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XCZU2CG-1SFVC784E
+StücklisteIC SOC CORTEX-A53 784FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCZU2CG-1SFVC784E
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Paket FCBGA-784
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Auf Lager5602
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Übersicht
Description
The XCZU2CG variant is designed with a focus on cost-effectiveness while maintaining essential performance attributes. It features a robust set of peripherals and interfaces, including USB, Ethernet, and PCIe, enabling seamless connectivity and data processing capabilities. The "-1" speed grade denotes its operating speed range, and the "SFVC784E" refers to its specific packaging type and pin count, indicating a fine-pitch ball-grid array (FBGA) with 784 pins. This model is suitable for applications requiring a compact footprint with moderate processing and logic requirements, providing a flexible platform for custom hardware acceleration and system integration.
Equivalent
Features
1. Processing System (PS): Features a quad-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor, providing robust computing power and flexibility.
2. Programmable Logic (PL): Offers 81,000 system logic cells, enabling custom hardware accelerations and parallel processing.
3. Integrated Memory: Incorporates a 1MB L2 cache and on-chip memory controllers for efficient data handling.
4. Multimedia Capabilities: Supports H.264/H.265 video codec for high-definition processing.
5. High-Speed Connectivity: Includes multiple interfaces like PCIe Gen2, USB 3.0/2.0, Gigabit Ethernet, and SATA, enhancing data transfer and connectivity.
6. Security Features: Equipped with TrustZone technology, secure boot, and encryption for data protection.
7. Power Management: Advanced power management features for optimized energy consumption.
8. Package: Available in a 784-pin flip-chip package (SFVC784), suitable for various applications.
These features make it suitable for applications in automotive, industrial, and consumer electronics where high performance and flexibility are required.
Pinout
The XCZU2CG-1SFVC784E integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400MP2 GPU. Additionally, it offers programmable logic with a range of configurable I/O options, high-speed connectivity, and integrated memory interfaces.
The pin functions cover various signal categories including general-purpose I/Os, configuration pins, clock pins, power, and ground pins, as well as dedicated pins for communication interfaces like PCIe, USB, I2C, SPI, and more. The specific pin assignments and configurations can be determined using the Xilinx documentation and tools, such as the Zynq UltraScale+ MPSoC technical reference manual and the Vivado Design Suite.
Manufacturer
Application
1. Embedded Vision Systems: Used for real-time image processing and video analytics.
2. Industrial Automation: Facilitates efficient control and monitoring of industrial processes.
3. Automotive ADAS: Supports advanced driver-assistance systems by processing sensor data.
4. IoT Gateways: Acts as a central hub for IoT devices, handling data aggregation and processing.
5. Telecommunications: Used in base stations and network infrastructure for data handling and processing.
6. Aerospace and Defense: Provides secure and reliable processing for mission-critical applications.
These applications leverage the device's combination of high-performance processing and flexible logic.