XCZU9EG-1FFVB1156I

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XCZU9EG-1FFVB1156I

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IC SOC CORTEX-A53 1156FCBGA

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  • Herstellerteil #XCZU9EG-1FFVB1156I

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Spezifikationen

Attribut Wert
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Base Product Number XCZU9

Übersicht

Description

The XCZU9EG-1FFVB1156I is a high-performance System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ family. It combines a powerful ARM Cortex-A53 quad-core processor with a dual-core ARM Cortex-R5 real-time processor, along with a programmable logic fabric. This architecture enables efficient processing and control functionalities, making it ideal for applications in telecommunications, automotive, industrial, and aerospace sectors.
Key features include:
- FPGA Integration: It includes a configurable FPGA for custom hardware acceleration.
- High-Speed Interfaces: Supports various interfaces such as PCIe, Ethernet, and USB for connectivity.
- Memory Support: Compatible with DDR4 memory for high-bandwidth data processing.
- Power Efficiency: Designed for low power consumption while maintaining high performance.
The XCZU9EG is suitable for complex applications requiring both software flexibility and hardware efficiency, leveraging its heterogeneous computing capabilities. It is often employed in embedded systems, machine learning, and real-time data processing applications.

Equivalent

The XCZU9EG-1FFVB1156I is a part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include XCZU9EG-2FFVB1156I (higher speed grade) and other Zynq UltraScale+ models like XCZU7EV or XCZU11EG, depending on specific requirements like performance, I/O count, and resource availability. Always verify compatibility based on application needs and specifications.

Features

The XCZU9EG-1FFVB1156I is a member of Xilinx's Zynq UltraScale+ MPSoC family, combining a high-performance ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor and programmable FPGA logic. Key features include:
- Processing System: 4 x ARM Cortex-A53 cores, 2 x Cortex-R5 cores for real-time applications.
- FPGA Fabric: Over 1 million logic cells, supporting extensive customization and parallel processing.
- Memory Interfaces: Supports DDR4 memory with a wide data bus for high bandwidth.
- Connectivity: Multiple high-speed I/O options, including PCIe, Gigabit Ethernet, and USB.
- DSP Resources: Built-in DSP slices for efficient processing of digital signals.
- Advanced Security: Features hardware security capabilities for secure boot and data protection.
- High Performance: Designed for applications requiring high computational power, such as automotive, industrial, and communications.
This SoC is ideal for applications needing both software programmability and hardware flexibility.

Pinout

The XCZU9EG-1FFVB1156I is a device from Xilinx's Zynq UltraScale+ MPSoC family. It features a pin count of 1,156. The primary functions of this device include:
1. Processing System (PS): It integrates a dual-core ARM Cortex-A53 processor and a real-time ARM Cortex-R5 processor, along with programmable logic.
2. Programmable Logic (PL): The device contains a large array of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM.
3. High-Speed Interfaces: It supports various high-speed I/O interfaces, such as PCIe, USB, and Ethernet.
4. Flexible I/O: The device includes numerous GPIOs and can be configured for multiple standard protocols.
This combination of features makes the XCZU9EG-1FFVB1156I suitable for a wide range of applications, including communications, automotive, and industrial systems.

Manufacturer

The manufacturer of the XCZU9EG-1FFVB1156I is Xilinx, Inc., a subsidiary of Advanced Micro Devices (AMD). Xilinx is a leading company in the semiconductor industry, specializing in the design and production of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), System-on-Chip (SoC) devices, and other related technologies.
Xilinx's products are widely used in various applications such as telecommunications, automotive, aerospace, defense, industrial automation, and data centers. The XCZU9EG-1FFVB1156I specifically belongs to the Zynq UltraScale+ family, which integrates a high-performance FPGA fabric with ARM-based processing cores, allowing for versatile and efficient design solutions.
Founded in 1984, Xilinx has played a pivotal role in the evolution of programmable logic technology and continues to innovate and expand its product offerings to meet the growing demands of modern electronic systems. The company is known for its commitment to providing flexible and high-performance solutions, enabling engineers and designers to create complex systems more efficiently.

Application

The XCZU9EG-1FFVB1156I is a Zynq UltraScale+ MPSoC from Xilinx, suitable for various application areas including:
1. Telecommunications: Used in 5G infrastructure for baseband processing and radio unit control.
2. Automotive: Applications in advanced driver-assistance systems (ADAS) and autonomous driving platforms.
3. Industrial Automation: Implementation in robotics, machine vision, and factory automation systems.
4. Aerospace and Defense: Suitable for signal processing, radar systems, and secure communications.
5. Machine Learning: Deployed in edge AI applications for real-time data processing and inference.
Its versatility makes it ideal for high-performance computing tasks across multiple sectors.

Package

The XCZU9EG-1FFVB1156I is packaged in a FFG (Fine Pitch Flip Chip) BGA (Ball Grid Array) format. It features a 1156-ball configuration, allowing for high-density connections and efficient heat dissipation suitable for high-performance applications in FPGA designs.

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