-1SBVA484E is a model from the Xilinx Zynq UltraScale+ MPSoC family. It features a package with 484 pins, specifically in a Ball Grid Array (BGA) format. This device integrates a high-performance processing system (PS) and programmable logic (PL) within the same chip, providing a versatile platform for various applications.
Key functions of the XCZU2CG include:
1. Processing System (PS): Comprising of a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 graphics processing unit (GPU).
2. Programmable Logic (PL): Offers flexibility for custom hardware acceleration and design, suitable for applications demanding parallel processing capabilities.
3. I/O and Connectivity: Supports multiple high-speed interfaces, including PCIe, USB, Gigabit Ethernet, and more.
4. Memory Interfaces: Compatible with DDR4, LPDDR4, DDR3, and DDR3L memory types, facilitating high-speed data operations.
Overall, the XCZU2CG-1SBVA484E is designed for applications requiring a combination of processing power, flexibility, and high-speed connectivity, such as embedded systems, automotive, and communications.

Manufacturer

The XCZU2CG-1SBVA484E is manufactured by Xilinx, Inc., which is now a part of Advanced Micro Devices, Inc. (AMD) following its acquisition in 2022. Xilinx was renowned for being a leading provider of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and related technologies. These devices are widely used in various applications, such as telecommunications, automotive, industrial, and data centers, due to their flexibility and ability to be reprogrammed for different tasks post-manufacturing. As part of AMD, Xilinx's technologies complement AMD’s portfolio, enhancing capabilities in adaptive computing.

Application

The XCZU2CG-1SBVA484E is a Zynq UltraScale+ MPSoC, which combines programmable logic with a processing system. Its application areas include embedded systems, industrial automation, automotive systems, telecommunications, and medical devices. It is ideal for applications requiring real-time data processing, high-speed interfacing, and system integration. The device is used in advanced driver-assistance systems (ADAS), IoT edge devices, machine vision, and robotics. Its ability to integrate diverse functions onto a single chip makes it suitable for applications requiring both hardware flexibility and robust processing power.

Package

The XCZU2CG-1SBVA484E is a System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ family. It features a BGA (Ball Grid Array) package type with 484 pins. This package is designed to provide a compact, high-density interconnect solution suitable for complex, high-performance applications.

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